The present invention relates generally to micro-mechanical systems (MEMS), and particularly to optical scanning using such systems.
MEMS-based optical scanners are used in a variety of applications. For example, U.S. Pat. No. 7,952,781, whose disclosure is incorporated herein by reference, describes a method of scanning a light beam and a method of manufacturing a microelectromechanical system (MEMS), which can be incorporated in a scanning device.
U.S. Patent Application Publication 2013/0207970, whose disclosure is incorporated herein by reference, describes a scanning depth engine, which includes a transmitter, which emits a beam comprising pulses of light, and a scanner, which is configured to scan the beam, within a predefined scan range, over a scene. The scanner may comprise a micromirror produced using MEMS technology. A receiver receives the light reflected from the scene and generates an output indicative of the time of flight of the pulses to and from points in the scene. A processor is coupled to control the scanner and to process the output of the receiver so as to generate a 3D map of the scene.
PCT International Publication WO 2015/109273, whose disclosure is incorporated herein by reference, describes a scanning device, which includes a substrate, which is etched to define an array of two or more parallel rotating members, such as scanning mirrors, and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis. In some embodiments, coupling means between the mirrors in the array couple the oscillations of the mirrors and thus maintain the synchronization between them.
Embodiments of the present invention that are described hereinbelow provide improved scanning devices and methods.
There is therefore provided, in accordance with an embodiment of the invention, a mirror assembly, including a frame having a central opening and a mirror plate, which is contained within the central opening of the frame and is shaped to define separate first and second mirrors connected by a bridge extending between the first and second mirrors. A pair of hinges are connected between the frame and the mirror plate at locations on the central axis on opposing sides of the frame so as to enable rotation of the mirror plate about the central axis relative to the frame.
In some embodiments, the first and second mirrors have respective first and second widths, and the bridge has a bridge width, all measured in a dimension perpendicular to the central axis, such that the bridge width is less than one-fourth the first and second widths. In a disclosed embodiment, the bridge includes a neck, which extends along a central axis of the mirror plate, and the first mirror has a shape that tapers from a first width to a narrower width in proximity to the neck.
In some embodiments, the first and second mirrors have different, respective shapes and sizes. In one embodiment, the second mirror is larger than the first mirror, and the hinges include first and second hinges, which are respectively connected between the first and second mirrors and the frame, wherein the second hinge is stiffer than the first hinge.
In a disclosed embodiment, the frame, the mirror plate and the hinges include an epitaxial semiconductor material, which is etched to define and separate the mirror plate and the hinges from the frame. Typically, a reflective coating is deposited over the semiconductor mirror in an area of the first and second mirrors but is not deposited on the bridge. Additionally or alternatively, the hinges include torsion hinges.
In some embodiments, the assembly includes a first comb extending outward from the mirror plate, and a second comb extending inward from the frame so as to interleave with the first comb, wherein the first and second combs include a conductive material. Additionally or alternatively, the assembly includes a base surrounding the frame and rotationally connected to the frame so that the frame rotates, relative to the base, about a frame axis that is perpendicular to the central axis of the mirror plate.
There is also provided, in accordance with an embodiment of the invention, a scanning device, including scanner, which includes a frame having a central opening and a mirror plate, which is contained within the central opening of the frame and is shaped to define separate first and second mirrors connected by a bridge extending between the first and second mirrors. A pair of hinges are connected between the frame and the mirror plate at locations on the central axis on opposing sides of the frame so as to enable rotation of the mirror plate about the central axis relative to the frame. A transmitter is configured to emit a beam of light toward the first mirror, which reflects the beam so that the scanner scans the beam over a scene. A receiver is configured to receive, by reflection from the second mirror, the light reflected from the scene and to generate an output indicative of the light received from points in the scene.
In a disclosed embodiment, the scanner includes a base surrounding the frame and rotationally connected to the frame so that the frame rotates, relative to the base, about a frame axis that is perpendicular to the central axis of the mirror plate while the mirror plate rotates relative to the frame.
Typically, the mirror plate is configured to rotate about the hinges at a resonant frequency of the scanner, while the bridge is sufficiently stiff to synchronize the rotation of the first and second mirrors in amplitude and phase at the resonant frequency.
In some embodiments, the scanner includes a first comb extending outward from the mirror plate, and a second comb extending inward from the frame so as to interleave with the first comb, wherein the first and second combs include a conductive material and are configured to drive the rotation of the mirror plate by electrostatic force due to a voltage applied between the first and second combs.
There is additionally provided, in accordance with an embodiment of the invention, a method for producing a mirror assembly. The method includes etching a semiconductor wafer to define a frame having a central opening and a mirror plate, which is contained within the central opening of the frame and is shaped to define separate first and second mirrors connected by a bridge extending between the first and second mirrors. The wafer is also etched to define a pair of hinges, which are connected between the frame and the mirror plate at locations on the central axis on opposing sides of the frame so as to enable rotation of the mirror plate about the central axis relative to the frame.
The present invention will be more fully understood from the following detailed description of the embodiments thereof, taken together with the drawings in which:
The above-mentioned PCT International Publication WO 2015/109273 describes arrays of multiple scanning mirrors that are weakly coupled together in order to synchronize the oscillations of the mirrors in the array. U.S. patent application Ser. No. 14/551,104, filed Nov. 24, 2014, whose disclosure is incorporated herein by reference, describes an application of this technique in synchronizing separate transmit (Tx) and receive (Rx) mirrors. An advantage of this approach is that the individual mirrors in the array have low inertia and can be thus be driven with minimal power input at oscillation frequencies near the system resonant frequency. In practice, however, even small manufacturing deviations in the dimensions of the mirrors and the hinges on which they are mounted can lead to loss of precise amplitude and/or phase synchronization between the mirrors in the array.
Embodiments of the present invention that are described herein address this problem by coupling the transmit and receive mirrors strongly together, while using an asymmetric design to reduce inertia and reduce undesired scattering of the transmitted beam. Specifically, in the disclosed embodiment, the transmit and receive mirrors are coupled together by a narrow mechanical bridge, which ensures that the two mirrors will rotate at the same system frequency. Precise synchronization, in both phase and amplitude, between the two mirrors is achieved by matching the hinge stiffness and the inertia of the transmit and receive mirrors.
In the embodiments shown and described hereinbelow, the bridge has the form of a neck, running along the central axis of the mirror plate, which is also the axis of rotation. Alternatively, however, the bridge may have a different form, such as two or more parallel struts between the two mirrors. Typically, the width of the bridge, i.e., the aggregate dimension of the bridge or the multiple parts of the bridge measured perpendicular to the direction of rotation, is less than half the width of the mirrors and can advantageously be less than one-fourth the width of the mirrors.
In the disclosed embodiment, the size of the transmit mirror is reduced to approximately the minimum dimensions required to cover the entire area of the transmitted beam—which is typically considerably smaller than the collection area required to receive the reflected beam efficiently. The design takes into account the changing location and angle of incidence of the transmitted beam on the mirror as the mirror assembly rotates. Reduction of the transmit mirror size in this manner reduces inertia, as well as air drag, and thus reduces the power required to drive the mirror assembly. The shape and size of the transmit mirror are chosen so as to inhibit specular reflection of the beam emitted from the transmitter into the field of view of the receiver. The narrow bridge intervening between the transmit and receive mirrors is also useful in this regard, and in some embodiments may be made non-reflective for this purpose.
In the pictured embodiment, the wafer is also etched to define a base 32 surrounding frame 30 and rotationally connected to the frame by hinges 34. Thus, frame 30 serves as a gimbal and rotates, relative to base 32, about a frame axis that is perpendicular to the central axis of the mirror plate while the mirror plate rotates relative to the frame. Alternatively, for gimbaled operation, frame 30 may be mounted to rotate on bearings, as described, for example, in U.S. patent application Ser. No. 14/622,942, filed Feb. 16, 2015, whose disclosure is incorporated herein by reference. Further alternatively, frame 30 may be mounted statically, without gimbaling of the frame.
