Claims
- 1. An electronic interconnect device for attachment to an electronic package comprising:
- a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces, said coaxial connector having first and second ends, said first end for attachment to said electronic package; and,
- a socket for mating with said coaxial connector second end comprising a body and inner and outer conductors housed in said body and configured for mating with said coaxial connector such that said inner and outer conductors do not traverse beyond said coaxially cylindrical first end, said inner conductor adapted to be received within said electrically conductive interior surface of said coaxial connector, said inner and outer conductors configured so as to respectively contact said interior and exterior surfaces of said coaxial connector at different times in order to reduce the maximum insertion force of said coaxial connector into said socket.
- 2. An electronic package and interconnect device for attachment to said electronic package comprising:
- a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces, said coaxial connector having first and second ends, said first end for attachment to said electronic package;
- said electronic package including a substrate having coaxial electrical pads attached thereon, said coaxial connector positioned on said pads and attached to said pads on said substrate; and,
- a socket attached to a PC board, said socket comprising a body and inner and outer conductors housed in said body and configured for mating with said coaxial connector such that said inner and outer conductors do not traverse into said substrate, said inner conductor adapted to be received within said electrically conductive interior surface of said coaxial connector, said inner and outer conductors configured so as to respectively contact said interior and exterior surfaces of said coaxial connector at different times in order to reduce the maximum insertion force of said coaxial connector into said socket.
Parent Case Info
This is a continuation of application Ser. No. 08/739,104, filed on Oct. 25, 1996, now U.S. Pat. No. 5,791,911.
US Referenced Citations (17)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2-94693 |
Sep 1988 |
JPX |
Non-Patent Literature Citations (4)
Entry |
"Coaxial Connector", IBM Technical Disclosure Bulletin, vol. 21, No. 10, Mar., 1979. |
"Coaxial Complaint Pin Electrical Connector", IBM Technical Disclosure Bulletin, vol. 32, No. 11, Apr. 1990. |
"Printed Circuit Net Repair Utilizing A Coaxial Cable-To-Board Pin Connection", IBM Technical Disclosure Bulletin, vol. 33, No. 1B, Jun. 1990. |
"Ceramic Ball Grid Array Packaging", Advanced Microelectronics, Jan./Feb. 1995. |
Continuations (1)
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Number |
Date |
Country |
Parent |
739104 |
Oct 1996 |
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