Via connections through the substrates

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H01L23/49827

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49827Via connections through the substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Through mold via frame
- Patent number 12,308,307
- Issue date May 20, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
- Patent number 12,308,252
- Issue date May 20, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,308,343
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor element, module, and semiconductor composite device
- Patent number 12,308,181
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Akitomo Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with controllable standoff
- Patent number 12,300,592
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package with via structure and method of formation thereof
- Patent number 12,300,874
- Issue date May 13, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 12,300,594
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication process, and electronic device
- Patent number RE50431
- Issue date May 13, 2025
- Sony Group Corporation
- Masaya Nagata
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,300,593
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip and chip packaging structure
- Patent number 12,293,962
- Issue date May 6, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating formation of a via in a substrate
- Patent number 12,293,926
- Issue date May 6, 2025
- MOSAIC MICROSYSTEMS LLC
- Shelby Forrester Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 12,292,455
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,293,950
- Issue date May 6, 2025
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock circuit in a processor integrated circuit
- Patent number 12,287,665
- Issue date Apr 29, 2025
- Huawei Technologies Co., Ltd.
- Wen Yin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 12,288,744
- Issue date Apr 29, 2025
- Intel Corporation
- Ji Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 12,272,672
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 12,274,079
- Issue date Apr 8, 2025
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,272,631
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,164
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor chip, transparent subs...
- Patent number 12,261,181
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woonbae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250167088
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gye Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE
- Publication number 20250167192
- Publication date May 22, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING CIRCUIT TEST STRUCTURE
- Publication number 20250164548
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167090
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND INTERPOSER
- Publication number 20250167091
- Publication date May 22, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250167061
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250167089
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20250157969
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250160031
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157947
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INVERTED MEMORY-LOGIC STACK
- Publication number 20250157987
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20250157905
- Publication date May 15, 2025
- NGK Insulators, Ltd.
- Yoshitsugu WAKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...
- Publication number 20250158007
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE ON INTERPOSER PACKAGES
- Publication number 20250149462
- Publication date May 8, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250149529
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...
- Publication number 20250149420
- Publication date May 8, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...
- Publication number 20250149427
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yueh Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE
- Publication number 20250149521
- Publication date May 8, 2025
- MaxLinear, Inc.
- Abdelkrim El Amili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149392
- Publication date May 8, 2025
- Unimicron Technology Corp.
- Chia Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...
- Publication number 20250147251
- Publication date May 8, 2025
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR GROUND FENCING
- Publication number 20250149782
- Publication date May 8, 2025
- Apple Inc.
- Xiaofang Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...
- Publication number 20250149416
- Publication date May 8, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Through mold via frame

Interposer, manufacturing method therefor, and circuit board assembly

Semiconductor device and method of forming the same

Capacitor element, module, and semiconductor composite device

Devices with conductive or magnetic nanowires for localized heating...

Fan-out package with controllable standoff

Connector and method for forming the same

Antenna package with via structure and method of formation thereof

Fan-out semiconductor package and electronic device including the same

Semiconductor device, fabrication process, and electronic device

Semiconductor device and method of manufacture

Conductive structure including copper-phosphorous alloy and a metho...

Integrated circuit package and method of forming same

Flip chip and chip packaging structure

Method for forming chip packages and a chip package

Semiconductor packages and methods of forming same

3D chip sharing data bus

Facilitating formation of a via in a substrate

Chip socket, testing fixture and chip testing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Clock circuit in a processor integrated circuit

Microelectronic assemblies having conductive structures with differ...

Semiconductor packages

High density interconnection using fanout interposer chiplet

Semiconductor device with hollow interconnectors

Deep trench capacitors embedded in package substrate

Semiconductor package having multiple substrates

Method for forming a semiconductor device including forming a first...

Semiconductor package

Semiconductor package including image sensor chip, transparent subs...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE

METHOD OF USING CIRCUIT TEST STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

CORE SUBSTRATE AND INTERPOSER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

PACKAGE STRUCTURES

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

HYBRID BONDED INVERTED MEMORY-LOGIC STACK

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

EMBEDDED DIE ON INTERPOSER PACKAGES

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

EMBEDDED PASSIVE DEVICES FOR INTEGRATED CIRCUITS AND METHODS OF FOR...

DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...

SYSTEM AND METHOD FOR GROUND FENCING

SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...