Typically, the mirror plate is configured to rotate about hinges 28 at a resonant frequency of array 20, while neck 26 is sufficiently stiff to synchronize the rotation of mirrors 22 and 24 in amplitude and phase at the resonant frequency. To reduce inertia and avoid stray specular reflections of the transmitted beam, however, the width of neck 26, measured in the direction perpendicular to the central axis of the mirror plate, is typically less than one-fourth the width of mirrors 22 and 24. In a typical application, the area of each of mirrors 22 and 24 is in the range of 2.5 to 50 mm2, and the overall area of array 20 is on the order of 1 cm2. Alternatively, larger or even smaller scanners of this sort may be produced, depending on application requirements.
To further reduce inertia and undesired reflections, the shape of mirror 22 tapers from its full width near hinge 28 to a narrower width in proximity to neck 26. Mirrors 22 and 24 have different, respective shapes and sizes, which are matched to the optical requirements of the scanning device in which array 20 is used, as illustrated in
To drive the rotation of the mirror plate, the semiconductor wafer is etched to define interleaved combs 36, including one set of combs extending outward from mirrors 22 and 24 and a second, interleaved set extending inward from frame 30. Combs 36 comprise a conductive material (typically deposited on the semiconductor surface), which is coupled by drive traces to an electrical drive circuit (not shown). Rotation of mirrors 22 and 24 is thus driven by electrostatic forces between combs 36, as is known in the art. Alternatively, any other suitable sort of drive, such as electromagnetic or piezoelectric drives, may be used to drive the rotation of the mirrors.
A transmitter 42 emits pulses of light, which are collimated by a collimating lens 44 and directed toward transmit mirror 22, which reflects the beam so that the rotation of the mirror scans the beam over a scene. (The term “light,” in the context of the present description and in the claims, refers to optical radiation of any wavelength, including visible, infrared, and ultraviolet radiation.) Light reflected back from the scene is directed by receive mirror 24 toward a collection lens 46, which focuses the reflected light onto a receiver 48. In alternative optical layouts (not shown in the figures), device 40 may comprise ancillary optical elements, such as reflectors and filters, in accordance with system requirements. In any case, device 40 is designed so that array 20 scans the transmitted and received beams of light together over a predefined angular range, so that at each point in the scan, receiver 48 receives light from the same area of the scene that is illuminated at that point by transmitter 42.
In one embodiment, scanning device 40 is used for depth sensing based on time of flight of the light pulses emitted by transmitter 42. In this sort of embodiment, transmitter 42 typically comprises a pulsed laser diode, while receiver 48 comprises a high-speed optoelectronic detector, such as an avalanche photodiode. Alternatively, any other suitable sorts of emitting and sensing components may be used in device 40.
The distance between mirrors 22 and 24 is chosen so as to enable placement of the transmit and receive optics (such as lenses 44 and 46) in the respective beam paths, and to eliminate specular reflections of the transmitted beam within device 40. In particular mirrors 22 and 24 are spaced sufficiently far apart so that specular reflections of the beam emitted by transmitter 42 do not fall within a field of view of receiver 48, and mirror 22 is shaped and sized in support of this objective. As can be seen in
Although the figures described above show a particular optical design and layout of the components of scanning device 40, the principles of the present invention may be applied in scanning devices of other designs. For example, the scanning mirror assembly in device 40 may comprise mirrors and gimbals of different shapes, sizes, orientations and spacing from those shown in the figures. Alternative designs based on the principles set forth above will be apparent to those skilled in the art and are also considered to be within the scope of the present invention.
It will thus be appreciated that the embodiments described above are cited by way of example, and that the present invention is not limited to what has been particularly shown and described hereinabove. Rather, the scope of the present invention includes both combinations and subcombinations of the various features described hereinabove, as well as variations and modifications thereof which would occur to persons skilled in the art upon reading the foregoing description and which are not disclosed in the prior art.
