Claims
- 1. An electrical connector comprising:
a hollow generally cylindrical post formed from electrically conductive sheet material for engaging a mating connector, the post including a top having a top surface, a generally planar base member extending radially outward from the post, the base member having a generally circular diameter; and at least one standoff located on a bottom surface of the base member for defining a minimum volume of solder below the bottom surface during soldering.
- 2. The connector of claim 1 in which the top surface includes a concave portion.
- 3. The connector of claim 1 further comprising a layer of solder located on the bottom surface of the base member for soldering the electrical connector to a surface.
- 4. The connector of claim 3 in which the layer of solder has a thickness greater than a height of said at least one standoff.
- 5. The connector of claim 3 in which the base member includes a central opening.
- 6. The connector of claim 5 in which the layer of solder is generally annular in shape.
- 7. An electrical connector comprising:
a hollow generally cylindrical post formed from electrically conductive sheet material for engaging a mating connector, the post including a generally planar disk shaped foot portion extending radially outward from the post; and at least one standoff located below the foot portion for defining a minimum volume of solder during soldering.
- 8. The connector of claim 7 further comprising a layer of solder located below the foot portion for soldering the electrical connector to a surface.
- 9. A method of forming an electrical connector comprising:
forming from electrically conductive sheet material, a hollow generally cylindrical post for engaging a mating connector, the post including a top having a top surface; forming a generally planar base member extending radially outward from the post, the base member having a generally circular diameter; and forming at least one standoff located on a bottom surface of the base member for defining a minimum volume of solder below the bottom surface during soldering.
- 10. The method of claim 9 further comprising forming the top surface with a concave portion.
- 11. The method of claim 9 further comprising forming a layer of solder located on the bottom surface of the base member for soldering the electrical connector to a surface.
- 12. The method of claim 11 further comprising forming the layer of solder with a thickness that is greater than a height of said at least one standoff.
- 13. The method of claim 11 further comprising forming a central opening through the base member.
- 14. The method of claim 13 further comprising forming a layer of solder that is generally annular in shape.
- 15. A method of forming an electrical connector comprising:
forming from electrically conductive sheet material, a hollow generally cylindrical post for engaging a mating connector, the post including a generally planar disk shaped foot portion extending radially outward from the post; and locating at least one standoff below the foot portion for defining a minimum volume of solder during soldering.
- 16. The method of claim 15 further comprising forming a layer of solder located below the foot portion for soldering the electrical connector to a surface.
- 17. A method of soldering an electrical connector comprising:
providing the electrical connector with a hollow generally cylindrical post formed from electrically conductive sheet material for engaging a mating connector, the post including a top having a top surface, a generally planar base member extending radially outward from the post, the base member having a generally circular diameter; and defining a minimum volume of solder below a bottom surface of the base member during soldering of the electrical connector to a surface with at least one standoff located on the bottom surface of the base member.
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser. No. 10/445,741, filed May 27, 2003, which is a divisional of U.S. application Ser. No. 10/209,556, filed Jul. 30, 2002, now U.S. Pat. No. 6,599,157, issued Jul. 29, 2003, which is a divisional of application Ser. No. 09/847,861, filed May 2, 2001, now U.S. Pat. No. 6,475,043, issued Nov. 5, 2002, which is a continuation-in-part of application Ser. No. 09/491,135, filed Jan. 26, 2000, now U.S. Pat. No. 6,249,966, issued Jun. 26, 2001, which is a continuation of application Ser. No. 09/199,810, filed Nov. 25, 1998, now U.S. Pat. No. 6,039,616, issued Mar. 21, 2000. The entire teachings of the above applications and patents are incorporated herein by reference.
Divisions (2)
|
Number |
Date |
Country |
Parent |
10209556 |
Jul 2002 |
US |
Child |
10445741 |
May 2003 |
US |
Parent |
09847861 |
May 2001 |
US |
Child |
10209556 |
Jul 2002 |
US |
Continuations (2)
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Number |
Date |
Country |
Parent |
10445741 |
May 2003 |
US |
Child |
10869783 |
Jun 2004 |
US |
Parent |
09199810 |
Nov 1998 |
US |
Child |
09491135 |
Jan 2000 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09491135 |
Jan 2000 |
US |
Child |
09847861 |
May 2001 |
US |