Ceramic or glass substrates

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CPC
H01L23/15

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/15Ceramic or glass substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded packaging structure, preparation method thereof, and termi...
- Patent number 12,205,876
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method for preparing same
- Patent number 12,198,942
- Issue date Jan 14, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic element housing package and electronic apparatus
- Patent number 12,198,992
- Issue date Jan 14, 2025
- Kyocera Corporation
- Masanori Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,183,661
- Issue date Dec 31, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cantilevered dies in ceramic packages
- Patent number 12,176,255
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate stacking
- Patent number 12,170,252
- Issue date Dec 17, 2024
- International Business Machines Corporation
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,165,979
- Issue date Dec 10, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a supporting glass substrate
- Patent number 12,119,278
- Issue date Oct 15, 2024
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and mounting substrate
- Patent number 12,119,293
- Issue date Oct 15, 2024
- Dai Nippon Printing Co., Ltd.
- Shinji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS TRANSISTOR OUTLINE PACKAGE STRUCTURE
- Publication number 20250029881
- Publication date Jan 23, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- HUNG-HSIANG YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
- Publication number 20250014979
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Component Carrier
- Publication number 20250014955
- Publication date Jan 9, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250015062
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME
- Publication number 20250014983
- Publication date Jan 9, 2025
- SAMTEC, INC.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION
- Publication number 20250006614
- Publication date Jan 2, 2025
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...
- Publication number 20250006646
- Publication date Jan 2, 2025
- Intel Corporation
- Xing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Publication number 20250006570
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006610
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006611
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006609
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006613
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...
- Publication number 20250006615
- Publication date Jan 2, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...
- Publication number 20250006568
- Publication date Jan 2, 2025
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FIL...
- Publication number 20250006571
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006612
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...
- Publication number 20250006569
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240429153
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240429150
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Christian MÜLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...
- Publication number 20240421465
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20240421059
- Publication date Dec 19, 2024
- TOPPAN Holdings Inc.
- Tsukasa Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...
- Publication number 20240413050
- Publication date Dec 12, 2024
- Kabushiki Kaisha Toshiba
- Toshihide UENO
- H01 - BASIC ELECTRIC ELEMENTS

Ceramic or glass substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded packaging structure, preparation method thereof, and termi...

Packaging structure and method for preparing same

Packaging substrate and method for manufacturing same

Bonded body, power module substrate, power module, method for manuf...

Systems and methods for non-overlap enforcement for inverter for el...

Electronic element housing package and electronic apparatus

Silicon nitride sintered body, silicon nitride substrate, and silic...

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Systems and methods for single channel fault encoding for inverter...

Method of manufacturing a ceramic structure with metal traces

Through electrode substrate and semiconductor device

Cantilevered dies in ceramic packages

3D chip package based on vertical-through-via connector

Electronic substrate stacking

Packaging substrate and semiconductor apparatus comprising same

Systems and methods for phase switch timing controller for inverter...

Fluidic flow channel over active surface of a die

Semiconductor device and method of forming ultra high density embed...

Hermetic metallized via with improved reliability

Method for forming semiconductor package and semiconductor package

Systems and methods for bidirectional message architecture for inve...

Copper/ceramic joined body and insulating circuit substrate

Bonded body, ceramic copper circuit substrate, and semiconductor de...

DBC substrate for power semiconductor devices, method for fabricati...

Method of manufacturing a supporting glass substrate

Through-substrate via structure and method of manufacture

Through electrode substrate and mounting substrate

Method of manufacturing semiconductor structure

Systems and methods for integrated gate driver for inverter for ele...

Power module

Patents Applicationslast 30 patents

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

WIRELESS TRANSISTOR OUTLINE PACKAGE STRUCTURE

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

POWER MODULE STRUCTURE

THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE

Component Carrier and Method of Manufacturing the Component Carrier

SEMICONDUCTOR PACKAGE

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

INTERVENING LAYERS FOR THRU-VIA SEED METALLIZATION

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVI...

GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRON...

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-...

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FIL...

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS L...

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR PACKAGE

WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR USING S...