The present invention relates to an operation for checking the appearance of a product or a component part in the course of manufacture and, more particularly, to a data processing device, an inspection operation support system and a data processing method for supporting an operation to determine conditions for a device for detecting foreign materials and pattern defects on a surface of a semiconductor wafer, a photomask, a magnetic disk, a liquid crystal substrate, or the like, and an observation device for observing defects including foreign materials, as well as an analysis operation to check the performances of the devices.
In a process of manufacturing a semiconductor device, a liquid crystal device or a magnetic disk, a foreign material or a pattern defect on a surface of a semiconductor wafer or a liquid crystal substrate is a cause of a product fault. There is, therefore, a need to continuously monitor whether or not there is any problem with the manufacturing apparatus and the manufacture environment by quantifying foreign materials and pattern defects (hereinafter referred to as appearance faults). There is also a need to check whether or not such an appearance fault has a fatal influence on the product.
In recent years, defects have become smaller in size with the reduction in processed size of semiconductor devices. In recent years, therefore, it has become a common practice to perform, for monitoring of defects such as described above, divided processes with a special-purpose device for detecting the positions of defects on a wafer and a special-purpose device for classifying defects by obtaining a high-magnification images at detected defect positions. As a device for detecting defect positions, an appearance inspection device such as an optical detection device or an inspection SEM is used. As a device for obtaining a high-magnification image at a defect position, a defect review SEM using a scanning electron microscope is used.
When a defect review SEM was first introduced as a defect observation tool, an operator manually performed the above-described defect classifying operation. There was, therefore, a problem that different persons who observe do not evenly recognize defect positions on observed objects and kinds of defect and do not stably recognize defects to be observed. Recently, to solve this problem, introduction of techniques for automatic defect review (ADR) and automatic defect classification (ADC) in which devices automatically determine the sizes, shapes, kinds, and so on of defects by using image processing techniques has begun. Results of ADR and ADC are displayed on a screen in such a manner as to be easily seen with the human eye and are finally output as a review report in a form on paper, a PDF file format, or the like.
On the other hand, semiconductor device and liquid crystal substrate manufacturers who are users of a defect review device have interest in how what kind of defect is distributed on a wafer or a liquid crystal substrate. This is because a distribution of defects on a wafer or a liquid crystal substrate relates to the processes of manufacturing the above-described various devices, and because each of the manufacturers adjusts conditions for the manufacturing process based on information on variations in a defect distribution. Therefore, a review report is ordinarily made in a form such that a defect map in which defect positions on a wafer or a liquid crystal substrate are shown on a schematic view of the wafer or the liquid crystal substrate and high-magnification images at representative points on the defect distribution shown by the defect map are displayed on one on-screen view.
JP Patent Publication (Kokai) No. 2008-130966 A (Patent Literature 1) discloses an example of a view for display of review results. Patent Literature 1 discloses a review report view provided in a form such that high-magnification images of defects shown in a defect map are displayed in thumbnail form in order of defect IDs on one view together with the defect map. The high-magnification images are displayed in thumbnail form along with a scroll bar, and a device user can read on a review result check view the thumbnail images at the defect positions with respect to all the IDs by operating the scroll bar.
JP Patent Publication (Kokai) No. 2007-232480 A (Patent Literature 2) discloses an example of a defect review device arranged so that a review report finally made can be freely edited on a report editing view. In the defect review device disclosed in Patent Literature 2, constituent elements of a report are combined into modules to be displayed as icons on the editing view. The defect review device is arranged so that the review report can be edited by displaying these icons in the editing view for a GUI. Once editing of a review report is completed, the review report is stored as a template. After the completion of the next defect review, a device operator can call up the stored template and output a review report in the same format.