This application claims the benefit of U.S. Provisional Patent Application 62/234,686, filed Sep. 30, 2015, which is incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3918068 | Reinke et al. | Nov 1975 | A |
4003626 | Reinke et al. | Jan 1977 | A |
5629790 | Neukermans et al. | May 1997 | A |
5742419 | Dickensheets et al. | Apr 1998 | A |
5847859 | Murata | Dec 1998 | A |
5938989 | Hambright | Aug 1999 | A |
6140979 | Gerhard et al. | Oct 2000 | A |
6517751 | Hambright | Feb 2003 | B1 |
6603894 | Pu | Aug 2003 | B1 |
6753638 | Adams | Jun 2004 | B2 |
6825967 | Chong et al. | Nov 2004 | B1 |
6882770 | Neilson et al. | Apr 2005 | B2 |
6941034 | Kuboi | Sep 2005 | B2 |
7609875 | Liu et al. | Oct 2009 | B2 |
7952781 | Weiss | May 2011 | B2 |
8018579 | Krah | Sep 2011 | B1 |
8437063 | Weiss et al. | May 2013 | B2 |
8624177 | Campion et al. | Jan 2014 | B2 |
8752969 | Kane et al. | Jun 2014 | B1 |
8797623 | Weiss et al. | Aug 2014 | B2 |
20020070335 | Orcrutt et al. | Jun 2002 | A1 |
20020071169 | Bowers et al. | Jun 2002 | A1 |
20020075786 | Ikegame et al. | Jun 2002 | A1 |
20030137711 | Yagi et al. | Jul 2003 | A1 |
20030162313 | Kim et al. | Aug 2003 | A1 |
20040004775 | Turner | Jan 2004 | A1 |
20040021852 | DeFlumere | Feb 2004 | A1 |
20040040648 | Harden et al. | Mar 2004 | A1 |
20040063235 | Chang | Apr 2004 | A1 |
20040070816 | Kato et al. | Apr 2004 | A1 |
20040081391 | Ko et al. | Apr 2004 | A1 |
20040105139 | Hirose et al. | Jun 2004 | A1 |
20040207744 | Bock | Oct 2004 | A1 |
20040214350 | Pan et al. | Oct 2004 | A1 |
20070064293 | Turner et al. | Mar 2007 | A1 |
20080143196 | Sprague et al. | Jun 2008 | A1 |
20080225368 | Ciabattoni et al. | Sep 2008 | A1 |
20090002678 | Tanaka et al. | Jan 2009 | A1 |
20090161177 | Nomura | Jun 2009 | A1 |
20090284817 | Orcutt | Nov 2009 | A1 |
20090294638 | Mohanty et al. | Dec 2009 | A1 |
20100046054 | Jeong et al. | Feb 2010 | A1 |
20100142020 | Kim | Jun 2010 | A1 |
20100182667 | Ishida | Jul 2010 | A1 |
20100253989 | Shimizu et al. | Oct 2010 | A1 |
20100302617 | Zhou | Dec 2010 | A1 |
20110188054 | Petronius et al. | Aug 2011 | A1 |
20110205609 | Mizoguchi | Aug 2011 | A1 |
20110228251 | Yee et al. | Sep 2011 | A1 |
20110228367 | Lubianiker et al. | Sep 2011 | A1 |
20110279648 | Lutian et al. | Nov 2011 | A1 |
20110310125 | McEldowney et al. | Dec 2011 | A1 |
20120236379 | DaSilva et al. | Sep 2012 | A1 |
20120250124 | Choi et al. | Oct 2012 | A1 |
20120307211 | Hofmann et al. | Dec 2012 | A1 |
20130206967 | Shpunt et al. | Aug 2013 | A1 |
20130207970 | Shpunt et al. | Aug 2013 | A1 |
20130301101 | Conrad et al. | Nov 2013 | A1 |
20140153001 | Chayat et al. | Jun 2014 | A1 |
20140226145 | Steffey et al. | Aug 2014 | A1 |
20140291491 | Shpunt et al. | Oct 2014 | A1 |
20140291496 | Shpunt et al. | Oct 2014 | A1 |
20140310914 | Erlich et al. | Oct 2014 | A1 |
20140313519 | Shpunt et al. | Oct 2014 | A1 |
20150234179 | Shpunt | Aug 2015 | A1 |
20160178895 | Gerson et al. | Jun 2016 | A1 |
Number | Date | Country |
---|---|---|
1621322 | Jun 2005 | CN |
101308343 | Nov 2008 | CN |
102011113147 | Jan 2013 | DE |
1548487 | Jun 2005 | EP |
2333603 | Jun 2011 | EP |
2363686 | Sep 2011 | EP |
2271436 | Apr 1994 | GB |
2004191918 | Jul 2004 | JP |
100867147 | Nov 2008 | KR |
0247241 | Jun 2002 | WO |
03049156 | Jun 2003 | WO |
2005078509 | Aug 2005 | WO |
2012020380 | Feb 2012 | WO |
2012013536 | Feb 2012 | WO |
2014016794 | Jan 2014 | WO |
2014064606 | May 2014 | WO |
Entry |
---|
Judy et al., “Magnetic Microactuation of Polysilicon Flexure Structures,” Solid-State Sensor and Actuator Workshop, year 1994. |
Judy et al., “Magnetically Actuated, Addressable Microstructures,” Journal of Microelectromechanical Systems, vol. 6, No. 3, pp. 249-256, Sep. 1997. |
Cho et al., “A Scanning Micromirror Using a Bi-Directionally Movable Magnetic Microactuator,” Proceedings of SPIE, MOEMS and Miniaturized Systems, vol. 4178, pp. 106-115, USA 2000. |
Hamamatsu Photonics K.K., “Position sensitive detectors”, Japan, Feb. 2010. |
Gale, M.T., “Replication Technology for Diffractive Optical Elements”, Proceedings of SPIE, vol. 3010, pp. 111-123, May 15, 1997. |
Kolste et al., “Injection Molding for Diffractive Optics”, Proceedings of SPIE, vol. 2404, pp. 129-131, Feb. 9, 1995. |
Gale et al., “Replicated Microstructures for Integrated Topics”, Proceedings of SPIE, vol. 2513, pp. 2-10, Aug. 29, 1994. |
Jahns et al., “Diffractive Optics and Micro-Optics: Introduction to the Feature Issue”, Applied Optics Journal, vol. 36, No. 20, pp. 4633-4634, Jul. 10, 1997. |
Nikolejeff et al., “Replication of Continuous Relief Diffractive Optical Elements by Conventional Compact Disc Injection-Molding Techniques”, Applied Optics Journal, vol. 36, No. 20, pp. 4655-4659, Jul. 10, 1997. |
Neyer et al., “New Fabrication Technology for Polymer Optical Waveguides”, Integrated Photonics Research, pp. 248-249, year 1992. |
Neyer et al., “Fabrication of Low Loss Polymer Waveguides Using Injection Moulding Technology”, Electronics Letters, vol. 29, No. 4, pp. 399-401, Feb. 18, 1993. |
Optical Society of America, “Diffractive Optics and Micro-Optics”, 1996 Technical Digest Series, vol. 5, Boston, USA, Apr. 29-May 2, 1996. |
Lintec Corporation, “Adwill D-510T Tape”, Japan, Apr. 4, 2006. |
Stark, B., “MEMS Reliability Assurance Guidelines for Space Applications”, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, USA, Jan. 1999. |
Fraunhofer Institute for Photonic Microsystems, “Lamda—Large Aperture MEMS Scanner Module for 3D Distance Measurement”—Data sheet, Dresden, Germany, 2 pages, May 9, 2012. |
International Application # PCT/IB2013/056101 Search Report Dated Dec. 17, 2013. |
Fujita et al., “Dual-Axis MEMS Mirror for Large Deflection-Angle Using SU-8 Soft Torsion Beam,” Sensors and Actuators A: Physical, vol. 121, issue 1, pp. 16-21, May 2005. |
