Claims
- 1. A method of connecting a semiconductor body to a support, said method comprising forming at least one projecting part, projecting from the surface of the semiconductor body to face the support, providing a deformable metal layer between the surface of the semiconductor body provided with the projection and the support and then pressing the support and the semiconductor body under pressure at an elevated temperature in a manner such that the projecting part is pressed into the metal layer.
- 2. A method of connecting a semiconductor body to a support, said method comprising forming, by etching, at least one projecting part, projecting from the surface of the semiconductor body to face the support, providing a deformable metal layer between the surface of the semiconductor body provided with the projection and the support and then pressing the support and the semiconductor body under pressure at an elevated temperature in a manner such that the projecting part is pressed into the metal layer.
- 3. A method of connecting a semiconductor body to a support, said method comprising forming at least one projecting part, projecting from the surface of the semiconductor body to face the support, coating said projecting part with aluminum, providing a deformable metal layer between the surface of the semiconductor body provided with the projection and the support and then pressing the support and the semiconductor body under pressure at an elevated temperature in a manner such that the projecting part is pressed into the metal layer.
Priority Claims (1)
Number |
Date |
Country |
Kind |
8800901 |
Apr 1988 |
NLX |
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Parent Case Info
This is a division of application Ser. No. 334,063, filed Apr. 4, 1989, now U.S. Pat. No. 4,929,999.
US Referenced Citations (6)
Divisions (1)
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Number |
Date |
Country |
Parent |
334063 |
Apr 1989 |
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