Patent Literature 1: JP Patent Publication (Kokai) No. 2008-130966 A
Patent Literature 2: JP Patent Publication (Kokai) No. 2007-232480 A
In improving the yield in manufacture of a semiconductor device, a liquid crystal device or a magnetic disk, an operation to detect defects such as appearance faults, attached foreign materials or electrical defects is very important, as described above. Therefore an improvement in performance with the miniaturization of semiconductor devices is continually required of inspection devices, and inspection devices capable of detecting finer defects with high sensitivity have come on the market.
With the improvement in sensitivity of inspection devices, the amounts of information output from appearance inspection devices and defect observation devices have become enormously large. On the other hand, there is a need to finally compile inspection results in the form of a review report. Information output from an appearance inspection device or a defect observation device includes information on inspection results, such as detected foreign materials, the number of defects and defect feature quantities. There is a problem that a considerably long time is required for data processing and data rearrangement. “Data processing” referred to here means checking a plurality of groups of coordinate data output from a defect inspection device, taking in corresponding image data from a review device, inputting category numbers for kinds of defect, and performing Venn diagram analysis (adder-missing analysis). Also, “data rearrangement” means an operation including showing the correspondence between a defect map, defect positions on the map and images, for example, with presentation software sold on the market, and drawing a graph of the number of detections with respect to each of kind-of-defect categories.
Preparation of a review report requires selecting necessary images from a large number of image data items output from a defect observation device, and combining the images into one slide. With the improvement in performance of the defect observation devices, the amounts of image data output from the devices have become enormously large, and it has become more difficult to perform processing relating selection of images automatically output. The fact is that preparation of a review report is presently dependent on manual operations. Operations for searching for desired defects in such an enormous amount of image data, making checks against a defect map and combining data into a file require much expense in time. Therefore, there has been a demand for a support tool capable of easily preparing a review report.
Defects detected by defect review change between batches of inspection data. It is, therefore, difficult to fix in advance the relationships between dots on a defect map and images in the form of templates. Also, a situation may occur frequently in which a demand arises for changing the display format of a review report in course of preparation of the review report. In such a case, with a template-type review report format such as that described in Patent Literature 2, it is necessary to repeat a process including editing a template by returning to a template editing view, displaying the results of execution of the template on another view, and checking whether or not a review report is displayed in the desired format. After all, under the present circumstances, a review report is prepared according to inspection results by manual operations taking a long time.
Therefore, the present invention presents a defect review support device, a defect review device or an inspection support device capable of providing review report preparation functions improved in operability and easy to use.
According to the present invention, the above-described problem is solved by implementing a review report preparation tool having a function to edit a layout of a review report in the above-described defect review support device, defect review device or inspection support device. A device user prepares a review report by calling up the above-described review report preparation tool on a monitor connected to each of the above-described devices. If there is a need to change the format of the review report, changing processing is executed on the review report preparation tool. All of a sequence of operations necessary for changing the format are executed on a GUI. An on-screen display of the review report preparation tool at the time of completion of review report preparation is a review report. If the device user outputs the on-screen display of the review report preparation tool at the time of completion of review report preparation, the output result itself is a review report.
When configured as hardware, the review report preparation tool is constituted by a storage means in which software for realizing the above-described function to edit the layout of the review report is stored, a computation means for executing this software, and a communication interface for transmitting a demand for data to an external database in which data necessary for review report preparation is stored. In correspondence with an operation performed on the GUI, the above-described computation means transmits a command to demand the necessary data to the above-described database, extracts the necessary data from a returned reply, and displays the data on the review report preparation tool. Thus, execution of the sequence of operations necessary for changing the format on the GUI is enabled.
Advantageous Effects of Invention
According to the present invention, a method of displaying a large amount of images and a defect map is devised to provide a means that makes checking of a large amount of images easier, and improves the facility with which a defect review report having a defect map and a defect images disposed around the defect map is prepared while check is made as to whether or not desired defects are detected. Also, means for enabling a report to be easily prepared with a freely designed layout, such as defect map enlarging/reducing display and image list display, are provided to realize an environment in which the above-described review report can be prepared in a markedly short time, which effect is unimaginable from the conventional art. Further, the time required to feedback defect inspections to the processes of manufacturing various devices is reduced. This effect contributes to an improvement in yield in manufacture of various devices.
