Claims
- 1. A process for aligning the surface of a chosen member with a chosen fixed reference point comprising the steps of:
- (a) providing a set of alignment marks on said surface of said member and spaced at a predetermined periodicity;
- (b) providing said chosen fixed reference point;
- (c) providing a source of incoherent flood radiation for illuminating said set of alignment marks;
- (d) illuminating said set of alignment marks with said flood radiation to produce reflected radiation therefrom;
- (e) imaging said reflected radiation onto an imaging detector means comprising a charge-coupled device to generate from said set of alignment marks a detection signal comprising a serial electronic signal as a function of time and containing serial information corresponding to the position of said set of alignment marks;
- (f) electronically processing said detection signal to generate an alignment signal with a high signal-to-noise ratio;
- (g) providing a reference electrical signal comprising a periodic signal of a predetermined frequency and phase;
- (h) comparing the phase angle of said alignment signal and the phase angle of said reference signal and generating an error signal proportional to the phase difference of said alignment signal and said reference signal; and
- (i) providing lateral movement of said set of alignment marks with respect to said chosen reference point in response to said error signal until said alignment signal and said reference signal become congruent in phase, to produce accurate alignment of said surface of said chosen member with said chosen reference point.
- 2. A process for aligning the surface of a first chosen member with the surface of a second chosen member which includes the steps of:
- (a) providing a first set of alignment marks on said surface of said first member and spaced at a predetermined periodicity;
- (b) providing a chosen fixed reference point for determining the relative positions of said first and said second chosen members;
- (c) providing a source of incoherent flood radiation for illuminating said first set of alignment marks;
- (d) illuminating said first set of alignment marks with said flood radiation to produce first reflected radiation therefrom;
- (e) imaging said first reflected radiation onto an imaging detector means comprising a charge-coupled device to generate a first serial electronic signal as a function of time and containing serial information corresponding to the position of said first set of alignment marks;
- (f) electronically processing said first detection signal to generate a first alignment signal with a high signal-to-noise ratio;
- (g) providing a first reference electrical signal comprising a periodic signal of a predetermined frequency and phase;
- (h) comparing the phase angle of said first alignment signal and the phase angle of said first reference signal and generating a first error signal proportional to the phase difference of said first alignment signal and said first reference signal;
- (i) providing lateral movement of said first set of alignment marks with respect to said chosen reference point in response to said first error signal until said first alignment signal and said first reference signal become congruent in phase, to produce accurate alignment of said surface of said first chosen member with said chosen reference point;
- (j) providing a second set of alignment marks on said surface of said second member and which is substantially identical to said first set of alignment marks;
- (k) illuminating said second set of alignment marks with said flood radiation to produce second reflected radiation therefrom;
- (l) imaging said second reflected radiation onto said imaging detector means comprising a charge-coupled device to generate a serial electronic signal as a function of time and containing serial information corresponding to the position of said second set of alignment marks;
- (m) electronically processing said second detector signal to generate a second alignment signal with a high signal-to-noise ratio;
- (n) providing a second reference electrical signal comprising a periodic signal of predetermined frequency and phase;
- (o) comparing the phase angle of said second alignment signal and the phase angle of said second reference signal and generating a second error signal proportional to the phase difference of said second alignment signal and said second reference signal; and
- (p) providing lateral movement of said second set of alignment marks with respect to said chosen reference point in response to said error signal until said second alignment signal and said second reference signal become congruent in phase, to produce accurate alignment of said surface of said second chosen member with said chosen reference point and thus produce accurate alignment of said surface of said first chosen member with said surface of said second chosen member.
- 3. A process for aligning the surface of a chosen member with a chosen fixed reference point comprising the steps of:
- (a) providing a set of alignment marks on said surface of said member and spaced at a selected coded periodicity;
- (b) providing said chosen fixed reference point;
- (c) providing a source of incoherent flood radiation for illuminating said set of alignment marks;
- (d) illuminating said set of alignment marks with said flood radiation to produce reflected radiation therefrom;
- (e) imaging said reflected radiation onto an imaging detector means comprising a charge-coupled device to generate from said set of alignment marks a detection signal comprising a serial electronic signal as a function of time and containing serial information corresponding to the position of said set of alignment marks;
- (f) electronically processing said detection signal to generate an alignment signal with a high signal-to-noise ratio;
- (g) providing a reference electrical signal comprising an encoded signal with coding corresponding to said selected coded periodicity of said set of alignment marks;
- (h) correlating said alignment signal and said reference signal and generating an error signal which is indicative of the extent of correlation of said alignment signal and said reference signal in time; and
- (i) providing lateral movement of said set of alignment marks with respect to said chosen reference point in response to said error signal until said alignment signal and said reference signal become correlated, to produce accurate alignment of said surface of said chosen member with said chosen reference point.
Parent Case Info
This application is a continuation-in-part application of patent application Ser. No. 149,600, filed May 13, 1980, which has matured to U.S. Pat No. 9,327,292.
Government Interests
The Government has rights in this invention pursuant to Contract No. N00123-78-C-0195 awarded by the Department of the Navy.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1328976 |
Sep 1973 |
GBX |
Non-Patent Literature Citations (2)
Entry |
"Step & Repeat Wafer Imaging", Wittekock, Semiconductor Microlithography, SPIE vol. 221, 1980, pp. 2-8. |
"Optimal Patterns for Alignment" by Makaous, Applied Optics, vol. 13, No. 3, Mar. 1974, pp. 659-664. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
149600 |
May 1980 |
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