Number | Date | Country | Kind |
---|---|---|---|
2000-145631 | May 2000 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5000113 | Wang et al. | Mar 1991 | A |
5094885 | Selbrede | Mar 1992 | A |
5133284 | Thomas et al. | Jul 1992 | A |
5238499 | van de Ven et al. | Aug 1993 | A |
5855687 | DuBois et al. | Jan 1999 | A |
5882419 | Sinha et al. | Mar 1999 | A |
6096135 | Guo et al. | Aug 2000 | A |
Number | Date | Country |
---|---|---|
4-233221 | Aug 1992 | JP |
5-38904 | Feb 1993 | JP |
6-13368 | Jan 1994 | JP |
6-208959 | Jul 1994 | JP |
6-295872 | Oct 1994 | JP |
7-221024 | Aug 1995 | JP |
8-222556 | Aug 1996 | JP |
8-233221 | Sep 1996 | JP |
2603909 | Jan 1997 | JP |
10-41251 | Feb 1998 | JP |
10-41253 | Feb 1998 | JP |
10321524 | Dec 1998 | JP |
11-36076 | Feb 1999 | JP |
Entry |
---|
“Effects of Copper Contamination in Silicon on Thin Oxide Breakdown,” Journal of The Electrochemical Society, 146 (6), pp. 2258-2260 (1999). |
“Deposition Rate and Gap Filling Characteristics in Cu Chemical Vapor Deposition With Trimethylvinylsilyl Hexafluoro-Acetylacetonate Copper(I),” Publication Board, Japanese Journal of Applied Physics, Part 1, No. 12A, pp. 6358-6363 (1998). |