Ceramic or glass substrates

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H01L23/15

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/15Ceramic or glass substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and device for providing through-openings in a substrate and...
- Patent number 12,365,051
- Issue date Jul 22, 2025
- LPKF LASER & ELECTRONICS SE
- Robin Alexander Krueger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with glass core having vertical power planes for...
- Patent number 12,368,091
- Issue date Jul 22, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier for die-up fan-out packaging and methods for making t...
- Patent number 12,354,996
- Issue date Jul 8, 2025
- Corning Incorporated
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,923
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimization for raster scanning
- Patent number 12,354,931
- Issue date Jul 8, 2025
- Intel Corporation
- Vinith Bejugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body including titanium alloy at bonding boundary
- Patent number 12,347,744
- Issue date Jul 1, 2025
- Kabushiki Kaisha Toshiba
- Seiichi Suenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,342,471
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, preparation method, and electronic device
- Patent number 12,341,116
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Substrate integrated with passive devices and manufacturing method...
- Patent number 12,322,669
- Issue date Jun 3, 2025
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Chuncheng Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Visual communications
- Patent number 12,312,274
- Issue date May 27, 2025
- Sococo, Inc.
- Eric Cozzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating formation of a via in a substrate
- Patent number 12,293,926
- Issue date May 6, 2025
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,288,742
- Issue date Apr 29, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,264,390
- Issue date Apr 1, 2025
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239511
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226300
- Publication date Jul 10, 2025
- Innolux Corporation
- Po-Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20250218919
- Publication date Jul 3, 2025
- HEFEI SMAT TECHNOLOGY CO. LTD.
- Xiaochun TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...
- Publication number 20250218955
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE
- Publication number 20250218963
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES
- Publication number 20250218898
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210503
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210422
- Publication date Jun 26, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250212538
- Publication date Jun 26, 2025
- Sony Semiconductor Solutions Corporation
- KOUSUKE SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250210531
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE
- Publication number 20250210423
- Publication date Jun 26, 2025
- ABSOLICS INC.
- SeHan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250203751
- Publication date Jun 19, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...
- Publication number 20250201732
- Publication date Jun 19, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE
- Publication number 20250183181
- Publication date Jun 5, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC COMPOSITE
- Publication number 20250178979
- Publication date Jun 5, 2025
- Heraeus Electronics GmbH & Co. KG
- Richard WACKER
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20250174537
- Publication date May 29, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...
- Publication number 20250174567
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MAN...
- Publication number 20250174470
- Publication date May 29, 2025
- Corning Incorporated
- Mandakini Kanungo
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic or glass substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Method and device for providing through-openings in a substrate and...

Package substrate with glass core having vertical power planes for...

Glass carrier for die-up fan-out packaging and methods for making t...

Semiconductor device

Optimization for raster scanning

Bonded body including titanium alloy at bonding boundary

Systems and methods for power module for inverter for electric vehicle

Electronic component and method for manufacturing electronic component

Chip package structure, preparation method, and electronic device

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Die coupling using a substrate with a glass core

Chip package and method of forming the same

Systems and methods for data recorder for inverter for electric veh...

Substrate integrated with passive devices and manufacturing method...

Systems and methods for an interlocking feature on a power module

Visual communications

Power substrate assembly with reduced warpage

Aluminum nitride multilayer power module interposer and method

Facilitating formation of a via in a substrate

Packaging substrate and semiconductor apparatus comprising same

Systems and methods for cooling system and power module for inverte...

Systems and methods for parameter drift correction for inverter for...

Semiconductor device having an integrated device positioned within...

Pure copper material, insulating substrate, and electronic device

Systems and methods for cooling system and power module for inverte...

Selective metallization of integrated circuit packages

Bonded substrate and bonded substrate manufacturing method

Semiconductor device and method of forming micro interconnect struc...

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

ELECTRONIC DEVICE

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD

MICROELECTRONIC STRUCTURES INCLUDING EMBEDDED GLASS PATCH WITH INTE...

DIE AND CONDUCTIVE VIAS EMBEDDED IN A SUBSTRATE

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

RECONSTITUTED PASSIVE WITH MECHANICAL SUPPORT STRUCTURES

SEMICONDUCTOR DEVICE

PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

DISPLAY DEVICE

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

PLATE SHAPED SUBSTRATE AND PACKAGING SUBSTRATE

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF PACKAGING SUBSTRATE

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

METAL-CERAMIC COMPOSITE

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...

METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MAN...