Via connections through the substrates

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H01L23/49827

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49827Via connections through the substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,261,164
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including redistribution substrate and method...
- Patent number 12,261,107
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Moongil Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold shelf package design and process flow for advanced package arc...
- Patent number 12,261,150
- Issue date Mar 25, 2025
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 12,261,181
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 12,253,558
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standardized commodity programmable logic semi...
- Patent number 12,255,195
- Issue date Mar 18, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with gap-fill structures and the method of manufacturing the same
- Patent number 12,249,566
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,243,741
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Johnny Chiahao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with CTE matching barrier ring around microvias
- Patent number 12,243,835
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,238,940
- Issue date Feb 25, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,237,238
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,241
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBST...
- Publication number 20250105120
- Publication date Mar 27, 2025
- Innolux Corporation
- Po-Yun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20250105121
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Mihoko MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105231
- Publication date Mar 27, 2025
- Samsung Electronics Co., LTD
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250105232
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Youngbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20250105122
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE CARRIER WITH EMBEDDED ELECTRONIC COMPONENT ELECTRICALLY CO...
- Publication number 20250105129
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Urban MEDIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS
- Publication number 20250104911
- Publication date Mar 27, 2025
- Intel Corporation
- Jaeil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20250105079
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Publication number 20250105119
- Publication date Mar 27, 2025
- Intel Corporation
- Yuqin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096214
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096105
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096109
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250096176
- Publication date Mar 20, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Publication number 20250096053
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250096097
- Publication date Mar 20, 2025
- Hana Micron Inc.
- Jae-Sung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096104
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION
- Publication number 20250096093
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087571
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087603
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING VIAS
- Publication number 20250087569
- Publication date Mar 13, 2025
- SAMTEC, INC.
- Thomas Jacob HAMMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250087570
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Providing Shielding Between Inductors Using Guard Rings
- Publication number 20250087577
- Publication date Mar 13, 2025
- Altera Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...
- Publication number 20250079278
- Publication date Mar 6, 2025
- Intel Corporation
- Karumbu Nathan Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including redistribution substrate and method...

Application of conductive via or trench for intra module EMI shielding

Mold shelf package design and process flow for advanced package arc...

Semiconductor package including image sensor chip, transparent subs...

Selective metallization of integrated circuit packages

Circuit test structure and method of using

Secure semiconductor integration and method for making thereof

Package-on-package type semiconductor package

Chip package structure

Logic drive based on standardized commodity programmable logic semi...

Integrated structure with bifunctional routing and assembly compris...

3DIC with gap-fill structures and the method of manufacturing the same

Semiconductor device including penetration via structure

Semiconductor device with electromagnetic interference film and met...

Semiconductor device with open cavity and method therefor

Semiconductor structure and method for forming the same

Interconnect structure having conductor extending along dielectric...

Alternative surfaces for conductive pad layers of silicon bridges f...

Package substrate with CTE matching barrier ring around microvias

Semiconductor package

Connection structure and method of forming the same

Waferscale physiological characteristic sensor package with integra...

Deep trench capacitors embedded in package substrate

Package structure and method

Semiconductor package

Devices and methods related to radio-frequency filters on silicon-o...

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor die package and method of manufacture

Electronics assemblies employing copper in multiple locations

Patents Applicationslast 30 patents

NANOTWIN LINER FOR THROUGH GLASS VIAS

MANUFACTURING METHOD OF ELECTRONIC DEVICE HAVING THROUGH-HOLE SUBST...

SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE MANUF...

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

SEMICONDUCTOR PACKAGE

PHOTONIC IC CHIP, OPTICAL DEVICE AND SEMICONDUCTOR PACKAGE

SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...

LAMINATE CARRIER WITH EMBEDDED ELECTRONIC COMPONENT ELECTRICALLY CO...

COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR

PACKAGING STRUCTURE AND PACKAGING METHOD

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

FILLING MATERIALS AND METHODS OF FILLING VIAS

LOW STRESS THROUGH GLASS VIAS (TGVS)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

Techniques For Providing Shielding Between Inductors Using Guard Rings

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND...