Core board comprising nickel layer, multilayer board and manufacturing method thereof

Abstract

The present invention provides a core board and a manufacturing method thereof, in which the core board includes a nickel layer as a seed layer to improve the binding strength between an insulation layer and a conductive layer, so that it allows forming fine inner circuits by the semi-additive method.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are cross-sectional views of a core board according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a multilayer board according to an embodiment of the present invention.

FIG. 4 is a flow diagram illustrating a process of manufacturing a core board according to an embodiment of the present invention.

FIG. 5 is a flow diagram illustrating a process of manufacturing a multilayer board according to an embodiment of the present invention.

FIGS. 6 to 8 represent results of peel strength(binding strength) tests according to embodiments of the present invention and according to comparison examples.

Claims

1. A core board comprising: a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; anda first nickel layer stacked on at least one surface of the core insulation layer.

2. The core board of claim 1, wherein the core insulation layer includes a reinforcement material of glass fiber.

3. The core board of claim 1, wherein the first nickel layer has a thickness of 0.3-2 μm.

4. The core board of claim 1, wherein the first nickel layer is added by 5-15 parts by weight with respect to 100 parts by weight of the total layers.

5. The core board of claim 1, wherein the binding strength between the core insulation layer and the first nickel layer is in the range of from 0.7 to 0.9 kgf/cm.

6. The core board of claim 1, further comprising a first copper layer stacked on the first nickel layer.

7. A multilayer board comprising a core board on which inner circuits are formed according to wiring patterns;a first insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins, on the core board;a second nickel layer stacked on the first insulation layer according to the wiring patterns; anda second copper layer stacked on the second nickel layer.

8. The multilayer board of claim 7, wherein the core board comprises: a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins;a first nickel layer stacked on at least one surface of the core insulation layer according to the wiring patterns; anda first copper layer stacked on the first nickel layer.

9. The multilayer board of claim 8, wherein a wiring distance between the first nickel layer and the first copper layer is 10-20 μm.

10. The multilayer board of claim 7, wherein the second nickel layer has a thickness of 0.3-2 μm.

11. The multilayer board of claim 7, wherein the second nickel layer is added by 5-15 parts by weight with respect to the total layers.

12. The multilayer board of claim 7, wherein the binding strength between the first insulation layer and the second nickel layer is in the range of from 0.7 to 0.9 kgf/cm.

13. The multilayer board of claim 7, wherein a wiring distance between the second nickel layer and the second copper layer is 10-20 μm.

14. A method for manufacturing a core board, the method comprising: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; andforming a first nickel layer on at least one surface of the core insulation layer by the electroless plating.

15. The method of claim 14, wherein the electroless plating is performed by using a plating bath including a nickel salt, a sodium hypophosphate, and a pH controlling agent.

16. The method of claim 15, wherein the nickel salt is one or more compounds selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate, and nickel amidosulfonate.

17. The method of claim 15, wherein the nickel salt is added by 4-250 g/L.

18. The method of claim 15, wherein the sodium hypophosphate is added by 20-700 g/L.

19. The method of claim 15, wherein the pH controlling agent is one or more compounds selected from the group consisting of ammonia water, hydrochloric acid, and acetic acid.

20. The method of claim 15, wherein pH of the plating bath is 4-6.

21. The method of claim 15, wherein the plating bath further includes a complexing agent.

22. The method of claim 21, wherein the complexing agent is succinic acid and the succinic acid is added by 5-50 g/L.

23. The method of claim 15, wherein a temperature of the plating bath is 60-90° C.

24. The method of claim 15, wherein the electroless plating is performed for 1-10 min.

25. The method of claim 14, wherein the first nickel layer has a thickness of 0.3-2 μm.

26. The method of claim 14, wherein the first nickel layer is added by 5-15 parts by weight with respect to 100 parts by weight of the total layers.

27. The method of claim 14, the method further comprising: stacking a first photo-resist layer on the first nickel layer;exposing and developing the first photo-resist layer in correspondence with wiring patterns;forming a first copper layer on the first nickel layer by the electro plating;removing the first photo-resist layer; andetching the first nickel layer.

28. The method of claim 27, wherein a wiring distance between the first nickel layer and the first copper layer is 10-20 μm.

29. A method for manufacturing a multilayer board, the method comprising forming circuits according to wiring patterns on a core board;stacking a first insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins;forming a second nickel layer on the first insulation layer by the electroless plating;stacking a second photo-resist layer on the second nickel layer;exposing and developing the second photo-resist layer in correspondence with the wiring patterns;forming a second copper layer on the second nickel layer by the electro plating;removing the second photo-resist layer; andetching the second nickel layer.

30. The method of claim 29, wherein the core board is the core board manufactured by the method of preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins:forming a first nickel layer on at least one surface of the core insulation layer by the electroless plating:stacking a first photo-resist layer on the first nickel layer:exposing and developing the first photo-resist layer in correspondence with wiring patterns:forming a first copper layer on the first nickel layer by the electro plating:removing the first photo-resist layer; andetching the first nickel layer.

31. The method of claim 29, wherein the electroless plating is performed by using a plating bath including a nickel salt, a sodium hypophosphate, and a pH controlling agent.

32. The method of claim 31, wherein the nickel salt is one or more compounds selected from the group consisting of nickel sulfate, nickel chloride, nickel fluoborate, and nickel amidosulfonate.

33. The method of claim 31, wherein the nickel salt is added by 4-250 g/L.

34. The method of claim 31, wherein the sodium hypophosphate is added by 20-700 g/L.

35. The method of claim 31, wherein the pH controlling agent is one or more compounds selected from the group consisting of ammonia water, hydrochloric acid, and acetic acid.

36. The method of claim 31, wherein pH of the plating bath is 4-6.

37. The method of claim 31, wherein the plating bath further includes a complexing agent.

38. The method of claim 31, wherein the complexing agent is succinic acid and the succinic acid is added by 5-50 g/L.

39. The method of claim 31, wherein a temperature of the plating bath is 60-90° C.

40. The method of claim 31, wherein the electroless plating is performed for 1-10 min.

41. The method of claim 29, wherein the first nickel layer has a thickness of 0.3-2 μm.

42. The method of claim 29, wherein the first nickel layer is added by 5-15 parts by weight with respect to 100 parts by weight of the total layers.