Stone et al., “Performance Analysis of Next-Generation LADAR for Manufacturing, Construction, and Mobility”, National Institute of Standards and Technology, document # NISTIR 7117, Gaithersburg, USA, May 2004. |
U.S. Appl. No. 13/798,251 Office Action dated Nov. 20, 2014. |
International Application PCT/IB2013/051985 Search Report dated Jul. 22, 2013. |
International Application PCT/IB2013/051189 Search Report Dated Jun. 18, 2013. |
Minifaros, “D1.1-ProjectPresentation”, V3.0, 36 pages, Dec. 22, 2010. |
Sandenr et al., “Large Aperture MEMS Segmented Scanner Module for LIDAR Systems”, SPAR Conference—Europe, Amsterdam, 48 pages, Dec. 8, 2010. |
Gerson et al., U.S. Appl. No. 14/599,507, filed Nov. 18, 2014. |
Shpunt et al., U.S. Appl. No. 14/554,086, filed Nov. 26, 2014. |
Shpunt et al., U.S. Appl. No. 14/554,078, filed Nov. 26, 2014. |
Niclass et al., “Design and characterization of a 256×64-pixel single-photon imager in CMOS for a MEMS based laser scanning time-of-flight sensor”, Optics Express, vol. 20, No. 11, pp. 11863-11881, May 21, 2012. |
Hah et al., “Theory and Experiments of Angular Vertical Comb-Drive Actuators for Scanning Micromirrors”, IEEE Journal of Selected Topics in Quantum Electronics, vol. 10, No. 3, pp. 505-513, May/Jun. 2004. |
International Application # PCT/US15/56297 Search Report dated Jan. 19, 2016. |
Sandner et al., “3D imaging using resonant large-aperture MEMS mirror arrays and laser distance measurement”, Optical MEMs and Nanophotonics, IEEE/LEOS International Conference, pp. 78-79, Aug. 11, 2008. |
CN Application # 201380015506.3 Office Action dated Mar. 31, 2016. |
Gerson et al., U.S. Appl. No. 14/941,599, filed Nov. 15, 2015. |
Shpunt et al., U.S. Appl. No. 14/551,104, filed Nov. 24, 2014. |
Erlich et al., U.S. Appl. No. 14/622,942, filed Feb. 16, 2015. |
Yang et al., “Phase synchronization of micro-mirror arrays using elastic linkages”, Sensors and Actuators A, Elsevier Sequoia, vol. 95, No. 1, pp. 55-60, Dec. 15, 2001. |
Gruger et al., “New approach for MEMS scanning mirror for laser projection systems”, SPIE Proceedings, vol. 6887, MOEMS and Miniaturized Systems VII, pp. 68870L-68870L, Feb. 8, 2008. |
International Application # PCT/US2015/67974 Search Report dated May 3, 2016. |
CN Application # 201380015506.3 Office Action dated Aug. 16, 2016. |
U.S. Appl. No. 14/599,507 Office Action dated Oct. 20, 2016. |
U.S. Appl. No. 14/551,104 Office Action dated Nov. 1, 2016. |
International Application # PCT/US2016/45452 Search Report dated Oct. 28, 2016. |
Sandner et al., “Synchronized microscanner array for large aperture receiver optics of LIDAR systems”, Proceedings of SPIE—The International Society for Optical Engineering, vol. 7594, 12 pages, Feb. 17, 2010. |
U.S. Appl. No. 14/554,086 Office Action dated Mar. 10, 2017. |
U.S. Appl. No. 14/599,507 Office Action dated Mar. 8, 2017. |
U.S. Appl. No. 14/554,078 Office Action dated May 31, 2017. |
Number | Date | Country | |
---|---|---|---|
20170090184 A1 | Mar 2017 | US |
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62234686 | Sep 2015 | US |