Via connections through the substrates

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H01L23/49827

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49827Via connections through the substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with antennas
- Patent number 12,362,297
- Issue date Jul 15, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor device...
- Patent number 12,362,248
- Issue date Jul 15, 2025
- Goki Toshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,362,263
- Issue date Jul 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
- Patent number 12,362,255
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar magnetic radial inductors to enable VR disaggregation
- Patent number 12,362,295
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including stepped surfaces and methods of forming the same
- Patent number 12,362,246
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device and integrated passive device comprising magnetic...
- Patent number 12,354,948
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,354,924
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 12,354,962
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a packaging substrate
- Patent number 12,354,884
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with decoupling capacitors
- Patent number 12,347,816
- Issue date Jul 1, 2025
- NVIDIA Corporation
- Naly Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with an alignment moat
- Patent number 12,347,713
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Andrew D. Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic planar spiral and high aspect ratio inductors for power de...
- Patent number 12,347,761
- Issue date Jul 1, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for through interposer die level interconnect...
- Patent number 12,347,762
- Issue date Jul 1, 2025
- Rockwell Collin Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having vertical routing to bond pads
- Patent number 12,349,475
- Issue date Jul 1, 2025
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrates having signal shielding for use with semiconductor...
- Patent number 12,347,788
- Issue date Jul 1, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,077
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,341,087
- Issue date Jun 24, 2025
- Kioxia Corporation
- Takuya Okishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,341,072
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,341,076
- Issue date Jun 24, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio vias filled with liquid metal fill
- Patent number 12,336,112
- Issue date Jun 17, 2025
- Samtec, Inc.
- Christopher David Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, and fabrication and packaging methods thereof
- Patent number 12,334,361
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interposer
- Publication number 20250233062
- Publication date Jul 17, 2025
- TE Connecitivity Japan G. K.
- Shinichi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...
- Publication number 20250233060
- Publication date Jul 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233112
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HsiaoYun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER
- Publication number 20250233036
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY
- Publication number 20250233044
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer
- Publication number 20250233061
- Publication date Jul 17, 2025
- TE Connectivity Japan G.K.
- Shinichi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT
- Publication number 20250233064
- Publication date Jul 17, 2025
- MURATA MANUFACTURING CO., LTD.
- Tomoyuki ASHIMINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226306
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
- Publication number 20250219002
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS
- Publication number 20250218909
- Publication date Jul 3, 2025
- Intel Corporation
- Donald Tiendung TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250218918
- Publication date Jul 3, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LDMOS EDGE TERMINATION FOR IMPROVED SAFE OPERATING AREA
- Publication number 20250220953
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jingjing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250216614
- Publication date Jul 3, 2025
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250218772
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JOHNNY CHIAHAO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...
- Publication number 20250218678
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210489
- Publication date Jun 26, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE
- Publication number 20250210268
- Publication date Jun 26, 2025
- Intel Corporation
- Srinivasan RAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250210571
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210501
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250210488
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE
- Publication number 20250212426
- Publication date Jun 26, 2025
- UNITED MICROELECTRONICS CORP.
- Tai-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250210553
- Publication date Jun 26, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE
- Publication number 20250210425
- Publication date Jun 26, 2025
- Nitto Denko Corporation
- Takahiro IKEDA
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with antennas

Method for manufacturing semiconductor device, semiconductor device...

Electronic package and method of fabricating the same

Method for fabricating a chip package

Apparatus including direct-contact heat paths and methods of manufa...

Planar magnetic radial inductors to enable VR disaggregation

Interposer including stepped surfaces and methods of forming the same

Component-incorporated substrate and method for manufacturing same

Integrated device and integrated passive device comprising magnetic...

Integrated circuit package and method

Standard cell layout for better routability

Reconstituted substrate structure and fabrication methods for heter...

Method for making a packaging substrate

Electronic package, electronic structure and manufacturing method t...

Integrated circuit package with decoupling capacitors

Semiconductor apparatus with an alignment moat

Magnetic planar spiral and high aspect ratio inductors for power de...

Method and apparatus for through interposer die level interconnect...

Packaging of three-dimensional integrated circuit by encapsulation...

Integrated circuit having vertical routing to bond pads

Glass substrates having signal shielding for use with semiconductor...

Semiconductor circuit structure with direct die heat removal structure

Semiconductor device and manufacturing method thereof

Semiconductor package and semiconductor device

Manufacturing method of semiconductor package

Semiconductor circuit structure with direct die heat removal structure

High aspect ratio vias filled with liquid metal fill

Substrate structure, and fabrication and packaging methods thereof

Semiconductor device and manufacturing method thereof

3D system integration

Patents Applicationslast 30 patents

Interposer

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE WITH GLASS SUBSTRATE AND PACKAGING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER

MEMORY DEVICE WITH ENHANCED THERMAL CONDUCTIVITY

Interposer

INTEGRATED CAPACITOR SHEET, INTERPOSER, AND SEMICONDUCTOR ELEMENT

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRONIC DEVICE

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...

ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS

ELECTRONIC DEVICE

LDMOS EDGE TERMINATION FOR IMPROVED SAFE OPERATING AREA

WIRING SUBSTRATE

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

Technologies for Components Embedded in a Substrate Core

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD

METAL-INSULATOR-METAL CAPACITOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

METAL CORE SUBSTRATE AND METHOD OF PRODUCING THE METAL CORE SUBSTRATE