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H01L23/49866

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49866characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication process, and electronic device
- Patent number RE50431
- Issue date May 13, 2025
- Sony Group Corporation
- Masaya Nagata
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flip chip and chip packaging structure
- Patent number 12,293,962
- Issue date May 6, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,283,540
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal mismatch reduction in semiconductor device modules
- Patent number 12,272,615
- Issue date Apr 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,272,631
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,264,390
- Issue date Apr 1, 2025
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 12,154,885
- Issue date Nov 26, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray shielding structure for a chip
- Patent number 12,142,556
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and manufacturing method thereof
- Patent number 12,107,036
- Issue date Oct 1, 2024
- INNOLUX CORPORATION
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183146
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250174545
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174593
- Publication date May 29, 2025
- Kabushiki Kaisha Toshiba
- Satoshi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250167088
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gye Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167093
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- DOHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250167095
- Publication date May 22, 2025
- AUO Corporation
- Cheng-He RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250167099
- Publication date May 22, 2025
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157913
- Publication date May 15, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR
- Publication number 20250157902
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149426
- Publication date May 8, 2025
- Unimicron Technology Corp.
- An-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20250149510
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW Z-HEIGHT SEPARABLE LIQUID METAL BASED ELECTRICAL INTERCONNECT
- Publication number 20250149414
- Publication date May 8, 2025
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250140664
- Publication date May 1, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140733
- Publication date May 1, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20250132221
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Dai-Fei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Publication number 20250125234
- Publication date Apr 17, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER STRUCTURE
- Publication number 20250125243
- Publication date Apr 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL SYSTEM-IN-PACKAGE MODULE WITH EMBEDDED DIE AND REDISTRIB...
- Publication number 20250118648
- Publication date Apr 10, 2025
- Qorvo US, Inc.
- Charles E. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Publication number 20250112127
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20250109463
- Publication date Apr 3, 2025
- MITSUBISHI MATERIALS CORPORATION
- Yuki ITO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring base and electronic device

Semiconductor device package

Electronic device

Aluminum nitride multilayer power module interposer and method

Semiconductor device, fabrication process, and electronic device

Conductive structure including copper-phosphorous alloy and a metho...

Flip chip and chip packaging structure

Semiconductor device, method of manufacturing semiconductor device,...

Thermal mismatch reduction in semiconductor device modules

Semiconductor package having multiple substrates

Pure copper material, insulating substrate, and electronic device

Method to enable 30 microns pitch EMIB or below

Semiconductor device and method of forming micro interconnect struc...

Magnetic inductor device and method

Method of manufacturing semiconductor device

Semiconductor package having multiple substrates

Heterogeneous annealing method and device

Silicon nitride circuit board and electronic component module

Method of manufacturing a ceramic structure with metal traces

Semiconductor package and methods of manufacturing

Method and structure for die bonding using energy beam

Split substrate interposer with integrated passive device

Power amplifier modules including semiconductor resistor and tantal...

X-ray shielding structure for a chip

Multi-chip package

Hermetic metallized via with improved reliability

Chip package structure with nickel layer

Through-substrate via structure and method of manufacture

Redistribution layer structure and manufacturing method thereof

Electrically conductive vias and methods for producing same

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

HETEROGENEOUS ANNEALING METHOD AND DEVICE

LOW Z-HEIGHT SEPARABLE LIQUID METAL BASED ELECTRICAL INTERCONNECT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE

INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING

CHIP CARRIER STRUCTURE

POWER MODULE AND MANUFACTURING METHOD THEREFOR

MULTILEVEL SYSTEM-IN-PACKAGE MODULE WITH EMBEDDED DIE AND REDISTRIB...

IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES

WIRING BOARD AND SEMICONDUCTOR DEVICE

PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE