Number | Name | Date | Kind |
---|---|---|---|
3346689 | Parstorfer | Oct 1967 | |
4095866 | Merrill | Jun 1978 | |
4320438 | Ibrahim et al. | Mar 1982 | |
4665468 | Dohya | May 1987 | |
5110654 | Yokokawa | May 1992 | |
5136238 | Kade | Aug 1992 | |
5155652 | Logan et al. | Oct 1992 | |
5191506 | Logan et al. | Mar 1993 | |
5450290 | Boyko et al. | Sep 1995 | |
5730803 | Steger et al. | Mar 1998 | |
5886863 | Nagasaki et al. | Mar 1999 |
Number | Date | Country |
---|---|---|
2649829 | Jan 1991 | FR |
0753875 | Aug 1956 | GB |
1138673 | Jan 1969 | GB |
60-083356 | Sep 1985 | JP |
62-286249 | Dec 1987 | JP |
1-207992 | Aug 1989 | JP |
3-163849 | Jul 1991 | JP |
Entry |
---|
R. Cechanek, Multilayer Printed-Circuit Boards, IBM Technical Disclosure Bulletin, vol. 20 No. 11B, Apr. 1978, pp 4726-4727. |