Claims
- 1. A semiconductor wafer cleaning formulation for use in post plasma ashing semiconductor fabrication comprising the following components in the percentage by weight ranges shown:
- 2. A cleaning formulation as described in claim 1 further including a glycol solvent having a percentage by weight range of 0-5%.
- 3. A cleaning formulation as described in claim 1 further including a chelating agent having a percentage by weight range of 0-17%.
- 4. A cleaning formulation as described in claim 2 further including a chelating agent having a percentage by weight range of 0-17%.
- 5. A cleaning formulation as described in claim 1 wherein said amine is selected from the group consisting of:
Monoethanolamine (MEA) Triethanolamine (TEA)
- 6. A cleaning formulation as described in claim 2 wherein said amine is selected from the group consisting of:
Monoethanolamine (MEA) Triethanolamine (TEA)
- 7. A cleaning formulation as described in claim 3 wherein said amine is selected from the group consisting of:
Monoethanolamine (MEA) Triethanolamine (TEA)
- 8. A cleaning formulation as described in claim 4 wherein said amine is selected from the group consisting of:
Monoethanolamine (MEA) Triethanolamine (TEA)
- 9. A cleaning formulation as described in claim 3 wherein said chelating agent is selected from the group consisting of:
Catechol Lactic acid Acetoacetamide Salicylaldehyde
- 10. A cleaning formulation as described in claim 4 wherein said chelating agent is selected from the group consisting of:
Catechol Lactic acid Acetoacetamide Salicylaldehyde
- 11. A cleaning formulation as described in claim 1 further including one or more of the compounds selected from the group consisting of surfactants, stabilizers, corrosion inhibitors, buffering agents, and cosolvents.
- 12. A cleaning formulation as described in claim 9 comprising:
- 13. A cleaning formulation as described in claim 9 comprising:
- 14. A cleaning formulation as described in claim 9 comprising:
- 15. A cleaning formulation as described in claim 9 comprising:
- 16. A cleaning formulation as described in claim 1 comprising:
- 17. A cleaning formulation as described in claim 5 comprising:
- 18. A cleaning formulation as described in claim 6 comprising:
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a division of U.S. application Ser. No. 09/801,543, filed on Mar. 7, 2001, now pending, which is a continuation of U.S. application Ser. No. 09/312,933 filed on May 17, 1999, now U.S. Pat. No. 6,306,807, which claims priority to U.S. provisional application Serial No. 60/085,879 filed on May 18, 1998.
Provisional Applications (1)
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Number |
Date |
Country |
|
60085879 |
May 1998 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09801543 |
Mar 2001 |
US |
Child |
10179867 |
Jun 2002 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09312933 |
May 1999 |
US |
Child |
09801543 |
Mar 2001 |
US |