Claims
- 1. A ceramic electronic package comprising:
- a glass-ceramic substrate having at least one via; and
- a capture pad on said substrate to contact said via, said capture pad comprising a first composite layer of 50-70 volume percent glass-ceramic material and 30-50 volume percent copper in direct contact with said via followed by a second layer comprising nickel or a copper-nickel alloy.
- 2. The ceramic electronic package recited in claim 1 wherein the coefficient of expansion of the glass-ceramic substrate is 3 ppm/.degree.C., the coefficient of expansion of the first composite layer of glass-ceramic/copper is about 7 ppm/.degree.C. and the coefficient of expansion of the second layer containing nickel is in the range of 13 to 18 ppm/.degree.C.
- 3. The ceramic electronic package recited in claim 1 wherein said second layer is nickel.
- 4. The ceramic electronic package recited in claim 1 wherein said second layer is a copper-nickel alloy.
- 5. The ceramic electronic package recited in claim 4 wherein said copper-nickel alloy is 88% by volume of copper and 12% by volume nickel.
- 6. The ceramic electronic package recited in claim 1 wherein said copper-nickel alloy is 80% by volume of copper and 20% by volume of nickel.
CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of application Ser. No. 08/360,526 filed Dec. 21, 1994 now allowed.
US Referenced Citations (18)
Divisions (1)
|
Number |
Date |
Country |
Parent |
360526 |
Dec 1994 |
|