Ceramic or glass substrates

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CPC
H01L23/15

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/15Ceramic or glass substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic substrate stacking
- Patent number 12,170,252
- Issue date Dec 17, 2024
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,165,979
- Issue date Dec 10, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a supporting glass substrate
- Patent number 12,119,278
- Issue date Oct 15, 2024
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core substrate and manufacturing method thereof
- Patent number 12,100,632
- Issue date Sep 24, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liners on through glass vias
- Patent number 12,087,623
- Issue date Sep 10, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of wafer bonding
- Patent number 12,080,622
- Issue date Sep 3, 2024
- United Microelectronics Corp.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,185
- Issue date Aug 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Kakoiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method of manufacturing the same
- Patent number 12,068,210
- Issue date Aug 20, 2024
- Toppan Printing Co., Ltd.
- Yuki Umemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for glass substrate and glass substrate
- Patent number 12,068,181
- Issue date Aug 20, 2024
- AGC Inc.
- Yuha Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,068,289
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kenichi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...
- Publication number 20240421465
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20240421059
- Publication date Dec 19, 2024
- TOPPAN Holdings Inc.
- Tsukasa Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS
- Publication number 20240409452
- Publication date Dec 12, 2024
- AGC Inc.
- Rikiya KADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...
- Publication number 20240413050
- Publication date Dec 12, 2024
- Kabushiki Kaisha Toshiba
- Toshihide UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Publication number 20240413237
- Publication date Dec 12, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS INCLUDING A POROUS ELECTRICALLY CONDUCTIVE MATERIAL AND METHOD...
- Publication number 20240413070
- Publication date Dec 12, 2024
- Corning Incorporated
- Sean Matthew Garner
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DISPLAY APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240413141
- Publication date Dec 12, 2024
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Tomoaki ATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240404927
- Publication date Dec 5, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SILICA GLASS SUBSTRATE
- Publication number 20240407089
- Publication date Dec 5, 2024
- AGC Inc.
- Kent SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...
- Publication number 20240395659
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE
- Publication number 20240395784
- Publication date Nov 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Kuei-Hao TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Amplifier System in a Package
- Publication number 20240395645
- Publication date Nov 28, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS-BASED INTEGRATED CIRCUIT PACKAGES FOR COMPOUND MICROELECTRONI...
- Publication number 20240395644
- Publication date Nov 28, 2024
- Corning Incorporated
- Choonkon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240387342
- Publication date Nov 21, 2024
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240379643
- Publication date Nov 14, 2024
- InnoLight Technology (Suzhou) Ltd.
- Zhen-Zhong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240379566
- Publication date Nov 14, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240379513
- Publication date Nov 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A GLASS INTERPOSER
- Publication number 20240371714
- Publication date Nov 7, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT GLASS SUBSTRATE, MULTI-LAYER BODY, METHOD FOR PRODUCING MUL...
- Publication number 20240360027
- Publication date Oct 31, 2024
- NIPPON ELECTRIC GLASSS CO., LTD.
- Miyako TAKEDA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE
- Publication number 20240363480
- Publication date Oct 31, 2024
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic or glass substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic substrate stacking

Packaging substrate and semiconductor apparatus comprising same

Systems and methods for phase switch timing controller for inverter...

Fluidic flow channel over active surface of a die

Semiconductor device and method of forming ultra high density embed...

Hermetic metallized via with improved reliability

Method for forming semiconductor package and semiconductor package

Systems and methods for bidirectional message architecture for inve...

Copper/ceramic joined body and insulating circuit substrate

Bonded body, ceramic copper circuit substrate, and semiconductor de...

DBC substrate for power semiconductor devices, method for fabricati...

Method of manufacturing a supporting glass substrate

Through-substrate via structure and method of manufacture

Through electrode substrate and mounting substrate

Method of manufacturing semiconductor structure

Systems and methods for integrated gate driver for inverter for ele...

Power module

Glass core substrate and manufacturing method thereof

Electrically conductive vias and methods for producing same

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Dielectric liners on through glass vias

Through-hole electrode substrate

Semiconductor structure and method of wafer bonding

Semiconductor device

Package substrate and method of manufacturing the same

Manufacturing method for glass substrate and glass substrate

Power module

Chip package

Devices and methods related to metallization of ceramic substrates...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

GLASS

CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...

WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS

VIAS INCLUDING A POROUS ELECTRICALLY CONDUCTIVE MATERIAL AND METHOD...

DISPLAY APPARATUS AND ELECTRONIC DEVICE

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SILICA GLASS SUBSTRATE

THROUGH-HOLE ELECTRODE SUBSTRATE

CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...

ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE

Power Amplifier System in a Package

GLASS-BASED INTEGRATED CIRCUIT PACKAGES FOR COMPOUND MICROELECTRONI...

CIRCUIT BOARD

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME

OPTICAL MODULE

Hybrid organic and non-organic interposer with embedded component a...

CHIP PACKAGE

CIRCUIT BOARD

CHIP PACKAGE WITH A GLASS INTERPOSER

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SUPPORT GLASS SUBSTRATE, MULTI-LAYER BODY, METHOD FOR PRODUCING MUL...

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

COPPER/CERAMIC BONDED BODY AND INSULATING CIRCUIT SUBSTRATE