Number | Name | Date | Kind |
---|---|---|---|
RE31967 | Burns | Aug 1985 | |
3645785 | Hentzschel | Feb 1972 | |
4301188 | Niehaus | Nov 1981 | |
4498121 | Breedis et al. | Feb 1985 | |
4707724 | Suzuki et al. | Nov 1987 | |
4717591 | Acosta et al. | Jan 1988 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 18, No. 15, 10-75, "Depositing Adhesion Layers for Contact Between Noble Metals and Dielectric Material", by Romankiw. |