Claims
- 1. A metallized structure for pin joining, wire bonding, and chip attachment to multilayered ceramic substrates comprising:
- a multilayered structure comprising a glass-ceramic substrate and first and second metallized layers produced by sintering plurality of stacked ceramic green sheets having at least one via therein, said first metallized layer comprising a glass-ceramic/copper composite and said second metallized layer comprising a metal containing nickel; and
- nickel/gold or gold plated on said nickel-containing metal and composite.
- 2. A metallized structure for pin joining, wire bonding, and chip attachment as in claim 1 wherein the coefficient of expansion of the glass-ceramic substrate is 3 ppm/.degree.C., the coefficient of expansion of the first layer of glass-ceramic/copper is about 7 ppm/.degree.C. and the coefficient of expansion of the second layer containing nickel is in the range of 13 to 18 ppm/.degree.C.
- 3. A metallized structure for pin joining, wire bonding, and chip attachment as in claim 1 wherein said nickel-containing metal is nickel.
- 4. A metallized structure for pin joining, wire bond, and chip attachment as in claim 1 wherein said nickel-containing metal is a copper and nickel mixture wherein the volume percent of copper is in the range of 80 to 88% and the volume percent of nickel is in the range of 20 to 12%.
- 5. A metallized structure for pin joining, wire bond, and chip attachment as in claim 4 wherein said nickel-containing metal is composed of 88% by volume of copper and 12% by volume of nickel.
- 6. A metallized structure for pin joining, wire bonding, and chip attachment as in claim 4 wherein said nickel-containing metal is composed of 80% by volume of copper and 20% by volume of nickel.
CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of application Ser. No. 08/360,526 filed Dec. 21, 1994.
US Referenced Citations (18)
Divisions (1)
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Number |
Date |
Country |
Parent |
360526 |
Dec 1994 |
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