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H01L23/49866

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49866characterised by the materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method for manufacturing an electronic package
- Patent number 12,362,267
- Issue date Jul 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including package substrate with elongated solder...
- Patent number 12,362,268
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a nickel comprising layer and method for...
- Patent number 12,354,936
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Oliver Schilling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a packaging substrate
- Patent number 12,354,884
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package substrate structure and method therefor
- Patent number 12,341,089
- Issue date Jun 24, 2025
- NXP USA, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride multilayer power module interposer and method
- Patent number 12,300,578
- Issue date May 13, 2025
- TriPent Power LLC
- Stephen P. Nootens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication process, and electronic device
- Patent number RE50431
- Issue date May 13, 2025
- Sony Group Corporation
- Masaya Nagata
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flip chip and chip packaging structure
- Patent number 12,293,962
- Issue date May 6, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,283,540
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal mismatch reduction in semiconductor device modules
- Patent number 12,272,615
- Issue date Apr 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,272,631
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,264,390
- Issue date Apr 1, 2025
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- Tobias Schaedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,165,980
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 12,154,885
- Issue date Nov 26, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
- Publication number 20250239514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cong-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250226305
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
- Publication number 20250226284
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250226299
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- TAE OH HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250218916
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20250218923
- Publication date Jul 3, 2025
- Rohm Co., Ltd.
- Bin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...
- Publication number 20250218678
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250220810
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE
- Publication number 20250210492
- Publication date Jun 26, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qipeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250210530
- Publication date Jun 26, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183146
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250174545
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174593
- Publication date May 29, 2025
- Kabushiki Kaisha Toshiba
- Satoshi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250167088
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gye Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167093
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- DOHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250167095
- Publication date May 22, 2025
- AUO Corporation
- Cheng-He RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250167099
- Publication date May 22, 2025
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and method for manufacturing an electronic package

Package assembly including package substrate with elongated solder...

Semiconductor device with a nickel comprising layer and method for...

Reconstituted substrate structure and fabrication methods for heter...

Method for making a packaging substrate

Packaging of three-dimensional integrated circuit by encapsulation...

Device package substrate structure and method therefor

Wiring base and electronic device

Semiconductor device package

Electronic device

Aluminum nitride multilayer power module interposer and method

Semiconductor device, fabrication process, and electronic device

Conductive structure including copper-phosphorous alloy and a metho...

Flip chip and chip packaging structure

Semiconductor device, method of manufacturing semiconductor device,...

Thermal mismatch reduction in semiconductor device modules

Semiconductor package having multiple substrates

Pure copper material, insulating substrate, and electronic device

Method to enable 30 microns pitch EMIB or below

Semiconductor device and method of forming micro interconnect struc...

Magnetic inductor device and method

Method of manufacturing semiconductor device

Semiconductor package having multiple substrates

Heterogeneous annealing method and device

Silicon nitride circuit board and electronic component module

Method of manufacturing a ceramic structure with metal traces

Semiconductor package and methods of manufacturing

Method and structure for die bonding using energy beam

Split substrate interposer with integrated passive device

Power amplifier modules including semiconductor resistor and tantal...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES

ELECTRONIC DEVICE

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...

CIRCUIT BOARD

POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE

ELECTRONIC COMPONENT

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF