Via connections through the substrates

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H01L23/49827

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49827Via connections through the substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 12,230,661
- Issue date Feb 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for ground fencing
- Patent number 12,230,879
- Issue date Feb 18, 2025
- Apple Inc.
- Xiaofang Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for heat dissipation of semiconductor devices
- Patent number 12,230,550
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- S. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,598
- Issue date Feb 18, 2025
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making electrodes and providing electrical connections...
- Patent number 12,222,308
- Issue date Feb 11, 2025
- Corning Incorporated
- Shrisudersan Jayaraman
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package including a dualized signal wiring structure
- Patent number 12,224,260
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Heejung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 12,218,043
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,218,034
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via plug resistor
- Patent number 12,218,042
- Issue date Feb 4, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,218,099
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jungsoo Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multiple substrates
- Patent number 12,211,779
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,211,816
- Issue date Jan 28, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kuk Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 12,210,199
- Issue date Jan 28, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and printed circuit board attachment
- Patent number 12,205,859
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices using microchannels for interconnections
- Patent number 12,205,882
- Issue date Jan 21, 2025
- 3M Innovative Properties Company
- Kayla C. Niccum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging structure, preparation method thereof, and termi...
- Patent number 12,205,876
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO REDUCE CRACKING IN GLASS CORES
- Publication number 20250062207
- Publication date Feb 20, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CIRCUIT MOUNTING FILM
- Publication number 20250062211
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- JAE-MIN JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED THROUGH SUBSTRATE VIA STRUCTURES FOR A SILICON INTERCONNEC...
- Publication number 20250062205
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Ming Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Publication number 20250062206
- Publication date Feb 20, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062204
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062248
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250054849
- Publication date Feb 13, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CORE MODULE
- Publication number 20250054850
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20250054773
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES
- Publication number 20250054823
- Publication date Feb 13, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...
- Publication number 20250054851
- Publication date Feb 13, 2025
- TSINGHUA UNIVERSITY
- Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)
- Publication number 20250054881
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...
- Publication number 20250046695
- Publication date Feb 6, 2025
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Wolfgang REINERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMAPPING LAYERS FOR PHOTONIC INTERPOSERS
- Publication number 20250046775
- Publication date Feb 6, 2025
- Lightmatter, Inc
- Chian-min Richard Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20250046680
- Publication date Feb 6, 2025
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250046721
- Publication date Feb 6, 2025
- Samsung Electronics Co.,Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF
- Publication number 20250046690
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20250046722
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing Substrates with Cavities for Component Stacking
- Publication number 20250046689
- Publication date Feb 6, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038090
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250040190
- Publication date Jan 30, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250038145
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Tzu-Jui FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
- Publication number 20250037923
- Publication date Jan 30, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS

Via connections through the substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronics assemblies employing copper in multiple locations

Electronic device package and fabricating method thereof

System and method for ground fencing

Structures and methods for heat dissipation of semiconductor devices

Embedded die on interposer packages

Semiconductor device and method of forming micro interconnect struc...

Semiconductor package

Semiconductor circuit structure with direct die heat removal structure

Magnetic inductor device and method

Chip interconnecting method, interconnect device and method for for...

Methods for making electrodes and providing electrical connections...

Semiconductor package including a dualized signal wiring structure

Package and method of forming same

Semiconductor package and method of manufacturing semiconductor pac...

Interposer, semiconductor package including the same, and method of...

Semiconductor structure and method for manufacturing semiconductor...

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Via plug resistor

EMIB architecture with dedicated metal layers for improving power d...

Substrate, electronic device, and method for manufacturing substrate

Interposer and semiconductor package including the same

Stiffener package and method of fabricating stiffener package

Semiconductor package having multiple substrates

Printed circuit board and electronic component package including th...

Integration of power and optics through cold plates for delivery to...

Package and printed circuit board attachment

Methods and devices using microchannels for interconnections

Embedded packaging structure, preparation method thereof, and termi...

Semiconductor device and a manufacturing method thereof

Multi-die package structures including redistribution layers

Patents Applicationslast 30 patents

METHODS AND APPARATUS TO REDUCE CRACKING IN GLASS CORES

DRIVING CIRCUIT MOUNTING FILM

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SHIELDED THROUGH SUBSTRATE VIA STRUCTURES FOR A SILICON INTERCONNEC...

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE

PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE HAVING A CORE MODULE

FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...

METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES

Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY OF THROUGH-SILICON VIAS (TSV)

METHOD FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE CHANNEL STRUCTU...

REMAPPING LAYERS FOR PHOTONIC INTERPOSERS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING

Routing Substrates with Cavities for Component Stacking

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER