Claims
- 1. A semiconductor structure comprising a silicon layer formed over a substrate, said layer comprising a silicon inner portion, a silicon outer portion, and a silicon transition region between the inner and outer portions; one of said inner and outer portions being essentially polycrystalline, the other of said inner and outer portions being essentially amorphous; and the silicon transition region while being essentially silicon is neither essentially amorphous nor essentially polycrystalline and constitutes at least 1% of a thickness of the silicon layer.
- 2. A semiconductor structure comprising a silicon layer formed over a substrate, said layer comprising a silicon inner portion, a silicon outer portion, and a silicon transition region between the inner and outer portions; one of said inner and outer portions being essentially polycrystalline, the other of said inner and outer portions being essentially amorphous; and the silicon transition region while being essentially silicon is neither essentially amorphous nor essentially polycrystalline and constitutes at least 10% of a thickness of the silicon layer.
- 3. The structure of claim 2 wherein the substrate comprises monocrystalline silicon.
- 4. The structure of claim 2 wherein the substrate comprises monocrystalline silicon, wherein the inner portion is essentially amorphous, and wherein the inner portion contacts the substrate.
- 5. The structure of claim 2 wherein the transition region comprises from 10% to 20% of the thickness of the silicon layer.
- 6. The structure of claim 2 wherein the inner portion is essentially amorphous.
- 7. The structure of claim 2 wherein the inner portion is essentially polycrystalline.
- 8. The structure of claim 2 further comprising a varying dopant concentration, the dopant concentration being highest in the essentially amorphous portion, lowest in the essentially polycrystalline portion, and intermediate the lowest and highest concentrations in the silicon transition region.
- 9. A semiconductor structure comprising a silicon layer formed over a substrate through an uninterrupted deposition process, said layer comprising a silicon inner portion, a silicon outer portion, and a silicon transition region between the inner and outer portions; one of said inner and outer portions being essentially polycrystalline, the other of said inner and outer portions being essentially amorphous; and the silicon transition region being neither essentially amorphous nor essentially polycrystalline and constituting at least 10% of a thickness of the silicon layer.
- 10. The structure of claim 9 wherein the substrate comprises monocrystalline silicon.
- 11. The structure of claim 9 wherein the substrate comprises monocrystalline silicon, wherein the inner portion is essentially amorphous, and wherein the inner portion contacts the substrate.
- 12. The structure of claim 9 wherein the transition region comprises from 10% to 20% of the thickness of the silicon layer.
- 13. The structure of claim 9 wherein the inner portion is essentially amorphous.
- 14. The structure of claim 9 wherein the inner portion is essentially polycrystalline.
- 15. The structure of claim 9 further comprising a varying dopant concentration, the dopant concentration being highest in the essentially amorphous portion, lowest in the essentially polycrystalline portion, and intermediate the lowest and highest concentrations in the silicon transition region.
RELATED PATENT DATA
This patent resulted from a divisional application of U.S. patent application Ser. No. 09/146,732, filed on Sep. 3, 1998.
US Referenced Citations (19)
Divisions (1)
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Number |
Date |
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146732 |
Sep 1998 |
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