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H01L23/49866

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49866characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 12,154,885
- Issue date Nov 26, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray shielding structure for a chip
- Patent number 12,142,556
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and manufacturing method thereof
- Patent number 12,107,036
- Issue date Oct 1, 2024
- INNOLUX CORPORATION
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and chip package including same
- Patent number 12,080,654
- Issue date Sep 3, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 12,068,236
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 12,057,418
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,046,544
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 12,027,454
- Issue date Jul 2, 2024
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,027,456
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE
- Publication number 20250105114
- Publication date Mar 27, 2025
- Intel Corporation
- Alexander W. HUETTIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20250105237
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Chung-Min Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096099
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- JAESUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096175
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YISEUL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...
- Publication number 20250087576
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Substrates for Large, High Performance Power Packages
- Publication number 20250087566
- Publication date Mar 13, 2025
- Google LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079287
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250079290
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20250070009
- Publication date Feb 27, 2025
- Medtronic, Inc.
- Caian Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...
- Publication number 20250070003
- Publication date Feb 27, 2025
- TOPPAN Holdings Inc.
- Kenta SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20250069994
- Publication date Feb 27, 2025
- Kabushiki Kaisha Toshiba
- Akito SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
- Publication number 20250070008
- Publication date Feb 27, 2025
- Medtronic, Inc.
- Caian Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250062209
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062213
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyuho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250054847
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...
- Publication number 20250046695
- Publication date Feb 6, 2025
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Wolfgang REINERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE
- Publication number 20250046696
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Arya BHATTACHERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20250046722
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029932
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Yu Lim CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRU...
- Publication number 20250029912
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Shanshan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029906
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyounglim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...
- Publication number 20250022789
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...
- Publication number 20250014980
- Publication date Jan 9, 2025
- Intel Corporation
- Eric ERIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME
- Publication number 20250014983
- Publication date Jan 9, 2025
- SAMTEC, INC.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006610
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to enable 30 microns pitch EMIB or below

Semiconductor device and method of forming micro interconnect struc...

Magnetic inductor device and method

Method of manufacturing semiconductor device

Semiconductor package having multiple substrates

Heterogeneous annealing method and device

Silicon nitride circuit board and electronic component module

Method of manufacturing a ceramic structure with metal traces

Semiconductor package and methods of manufacturing

Method and structure for die bonding using energy beam

Split substrate interposer with integrated passive device

Power amplifier modules including semiconductor resistor and tantal...

X-ray shielding structure for a chip

Multi-chip package

Hermetic metallized via with improved reliability

Chip package structure with nickel layer

Through-substrate via structure and method of manufacture

Redistribution layer structure and manufacturing method thereof

Electrically conductive vias and methods for producing same

Package core assembly and fabrication methods

Flexible circuit board and chip package including same

Integrated circuit package with serpentine conductor and method of...

Electronic module

Semiconductor device having via sidewall adhesion with encapsulant

Passivation structure with increased thickness for metal pads

Reconstituted substrate for radio frequency applications

Semiconductor package device with integrated inductor and manufactu...

Semiconductor device

Packaging substrate having electric power transmitting elements on...

Semiconductor structure and manufacturing method thereof

Patents Applicationslast 30 patents

N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...

Advanced Substrates for Large, High Performance Power Packages

SEMICONDUCTOR PACKAGES

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...

CERAMIC CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME

ELECTRICAL COMPONENT AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

WIRING BOARD AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...

SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

POWER MODULE STRUCTURE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH STRESS BUFFER PADS AND METHODS...

INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL...

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...