Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus

Information

  • Patent Grant
  • 9748120
  • Patent Number
    9,748,120
  • Date Filed
    Monday, July 1, 2013
    11 years ago
  • Date Issued
    Tuesday, August 29, 2017
    7 years ago
Abstract
An apparatus for treating a disc-shaped article comprises a spin chuck and at least three individually controllable infrared heating elements. The infrared heating elements are mounted in a stationary manner with respect to rotation of said spin chuck. The infrared heating elements are arranged in a nested configuration so as to define individually controllable inner, middle and outer heating zones adjacent a disc-shaped article when positioned on the spin chuck.
Description
BACKGROUND OF THE INVENTION

1. Field of the Invention


The invention relates to an apparatus for liquid treatment of disc-shaped articles, and to a heating system for use in such an apparatus.


2. Description of Related Art


Liquid treatment includes both wet etching and wet cleaning, wherein the surface area of a wafer to be treated is wetted with a treatment liquid and a layer of the wafer is thereby removed or impurities are thereby carried off. A device for liquid treatment is described in U.S. Pat. No. 4,903,717. In this device the distribution of the liquid may be assisted by the rotational motion imparted to the wafer.


Techniques for processing a surface of a disc-shaped article are typically used in the semiconductor industry on silicon wafers, for example of 300 mm or 450 mm diameter. However, such techniques may be applied for other plate-like articles such as compact discs, photo masks, reticles, magnetic discs or flat panel displays. When used in semiconductor industry they may also be applied for glass substrates (e.g. in silicon-on-insulator processes), III-V substrates (e.g. GaAs) or any other substrate or carrier used for producing integrated circuits.


When using heated process liquids, there is a problem in achieving temperature uniformity across the surface of the wafer, and the need to address that problem becomes more acute as wafer diameters increase.


In particular, as the wafer diameter increases, so too will the temperature differential between a liquid at the point where it is applied in a central region of the wafer and the same liquid after it has travelled radially outwardly to the periphery of the wafer. This results in varied etch rates as a function of the distance from the center of the wafer, and hence poor process uniformity.


Conventional approaches to alleviate this problem have included dispensing process liquid from movable arms, so-called “boom swing” dispensers; however, this involves an increase in the cost and complexity of the device as well as its operation. The problem can be addressed to some extent by increasing the flow of process liquid, and/or by dispensing a high temperature liquid such as deionized water on the opposite side of the wafer; however, these techniques result in higher consumption of process liquids.


Commonly-owned co-pending application U.S Patent Application Pub. No. 2013/0061873 describes improved apparatus equipped with an infrared heater for heating a wafer to enhance process uniformity. Although the devices of that patent application represent an improvement over conventional techniques, there remains a need to provide further enhanced process uniformity and control.


SUMMARY OF THE INVENTION

Thus, in one aspect, the present invention relates to an apparatus for treating a disc-shaped article, comprising a spin chuck for holding a disc-shaped article in a predetermined orientation relative to an upper surface of the spin chuck, and at least three individually controllable infrared heating elements mounted above the upper surface of the spin chuck and below a disc-shaped article when mounted on the spin chuck. The infrared heating elements are mounted in a stationary manner with respect to rotation of the spin chuck. The at least three individually controllable infrared heating elements are arranged in a nested configuration so as to define individually controllable inner, middle and outer heating zones adjacent a disc-shaped article when positioned on the spin chuck.


In preferred embodiments of the apparatus according to the present invention, each of the heating elements has at least one of a shape and a position such that each of the heating elements heats regions of differing distance from the axis of rotation of the spin chuck.


In preferred embodiments of the apparatus according to the present invention, each of the heating elements comprises a curved portion that extends generally along an arc of a circle that is eccentric to the axis of rotation of the spin chuck.


In preferred embodiments of the apparatus according to the present invention, each of the heating elements comprises two curved portions interconnected by a straight portion, such that each of the heating elements is generally C-shaped.


In preferred embodiments of the apparatus according to the present invention, a first one of the two curved portions extends generally along an arc of a first circle and a second one of the two curved portions extends generally along an arc of a second circle, the first and second circle having centers that are offset from one another.


In preferred embodiments of the apparatus according to the present invention, each of the two curved portions extends generally along an arc of a same circle.


In preferred embodiments of the apparatus according to the present invention, each the heating element comprises two straight portions interconnected by a curved portion.


In preferred embodiments of the apparatus according to the present invention, the two straight portions are parallel to one another.


In preferred embodiments of the apparatus according to the present invention, each of the heating elements comprises a curved portion extending along an arc of a circle, and wherein the circle for each heating element is concentric with the circle for at least two others of the heating elements.


In preferred embodiments of the apparatus according to the present invention, a circle circumscribing emitting portions of any one of the at least three individually controllable infrared heating elements does not intersect a circle circumscribing emitting portions of any others of the at least three individually controllable infrared heating elements.


In preferred embodiments of the apparatus according to the present invention, the apparatus includes a plate that is transparent to infrared radiation emitted by the at least three individually controllable infrared heating elements, said plate being positioned between said at least three individually controllable infrared heating elements and a disc-shaped article when positioned on the spin chuck.


In preferred embodiments of the apparatus according to the present invention, the plate is part of a housing that surrounds the at least three individually controllable infrared heating elements.


In preferred embodiments of the apparatus according to the present invention, the housing is mounted in a stationary manner with respect to rotation of the spin chuck.


In another aspect, the present invention relates to an infrared heating assembly for use in an apparatus for treating a disc-shaped article. The infrared heating assembly comprises at least three individually controllable infrared heating elements mounted in a common frame connector. The at least three individually controllable infrared heating elements are arranged in a nested configuration so as to define individually controllable inner, middle and outer heating zones. Each of the heating elements has at least one of a shape and a position such that each of the heating elements extends over regions of differing distance from the center of a circle circumscribing the infrared heating assembly.


In preferred embodiments of the infrared heating assembly according to the present invention, each of the at least three individually controllable infrared heating elements comprises at least one curved portion and at least one straight portion.


In preferred embodiments of the infrared heating assembly according to the present invention, the curved portions of adjacent infrared heating elements extend along concentric circles and the straight portions of adjacent heating elements are parallel to one another.


In preferred embodiments of the infrared heating assembly according to the present invention, the common frame connector comprises a plurality of electrical connectors equal in number to the at least three individually controllable infrared heating elements, thereby to permit individual connection of each of the at least three individually controllable infrared heating elements to a controller for individually energizing each of the at least three individually controllable infrared heating elements.


In preferred embodiments of the infrared heating assembly according to the present invention, the assembly includes a housing surrounding the at least three individually controllable infrared heating elements, the housing comprising a plate forming an upper portion thereof, the plate being transparent to the infrared radiation emitted by the at least three individually controllable infrared heating elements.


In yet another aspect, the present invention the present invention relates to an infrared lamp for use in heating a disc-shaped workpiece in such a way that the infrared lamp radiates light onto the disc-shaped workpiece while the infrared lamp and the disc-shaped workpiece rotate relative to each other. The infrared lamp comprises an arc-shaped emitting part generally describing a circle that is eccentric in relation to an axis of rotation of the disc-shaped workpiece, and an adjoining emitting part disposed inside the circle and extending from the arc-shaped emitting part generally along a chord of the circle.


In preferred embodiments of the infrared lamp for use in heating a disc-shaped workpiece according to the present invention, the adjoining emitting part has a linear shape.


In preferred embodiments of the infrared lamp for use in heating a disc-shaped workpiece according to the present invention, the lamp includes a second arc-shaped emitting part at an end of the adjoining emitting part opposite the arc-shaped emitting part.


In preferred embodiments of the infrared lamp for use in heating a disc-shaped workpiece according to the present invention, the adjoining emitting part is integrally connected to an end of the arc-shaped emitting part.


In preferred embodiments of the infrared lamp for use in heating a disc-shaped workpiece according to the present invention, the arc-shaped emitting part and the adjoining emitting part are integrally formed and each is round in cross-section.


In yet another aspect, the present invention relates to a heating apparatus comprising an infrared lamp positioned facing a disc-shaped workpiece, the heating apparatus heating the disc-shaped workpiece in such a way that the infrared lamp radiates light onto the disc-shaped workpiece while the infrared lamp and the disc-shaped workpiece rotate relative to each other. The infrared lamp comprises an arc-shaped emitting part generally describing a circle that is eccentric in relation to an axis of rotation of the disc-shaped workpiece, and an adjoining emitting part disposed inside the circle and extending from the arc-shaped emitting part generally along a chord of the circle. The heating apparatus comprises a plurality of the infrared lamps, wherein the arc-shaped emitting parts of the infrared lamps are positioned concentrically to one another.


In preferred embodiments of the heating apparatus according to the present invention, the adjoining emitting part of each of the infrared lamps does not intersect a circle circumscribing the arc-shaped emitting part of the corresponding adjacent inner infrared lamp.


In preferred embodiments of the heating apparatus according to the present invention, the infrared lamp further comprises a second arc-shaped emitting part at an end of the adjoining emitting part opposite the arc-shaped emitting part.


In preferred embodiments of the heating apparatus according to the present invention, ends of the arc-shaped emitting part and the second arc-shaped emitting part define an angle whose vertex is on an axis of rotation of the disc-shaped article.


In preferred embodiments of the heating apparatus according to the present invention, the adjoining emitting part of each of the infrared lamps is integrally connected to an end of the corresponding arc-shaped emitting part.


In preferred embodiments of the heating apparatus according to the present invention, the adjoining emitting part of each of the infrared lamps does not extend outwardly from the circle described by the corresponding arc-shaped emitting part.





BRIEF DESCRIPTION OF THE DRAWINGS

Other objects, features and advantages of the invention will become more apparent after reading the following detailed description of preferred embodiments of the invention, given with reference to the accompanying drawings, in which:



FIG. 1 is an exploded perspective view of an apparatus for treating disc-shaped articles according to an embodiment of the present invention;



FIG. 2 is top plan view of the embodiment of FIG. 1;



FIG. 3 is an axial section through the chuck depicted in FIGS. 1 and 2, taken along the line III-III of FIG. 2;



FIG. 4 is a view similar to that of FIG. 2, of another embodiment of an apparatus according to the present invention;



FIG. 5 is a view similar to that of FIG. 2, of yet another embodiment of an apparatus according to the present invention;



FIG. 6 is a view similar to that of FIG. 2, of still another embodiment of an apparatus according to the present invention;



FIG. 7 is an explanatory view for better understanding the relative shapes and sizes of the lamps utilized in the embodiment of FIG. 6;



FIG. 8 is a graph showing the depth of material etched when using the lamp assembly of the FIGS. 1-3 embodiment with all three IR lamps turned off;



FIG. 9 is a graph showing the depth of material etched when using the lamp assembly of the FIGS. 1-3 embodiment with all three IR lamps turned on;



FIG. 10 is a graph showing the depth of material etched when using the lamp assembly of the FIGS. 1-3 embodiment with the inner and middle IR lamps turned on and the outer IR lamp turned off; and



FIG. 11 is a graph showing the depth of material etched when using the lamp assembly of the FIGS. 1-3 embodiment with the inner and middle IR lamps turned off and the outer IR lamp turned on.





DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Referring now to the drawings, FIGS. 1 and 2 depict an apparatus made up of two principal subassemblies, namely, a base spin chuck 10 and a modular infrared heating assembly 20. The spin chuck 10 comprises a rotary main body 12 that is mounted for rotation about a stationary central hollow post 14. This post 14 in turn comprises a central nozzle 18 for dispensing process liquid or gas onto the underside of a wafer when mounted on the spin chuck, as well a series of female electrical sockets 15 in a shoulder of the post 14, which sockets receive corresponding male connectors (not shown) that depend downwardly from the heating assembly 20, and which supply driving current to the IR heating lamps inside that assembly 20.


The chuck body 12 has mounted therein a series of gripping pins 16, which operate generally as described in the above-referenced U.S. Pat. No. 4,903,717, in that the pins 16 are driven in unison by a common ring gear between a radially outer open position and a radially inner closed position in with the upper ends of these pins engage the edge of a disc-shaped article to be treated.


The heating assembly 20 in this embodiment is formed as a modular unit comprising a lower dished housing or shell 22 that contains the IR lamps 21, 23, 25. A cover 24 is screwed onto the lower housing 22 by a series of peripheral screws 26, which are six in number in this embodiment.


The cover 24 in this embodiment is a plate formed from a material that is transparent to the wavelengths of IR radiation emitted by the lamps 21, 23, 25, and this plate 24 may be formed for example of sapphire or quartz glass, as is known to those skilled in this art. The plate 24 has a small central opening 19 formed therein, to permit passage of the upper end of dispensing nozzle 18.


Within the housing of the heating assembly 20, that is, inside the lower housing 22 and beneath the transparent plate 24, there is mounted a set of three infrared heating lamps 21, 23, 25, which are carried by a common frame 29 that also incorporates the associated electrical supply wiring (not shown). The assembly formed by the housing formed of lower shell 22 and upper plate 24, frame 29 and lamps 21, 23, 25 in this embodiment is rigidly mounted to the stationary post 14.


Referring now to FIG. 2, it can be seen that the wafer W is now supported by the ends of pins 16 projecting adjacent the outer periphery of the heating assembly 20. The phantom line in FIGS. 2 and 3 designates the position of a wafer W when held by the apparatus, with the underside of wafer W being spaced by a small defined gap from the cover 24.


The wafer W is centered above the heating assembly 20, which in turn is centered on the axis of rotation of the underlying spin chuck. It will be appreciated that the spin chuck 10 is therefore designed to hold a wafer W of a specified diameter. In the embodiments described herein, that diameter is 300 mm, which is a common diameter of silicon wafer at present. However, the apparatus may of course be designed to hold disc-shaped articles of other diameters, such as 200 mm and 450 mm.


In the plan view of FIG. 2 it can be seen that each of the three heating elements in this embodiment is made of two curved portions (25-1 and 25-3 in the case of the outer heating element 25) interconnected by a straight portion (25-2 in the case of the outer heating element 25). The middle and inner heating elements 23 and 21, respectively, have the same shape. The heating elements 21, 23, 25 of this embodiment are thus generally C-shaped. Moreover, while the curved portions (e.g., 25-1, 25-3) of these heating elements generally follow a circular arc, and while the adjacent curved portions of all three heating elements are preferably substantially concentric, the circles described by those curved portions are not in this embodiment concentric with the center of the heating assembly 20 and hence are not concentric with the axis of rotation of the spin chuck.


Consequently, in this embodiment, both the position and shape of the heating elements 21, 23, 25 is such that, as the wafer W is rotated by the chuck 10 relative to the stationary heating elements 21, 23, 25, each heating element effectively “travels” radially relative to the rotating wafer W, in that each heating element heats an annular region whose radial extent is significant greater than the cross-sectional diameter of the heating elements. For the present embodiment, those zones are delimited by the circles shown in broken line in FIG. 2, and those zones are designated Z1, Z2 and Z3 in FIG. 2.


It will be appreciated that each heating element also contributes to some extent to the heating in the zone or zones adjacent thereto. The broken line circles in FIG. 2 thus delineate the position at which the predominant heating effect changes from one heating element to the next.


In FIG. 3, it can be seen that the frame 29 is supported within the housing 22, 24, with the housing of the heating assembly 20 being in this embodiment rigidly secured to the stationary post 14, and thus with the frame 29 and lamps 21, 23, 25 also being mounted in a stationary manner to the post 14. The upwardly-facing surface of the lower housing part or shell 22 is preferably provided with a suitable IR reflective coating 31, to aid in directing the IR radiation emitted by lamps 21, 23, 25, upwardly through the transparent plate 24 and onto the downwardly facing surface of the wafer W.


The stationary post 14 is mounted onto the frame 32 of the apparatus, which in this embodiment also carries a stator 34. Stator 34 in turn drives rotor 36, which is attached to the body 12 of spin chuck 10. Also visible in FIG. 3 is the ring gear 11 mentioned above, which drives the gripping pins 16 in unison.


It will be appreciated that in the embodiments described herein, the entire heating assembly is mounted in a stationary manner on the post 14, as is described for example in connection with the heating assembly disclosed in commonly-owned co-pending application U.S Patent Application Pub. No. 2013/0061873.



FIG. 4 depicts another embodiment, in which the infrared lamps 21′, 23′, 25′ are shaped differently than in the preceding embodiments. In particular, each lamp comprises two straight portions 21-1′, 21-3′, 23-1′, 23-3′, 25-1′, 25-3′, and one straight portion 21-2′, 23-2′, 25-2′. The shape and position of the straight portions of these elements contribute to the creation of heating zones as described in connection with the preceding embodiments.



FIG. 5 depicts yet another embodiment, in which each of the three heating elements 41, 43, 45 is a continuous curved tubular element. Moreover, while these heating elements generally follow a circular arc, and while all three heating elements are preferably substantially concentric, the circles described by those heating elements are not in this embodiment concentric with the center of the heating assembly 20 and hence are not concentric with the axis of rotation of the spin chuck.


Consequently, in this embodiment, both the position and shape of the heating elements 41, 43, 45 is such that, as the wafer W is rotated by the chuck 10 relative to the stationary heating elements 41, 43, 45, each heating element also heats an annular region whose radial extent is significant greater than the cross-sectional diameter of the heating elements, as in the preceding embodiments.



FIGS. 6 and 7 illustrate a still further approach to the design of the heating lamps. In this embodiment, four individually controllable IR heating lamps 51, 53, 55, 57 are mounted on a suitable carrier frame 59 in the manner as generally as described in connection with the preceding embodiments. The housing 20 and spin chuck 10 are as previously described.


The conceptual diagram of FIG. 7 reveals the interrelationship between the shapes and sizes of these lamps 51, 53, 55, 57. In particular, the outer periphery of the curved part of lamp 53 describes a circle R1 that is also coincident with the inner periphery of the curved part of lamp 51. Similarly, the outer periphery of the curved part of lamp 55 describes a circle R2 that is also coincident with the inner periphery of the curved part of lamp 53, and the outer periphery of the curved part of lamp 57 describes a circle R3 that is also coincident with the inner periphery of the curved part of lamp 55. Furthermore, the outer periphery of the largest lamp 51 approximately coincides with a one-fourth quadrant of the circular housing 20.


Therefore, when the lamps 51, 53, 55, 57 are mounted as shown in FIG. 6, there are effectively no gaps in the heated regions of the wafer W, as the wafer is rotated in relation to the stationary lamps.


It is to be noted that the heating lamps in each of the preceding embodiments are preferably individually controllable. It is particularly preferred that each lamp can be not only switched on and off independently of the others, but also that the wattage to each lamp can be independently varied. This permits a variety of advantageous process control.


For example, FIG. 8 shows, for purposes of comparison, etching profiles achieved when using the heating lamp assembly of FIGS. 1-3 but without powering any of the three IR lamps 21, 23, 25. As can be seen, there is a markedly greater removal of material from the wafer in the central region of the wafer as compared to the peripheral region. This is because etchant dispensed centrally of the wafer has cooled substantially as it travels radially outwardly across a 300 mm diameter wafer. Moreover, this undesired etching profile is largely the same regardless of whether the etching chemistry, temperature and flow are selected to etch 4 Å or material or 9 Å of material. In either case, the material removed at the outer periphery of the wafer is less by about 2Å.


By contrast, FIG. 9 shows etching profiles achieved by appropriately powering all three of the lamps 21, 23, 25. The etching profiles have been nearly inverted relative to those of FIG. 8. It should be noted also that these profiles are attained at lower flow rates and shorter processing times than for the data of FIG. 8. It should also be noted that for many process specifications, the ideal etching profile is not necessarily flat; instead, as in FIG. 9, a desired etching profile will often call for “overetching” of the peripheral wafer region, e.g., removing approximately 10% more material at the wafer edge than at the wafer center. As can be seen in FIG. 9, the apparatus and heating assemblies of the present invention are particularly well-suited to such applications.



FIG. 10 shows the profile attained when only the lamps 21, 23 are powered, whereas FIG. 11 shows the profile attained when only the lamp 25 is powered. In neither case does the resulting profile resemble those of FIG. 9.


While the present invention has been described in connection with various preferred embodiments thereof, it is to be understood that those embodiments are provided merely to illustrate the invention, and should not be used as a pretext to limit the scope of protection conferred by the true scope and spirit of the appended claims.

Claims
  • 1. Apparatus for treating a disc-shaped article, comprising: a spin chuck for holding the disc-shaped article in a predetermined orientation relative to an upper surface of the spin chuck; andat least three individually-controllable heating elements mounted above the upper surface of the spin chuck and below the disc-shaped article when mounted on the spin chuck, wherein the at least three individually-controllable heating elements are mounted in a stationary manner with respect to rotation of the spin chuck,wherein the at least three individually-controllable heating elements are arranged in a nested configuration so as to define individually-controllable inner, middle and outer heating zones adjacent to the disc-shaped article when positioned on the spin chuck.
  • 2. The apparatus according to claim 1, wherein each of the at least three individually-controllable heating elements has at least one of a shape and a position such that each of the at least three individually-controllable heating elements heats regions of differing distance from an axis of rotation of the spin chuck.
  • 3. The apparatus according to claim 2, wherein each of the at least three individually-controllable heating elements comprises a curved portion that extends generally along an arc of a circle that is eccentric to the axis of rotation of the spin chuck.
  • 4. The apparatus according to claim 1, wherein each the at least three individually-controllable heating element comprises two straight portions interconnected by a curved portion.
  • 5. The apparatus according to claim 4, wherein the two straight portions are parallel to one another.
  • 6. The apparatus according to claim 1, wherein each of the at least three individually-controllable heating element comprises a curved portion extending along an arc of a circle, and wherein the circle for each heating element is concentric with the circle for at least two others of the at least three individually-controllable heating elements.
  • 7. The apparatus according to claim 1, wherein a circle circumscribing emitting portions of any one of the at least three individually-controllable heating elements does not intersect a circle circumscribing emitting portions of any others of the at least three individually-controllable heating elements.
  • 8. The apparatus according to claim 1, further comprising a plate that is transparent to radiation emitted by the at least three individually-controllable heating elements, the plate being positioned between the at least three individually-controllable heating elements and the disc-shaped article when positioned on the spin chuck.
  • 9. The apparatus according to claim 8, wherein the plate is part of a housing that surrounds the at least three individually-controllable heating elements.
  • 10. The apparatus according to claim 9, wherein the housing is mounted in a stationary manner with respect to rotation of the spin chuck.
  • 11. The apparatus of claim 1, wherein the at least three individually-controllable heaters comprise infrared heaters.
US Referenced Citations (102)
Number Name Date Kind
4871417 Nishizawa et al. Oct 1989 A
4903717 Sumnitsch Feb 1990 A
4982693 Ebata Jan 1991 A
5513668 Sumnitsch May 1996 A
5595606 Fujikawa Jan 1997 A
5667622 Hasegawa et al. Sep 1997 A
5762391 Sumnitsch Jun 1998 A
5818137 Nichols et al. Oct 1998 A
5859408 Baxendine Jan 1999 A
5882433 Ueno Mar 1999 A
5927305 Shiba Jul 1999 A
5965047 Blersch et al. Oct 1999 A
6051303 Katsuda et al. Apr 2000 A
6093252 Wengert et al. Jul 2000 A
6121579 Aoki Sep 2000 A
6198074 Savas Mar 2001 B1
6219936 Kedo et al. Apr 2001 B1
6328846 Langen et al. Dec 2001 B1
6357457 Taniyama et al. Mar 2002 B1
6358676 Wu Mar 2002 B1
6435200 Langen Aug 2002 B1
6443168 Morita et al. Sep 2002 B1
6485531 Schob Nov 2002 B1
6491764 Mertens et al. Dec 2002 B2
6517998 Noda et al. Feb 2003 B1
6536454 Lindner Mar 2003 B2
6550988 Sugimoto et al. Apr 2003 B2
6843857 Bergman Jan 2005 B2
6863741 Orii et al. Mar 2005 B2
6867150 Kikuchi et al. Mar 2005 B2
6982006 Boyers et al. Jan 2006 B1
7173216 Ptak Feb 2007 B2
7467635 Satoshi et al. Dec 2008 B2
7509035 Ranish et al. Mar 2009 B2
7806989 Sekiguchi et al. Oct 2010 B2
7837803 Hohenwarter Nov 2010 B2
7891314 Pichler Feb 2011 B2
7965372 Noda et al. Jun 2011 B2
8133327 Tokuno et al. Mar 2012 B2
8147618 Passegger Apr 2012 B2
8211242 Inoue et al. Jul 2012 B2
8277564 Le et al. Oct 2012 B2
8294068 Ranish et al. Oct 2012 B2
8404499 Moffatt Mar 2013 B2
8596623 Frank et al. Dec 2013 B2
8821681 Puggl et al. Sep 2014 B2
9093482 Brugger Jul 2015 B2
9136155 Kinoshita Sep 2015 B2
9245777 Plazonic Jan 2016 B2
9265091 Ueshima Feb 2016 B2
9316443 Hohenwarter et al. Apr 2016 B2
9355883 Hohenwarter et al. May 2016 B2
20020002991 Lindner Jan 2002 A1
20020032973 Jung Mar 2002 A1
20020096196 Toshima et al. Jul 2002 A1
20030196683 Izumi et al. Oct 2003 A1
20030213436 Kwon Nov 2003 A1
20040055707 Sato et al. Mar 2004 A1
20040069320 Bergman Apr 2004 A1
20040250839 Robertson et al. Dec 2004 A1
20050193952 Goodman et al. Sep 2005 A1
20060042722 Kim et al. Mar 2006 A1
20060086713 Hunter et al. Apr 2006 A1
20060112980 Jeong et al. Jun 2006 A1
20060201363 Nakatsukasa et al. Sep 2006 A1
20060231125 Yi Oct 2006 A1
20070017555 Sekiguchi et al. Jan 2007 A1
20070087568 Koyata et al. Apr 2007 A1
20070093071 Verhaverbeke et al. Apr 2007 A1
20070113872 Uchida et al. May 2007 A1
20070227556 Bergman Oct 2007 A1
20070295365 Miya et al. Dec 2007 A1
20080066337 Seki Mar 2008 A1
20080110861 Kajita et al. May 2008 A1
20080190454 Eitoku Aug 2008 A1
20080226272 Kasai et al. Sep 2008 A1
20080314870 Inoue et al. Dec 2008 A1
20090011523 Gale Jan 2009 A1
20090126762 Nomura et al. May 2009 A1
20090133715 Maekawa May 2009 A1
20100054720 Hunter et al. Mar 2010 A1
20100055314 Kato et al. Mar 2010 A1
20100200163 Puggl et al. Aug 2010 A1
20100229797 Kato Sep 2010 A1
20100236579 Araki et al. Sep 2010 A1
20110151675 Frank et al. Jun 2011 A1
20120085372 Plihon Apr 2012 A1
20120103371 Yun et al. May 2012 A1
20120138097 Okorn-Schmidt et al. Jun 2012 A1
20120160274 Kasai et al. Jun 2012 A1
20130042813 Kato Feb 2013 A1
20130061805 Jin et al. Mar 2013 A1
20130061873 Hohenwarter et al. Mar 2013 A1
20130143406 Hsu et al. Jun 2013 A1
20130160260 Frank et al. Jun 2013 A1
20140054280 Hohenwarter Feb 2014 A1
20140091079 Ueshima Apr 2014 A1
20140102637 Brugger et al. Apr 2014 A1
20140127908 Okutani May 2014 A1
20150079803 Huang et al. Mar 2015 A1
20160064242 Obweger et al. Mar 2016 A1
20160118278 Plazonic Apr 2016 A1
Foreign Referenced Citations (17)
Number Date Country
0504431 Sep 1992 EP
1791161 May 2007 EP
63185029 Jul 1988 JP
2001070859 Mar 2001 JP
2001319909 Nov 2001 JP
2001319910 Nov 2001 JP
2003257926 Sep 2003 JP
2006148010 Jun 2006 JP
2009206359 Sep 2009 JP
2010129809 Jun 2010 JP
5166718 Mar 2013 JP
20090012703 Feb 2009 KR
2004084278 Sep 2004 WO
2006008236 Jan 2006 WO
WO-2007101764 Sep 2007 WO
2009010394 Jan 2009 WO
2011007287 Jan 2011 WO
Non-Patent Literature Citations (9)
Entry
International Search Report dated Aug. 28, 2008, from corresponding PCT Application (PCT/EP2008/058568).
International Search Report, dated Dec. 6, 2012, corresponding PCT/IB2012/054450.
International Search Report, dated Sep. 22, 2011 in, PCT/IB2010/055550.
Machine Generated English Translation of JP 2001-319910A held to Taniyama Hiromi et al. Published Nov. 16, 2001.
Translation of Japanese Office Action, dated Oct. 23, 2012, from corresponding JP application.
English translation of JP Office Action, dated Nov. 24, 2015; Application No. 2013-535537.
International Search Report dated May 4, 2012 in International application No. PCT/IB11/54386.
Translation of KR 10-2009-0012703.
U.S. Appl. No. 13/593,264, filed Aug. 23, 2012. (no U.S. publication No. assigned yet).
Related Publications (1)
Number Date Country
20150001202 A1 Jan 2015 US