CLEANING METHOD OF SUBSTRATE PROCESSING EQUIPMENT, SUBSTRATE PROCESSING EQUIPMENT, AND RECORDING MEDIUM FOR RECORDING PROGRAM THEREOF

Abstract

A cleaning method of substrate processing equipment includes performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber. Further, in the cleaning method, the cleaning is performed by a kind of the process, based on specific cleaning setting information which is set in advance according to kinds of processes performed in the processing chamber. In addition, a further cleaning method of substrate processing equipment is provided, which includes performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber. Here, the cleaning is performed by a recipe for a kind of the process, based on cleaning recipes which are prepared by kinds of processes performed in the processing chamber and are pre-stored in a setting information memory unit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention will become apparent from the following description of preferred embodiments given with reference to the accompanying drawings, in which:

FIG. 1 is a sectional view of the constitution of a plasma processing device in accordance with a first embodiment of the present invention;

FIG. 2 is a block diagram illustrating a constitutional example of a control unit shown in FIG. 1;

FIG. 3 is a block diagram illustrating a specific example of a process performed in a processing chamber, relating to the first embodiment of the present invention;

FIG. 4 is a view illustrating a specific example of cleaning setting information shown in FIG. 2;

FIG. 5 is a block diagram illustrating the process of the plasma processing device in accordance with the first embodiment of the present invention;

FIG. 6 is a flow chart illustrating a specific example of cleaning, relating to the first embodiment of the present invention;

FIG. 7 is a flow chart illustrating a specific example of cleaning performance contents shown in FIG. 6;

FIG. 8 is a view illustrating a specific example of the cleaning setting information shown in FIG. 2;

FIG. 9 is a block diagram illustrating the processes of a plasma processing device in accordance with a second embodiment of the present invention;

FIG. 10 is a flow chart illustrating a specific example of cleaning, relating to the second embodiment of the present invention; and

FIG. 11 is a flow chart illustrating another specific example of the cleaning, relating to the second embodiment of the present invention.

Claims

1. A cleaning method of substrate processing equipment, comprising: performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber,wherein the cleaning is performed by a kind of the process, based on specific cleaning setting information which is set in advance according to kinds of processes performed in the processing chamber.

2. A cleaning method of substrate processing equipment, comprising: performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber,wherein the cleaning is performed by a recipe for a kind of the process, based on cleaning recipes which are prepared by kinds of processes performed in the processing chamber and are pre-stored in a setting information memory unit.

3. The cleaning method of claim 2, wherein the kinds of processes performed in the processing chamber include at least: a processing process which is performed by transferring a target substrate into the processing chamber; anda processing chamber condition controlling process which is performed by transferring a control substrate into the processing chamber, in order to control a condition of the processing chamber so as to maintain the condition suitable for the processing process, before the processing process is performed.

4. The cleaning method of claim 3, wherein each cleaning recipe includes at least a time for performing the cleaning and an internal temperature of the processing chamber, and when the kind of the process is the processing chamber condition controlling process, the time for performing the cleaning and/or the internal temperature of the processing chamber are set, depending on a required condition of the processing chamber for the processing process.

5. The cleaning method of claim 4, wherein, the time for performing the cleaning, when the kind of the process is the processing chamber condition controlling process, is set to be longer than that when the kind of the process is the processing process.

6. The cleaning method of claim 4, wherein the internal temperature of the processing chamber, when the kind of the process is the processing chamber condition controlling process, is set to be higher than that when the kind of the process is the processing process.

7. A cleaning method of substrate processing equipment, comprising: performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber,wherein the cleaning is performed by timing for a kind of the process, based on cleaning timing which is provided by kinds of processes performed in the processing chamber and is pre-stored in a setting information memory unit.

8. The cleaning method of claim 7, wherein the kinds of processes performed in the processing chamber include at least: a processing process which is performed by transferring a target substrate into the processing chamber; anda processing chamber condition controlling process which is performed by transferring a control substrate into the processing chamber, in order to control a condition of the processing chamber so as to maintain the condition suitable for the processing process, before the processing process is performed,wherein the setting information memory unit individually stores at least cleaning timing by the kinds of the processes.

9. The cleaning method of claim 8, wherein each of the cleaning timing is set based on the number of substrates, and, for the processing chamber condition controlling process, the cleaning is performed only when the processing chamber condition controlling process of the set number of the control substrates is ended; and for the processing process, the cleaning is performed only when the processing process of the set number of the substrates to be processed is ended.

10. A cleaning method of substrate processing equipment, comprising: performing a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber,wherein the cleaning is performed by a recipe and timing for a kind of the specific process, based on cleaning recipes and cleaning timing which are provided by kinds of processes performed in the processing chamber and are pre-stored in a setting information memory unit.

11. A cleaning method of substrate processing equipment, which performs a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber, comprising: including a setting information memory unit which stores cleaning setting information by kinds of processes performed in the processing chamber;determining a kind of the process performed in the processing chamber;obtaining the cleaning setting information for the kind of the process being determined, from the setting information memory unit; andperforming the cleaning for the kind of the process, based on the cleaning setting information being obtained.

12. The cleaning method of claim 2, wherein the cleaning generates plasma in the processing chamber.

13. A substrate processing equipment which performs a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber, comprising: a setting information memory unit which stores cleaning setting information by kinds of processes performed in the processing chamber; anda control unit which, upon cleaning, performs the cleaning for the kind of the process, based on the cleaning setting information being obtained from the setting information memory unit.

14. A substrate processing equipment which performs a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber, comprising: a setting information memory unit which stores cleaning setting information, which is set depending on kinds of processes performed in the processing chamber; anda control unit which, upon cleaning, determines the kind of the process performed in the processing chamber, obtains the cleaning setting information for the kind of the process being determined from the setting information memory unit, and performs the cleaning for the kind of the process, based on the cleaning setting information being obtained.

15. A computer readable recording medium for recording a program to perform a cleaning method of substrate processing equipment which performs a processing chamber cleaning after a specific process is performed on a substrate transferred into the processing chamber, wherein the substrate processing equipment includes a setting information memory unit for storing cleaning setting information by kinds of processes performed in the processing chamber, anda computer stores a program for performing steps of determining a kind of the process performed in the processing chamber; obtaining the cleaning setting information for the kind of the process being determined from the setting information memory unit; and performing the cleaning for the kind of the process, based on the cleaning setting information being obtained.