Description will be made of embodiments with reference to the drawings.
The present embodiment will be described with respect to an example of a configuration of a defect review support device that realizes functions for preparing a review report on a GUI by designating defect IDs. In the present embodiment, it is assumed that the defect review support device is applied to a semiconductor device manufacture line.
The appearance inspection device is a device for roughly checking the entire surface of a wafer to obtain information on positions on a wafer indicating defect candidates. The optical-type defect review device is a device for detecting foreign materials attached to a wafer and faults in wiring patterns formed on the wafer surface by obtaining optical images at defect candidate positions found by appearance inspection, and for classifying defects with respect to each kind of defect. The SEM-type defect review device is a device for detecting small defects and electrical defects (VC defects) that cannot be detected by the optical-type defect review, by using SEM images at defect candidate positions found by appearance inspection, and for classifying defects with respect to each kind of defect. The SEM-type defect review device can obtain not only a simple secondary electron image but also a plurality of backscattered electron images (shadow images) detected from different positions with respect to a primary electron beam optical axis. The above-described devices are connected to each other via a communication network 7.
A defect inspection support device 13 in the present embodiment is constituted by a database 8 for storing defect images detected by the optical-type defect review device and the SEM-type defect review device, a workstation 9 for storing in the database only image data desired by an inspection device user by removing unnecessary data from the image data output from the optical-type defect review device and the SEM-type defect review device, and terminals 10 to 12 in which a review report preparation tool is installed. While an example of a configuration in which a plurality of terminals are connected to the database 8 is shown in
It is necessary that inspection information transmitted and received between the above-described groups of inspection devices, database 8 and workstation 9 be exchanged in a common format for mutual use.
In these examples, the maximum gray level difference is the absolute value of brightness of a defect portion when a differential image is obtained by processing an image in a place determined as a defect and an image of a corresponding reference portion. The reference image average gray level is the average of the brightness of a pixel portion determined as the defect portion, as seen on the reference image. The defect image average gray level is the average of the brightness of the pixel portion determined as the defect portion, as seen on the defect image. The polarity indicates whether the defect portion is bright or dark in comparison with the reference image. In the polarity, “+” indicates a light defect, while “−” indicates a dark defect. The inspection mode is an image comparison method that was being used when the defect was detected. The inspection mode comprises die comparison, cell comparison and die-cell-mixture comparison. The defect size, the number of defects and the defect size width/height indicate the size of the detected defect. The defect size and width/height are in microns, for example. The number of defect pixels is counted in units of pixels. The defect size ratio represents the ratio of the width and height in the defect size. This is a parameter shown, for example, as 1 when the width and the height are equal to each other, as 2 when the width is twice the height, and so on. The defect portion pixel integrated value represents the derivative of the pixel portion recognized as a defect on the defect image or the reference image, indicating the degree of change in light and shade in the pixel portion. The value of the defect image portion is referred to as the in-defect-image defect portion pixel derivative, while the value of the reference image portion is referred to as the in-reference-image defect portion pixel derivative. The information on kinds of defect is information on kinds of defect obtained as a result of ADC, for example, information on an attachment of a foreign material, a short defect, a scratch, a defect due to a buried foreign material, a void, a pattern shape abnormality, and etching residue.
When defect review with the optical-type or SEM-type device is completed, obtained inspection information is stored in the database 8.
Methods of operating the review report preparation tool implemented in the defect review support device in the present embodiment will be described with reference to
The review report shown in
The operation view of the review report preparation tool in the present embodiment will be described with reference to
The image and feature quantity list display view 31 is a view displayed by sorting ADR images and RDC information output from the appearance inspection device or the defect review device with defect IDs and is constituted of a defect ID display section 20 in which defect IDs are displayed, an inspected image display section 21 in which inspection images 22 from the appearance inspection device are displayed, a reviewed image display section 23 in which images 24 obtained by review device are displayed, a review category input and display section 25 in which the IDs for the manufacturing processes on which defect review was performed are displayed, a defect feature quantity display section 26 in which RDC information on detected defects is displayed, and defect selecting buttons 27 for selecting defects to be entered in the review report. Since the number of defects recognized as defects and the amount of RDC information are markedly large, a defect ID scroll bar 28 for moving the on-screen view in defect ID descending/ascending order and a lateral scroll bar 29 are also prepared. By operating the above-described scroll bars, the device user can visually recognize representative defects to be entered in the review report and recognize defect IDs.
Through the image and feature quantity list display view 31 shown in
In a case where a desired ADR image is not displayed, the defect selecting button 27 is checkmarked and a review data output button 30 shown in
When the ID for the defect to be entered in the review report is recognized, the device user sets up a map and image display view 14 shown in
In an initial state, in the review report preparation view shown in
A defect image first obtained by a series of defect inspections is a defect image obtained by the appearance inspection device. Also, images of defects with one ID are stored in the database 8 in time series order in which inspections are made. In the defect review support device in the present embodiment, therefore, a setting is made such that a defect image first displayed after input of a defect ID in the map and image display view shown in
Therefore, the review support device or the review report preparation tool in the present embodiment has a function to select the kind of defect image to be selected through a pull-down menu, which is an example of a review report editing function. When it is desired to change the kind of defect image to be displayed, the device user selects the thumbnail image display box 34 by clicking a right button of a mouse provided for the terminal 10 (11 or 12). A displayed-kind-of-image selecting pull-down menu 37 shown in
In the above-described way, defect images are successively displayed in the initial view shown in
When it is desired to change the number of defect images to be inserted in the review in course of preparation of the review report, the above-described display information changing and layout editing pull-down menu 42 is displayed and “Enlarge” or “Reduce” in the displayed items is selected. When one of the items is selected, a number-of-displayed-image selecting pull-down menu 43 shown in
When the device user selects a suitable one of the numeric values contained in the number-of-displayed-image selecting pull-down menu 43, the number of defect images displayed in the map and image display view 14 is changed according to the selected number.
The internal operation of the review support device for realizing the above-described review report editing functions will be described with reference to
The functional blocks shown in
For example, in a case where the defect map shown in
The map drawing section 53 converts the obtained information on the x- and y-coordinates of defects into displayed positions on the GUI view and displays the positions on the user interface 46 together with image information representing the wafer (e.g., information on the wafer contour line and rectangle information representing chips). Simultaneously, the object display section 54 displays the thumbnail display sections 34, defect ID input boxes 17 and arrow buttons 18 around the defect map 15. When an ID is input to one of the defect ID input boxes 17, the pointer position detection section 51 detects the occurrence of a certain change in the pointer and interprets the determined position of the pointer to detect the occurrence of the operation for input to the defect ID input box 17. The demanding operation analysis section 52 obtains the information input to the defect ID input box 17 and transmits the information to the object display section 54. The object display section 54 searches for the image data to be displayed on the thumbnail display box 34 by referring to the data downloaded from the database 8 and stored in the memory and by using the defect ID as a key. If the search result is that the image data exists in the memory, the object display section 54 produces image data for a thumbnail image having a suitably reduced resolution from the image data existing in the memory and displays the data by superimposing the data on the thumbnail image display box 34. If the original image data does not exist, the object display section 54 transmits an image obtaining request to the database reference section 47.
On the other hand, the analysis result from the demanding operation analysis section 52 is also transmitted to the map drawing section 53. The map drawing section 53 is thereby enabled to recognize the defect (and the defect ID for the defect) in a state where the ID is input to the defect ID input box 17, and to display the defect highlighting pointer and the defect ID at the corresponding position on the defect map.
When the pull-down menu shown in
When the number of thumbnail images to be displayed is changed through
In actuality, since access to the database 8 occurs before the point in time at which the image and feature quantity list display view 31 shown in
To explain the advantage of the review report preparation tool in the present embodiment, an internal configuration of a terminal or a review support device in which a template-type review report preparation tool is implemented will be described.
As can be understood from the above description, once a template is determined in the case of the template-type review report preparation tool, adjusting the positions at which thumbnail images and arrows are displayed requires returning to the template editing view to perform the process. The review report layout, however, may be changed according to a device user's intention in the report preparation process. In the case of the template-type review report preparation tool, therefore, there is a need to repeat a complicated process including template editing; confirmation of report view through combined view; and reediting by returning to template editing view, before a completed view for a review report is attained, and a considerably long time is required to prepare a report.
The review report preparation tool in the present embodiment has the editing function that enables changing the review report layout on the review report preparation operation view, thereby largely reducing the number of review report preparation steps. To show the effects of the present embodiment, the time required to prepare a review report in the present embodiment is shown in
Thus, the review report preparation tool in the present embodiment enables realization of a review support device facilitating analysis, rearrangement and compilation using a vast amount of image data.
While Embodiment 1 has been described with respect to a review report preparation tool capable of preparing a review report by manually inputting defect IDs, the present embodiment will be described with respect to a configuration of a review report preparation tool further improved in operability.
First,
The defect review SEM 56 is constituted by a charged particle optical barrel 63 that applies a primary charged particle beam to a wafer and outputs a secondary charged particle signal generated by application of the primary charged particle beam, a vacuum specimen chamber 64 in which a specimen stage 65 on which a wafer is placed is housed, an overall control section 66 that controls the overall operation of the charged particle optical barrel 63 and the vacuum specimen chamber 64, and an image processing section 67 that sorts obtained defects by using taken images. The charged particle optical barrel 63 is constituted by an electron source 68 that generates a primary electron beam, upper and lower condenser lenses 69 and 71 and a beam current diaphragm 70 for controlling the beam current rate of the electron beam generated in the electron source, a scanning deflector 72 that scans the specimen with the electron beam, a reflector plate 73 that reflects out of the optical axis secondary charged particles generated by application of the primary electron beam, an objective lens 74 that converges onto the specimen the electron beam moved for scanning by the scanning deflector, a left shadow image detector 75 that detects backscattered electrons reflected on the left-hand side as viewed on the plane of projection of the figure in the secondary charged particles reflected by the reflector plate, a right shadow image detector 76 that detects backscattered electrons reflected on the right-hand side as viewed on the plane of projection of the figure, and a secondary electron detector 77 that outputs a secondary electron image formation signal.
The image processing section 67 obtains IDs for defects not having undergone defect review and defect position information about the defects by referring to the database 59. In some case, these defect IDs and defect position information are directly transmitted from the appearance inspection device 61. The internal configuration of the terminal 57 is the same as that described with reference to
An operation view of the review report preparation tool in the present embodiment will be described with reference to
When the device user puts the operating pointer on a suitable dot on the defect map to select a thumbnail image to be next displayed, a balloon view 83 containing a second thumbnail image 84 and a defect ID 85 is displayed in a pop-up manner. The device user performs an operation to drag and drop the second thumbnail image 84 displayed in the balloon view 83 into a desired image display box 86 in a plurality of image display boxes displayed in the map and image display view 78 by operating a pointing device such as a mouse. In this way, the second thumbnail image 84 displayed in the balloon view 83 can be pasted in the image display box 86. Simultaneously, the defect ID corresponding to the drag-and-dropped defect image is automatically displayed in an ID input box 87 below the image display box 86. Also, on the defect map 80, the defect position corresponding to the selected thumbnail image is highlighted with the highlighting pointer 81, and the defect ID value “154” is also displayed.
When one of the arrow buttons 88 by the side of the defect ID input box 87 is pressed, the defect ID value displayed in the defect ID input box 87 is changed according to the number of times the button is pressed. Simultaneously, the image displayed in the image display box 86 and the displayed position of the highlighting pointer 81 displayed on the defect map 80 are changed according to the change of the ID.
When one thumbnail image displayed in the map and image display view 78 is deleted, a drag-and-drop operation to move the image into a trash can icon not shown in the figure by clicking on the image is performed. Also, the image display positions can be interchanged by drag-and-dropping one of the defect images to another of the defect images.
In the above-described way, the operating pointer is moved on the defect map to successively display balloon images and successively paste desired thumbnail images, thereby progressing review report preparation.
The internal operation in the terminal 57 in the present embodiment will be described with reference to
When the operating pointer is moved onto an arbitrary dot in the defect map shown in
Next, when the thumbnail image, which is object data displayed in the balloon view 83, is drag-and-dropped into the image display box 86, the pointer position detection section 51 detects this operation and transmits this operation to the demanding operation analysis section 51. The demanding operation analysis section 51 interprets this drag-and-drop operation as an operation to paste the defect image with the defect ID 154 in the image display box 86 and transmits this to the display control section 49. The object display section 54 displays the defect image with the defect ID 154 in the image display box 86 and also displays the defect ID value “154” in the defect ID input box 87. The balloon view 83 is maintained in the displayed state unless the operating pointer is moved from the position of the defect ID 154. However, the device may be configured so that when the time period during which no operation on the operating pointer occurs reaches or exceeds a certain length of time, a timeout occurs and display of the balloon view 83 is terminated.
If the number of dots displayed on the defect map is large, there is a possibility of a hindrance to selection of the dots performed by moving the operating pointer on the defect map. The review report preparation tool in the present embodiment has a function to produce an enlarged display of a portion of the defect map in such a situation. The device user can select a defect to be displayed in thumbnail form from a region displayed by being enlarged. To produce an enlarged display of the defect map, the device user moves the operating pointer into a suitable region on the defect map 80 where no dot is displayed, and operates the pointing device (e.g., right-clicks the mouse). A display information changing and layout editing pull-down menu 42, such as shown in
In the map and image display view 78, an image list 91 can be displayed in place of the defect map. In the “image list”, defect images corresponding to all the dots displayed in the defect map 80 are displayed by being arranged in order of defect IDs. Since a plurality of kinds of defect image exist with respect to one defect ID as shown in
To display the image list, a display information changing and layout editing pull-down menu 42, such as shown in
Each of the above-described various operations, e.g., a defect map enlarging/reducing operation, display of a list of defect images, or display of a pull-down menu is realized by the pointer operation analysis section 48 shown in
As described above, switching between thumbnail image selection by means of a defect map and thumbnail image selection by means of an image list ensures compatibility between the facility with which a defect distribution is grasped by means of the defect map and the visibility of defect image configurations by means of the image list. The operability at the time of review report preparation is further improved in comparison with the case where only one of them can be displayed.
Further, an operation to display a defect image corresponding to a desired defect ID even in an image display box in which a thumbnail image is already displayed can be performed by inputting the defect ID in the defect ID input box 87, as in the case of Embodiment 1. In the review report preparation tool in the present embodiment, therefore, the device user can selectively use the two selection methods: thumbnail image selection by manual input of a defect ID in one defect ID input box 87; and thumbnail image selection by an operation to drag-and-drop an image from an image list. As a result, the convenience for extraction and selection of suitable images to be shown in a report is improved; the time taken to prepare a report including necessary information is further reduced; and the time before an improvement in yield is achieved is reduced.
As described above, a function to set conditions for selection of RDC information is provided in the review report preparation view to enable kinds of defect images to be displayed on the GUI view to be narrowed down according to a review preparer's intention, thus enabling finding a defect to be shown in a review report in a short time with ease. The above-described display control is also realized by cooperative processing performed by the pointer operation analysis section 48 and the display control section 49 shown in
In some cases, it is desired to display an enlarged image of some of the thumbnail images shown in
As described in Embodiment 1, thumbnail images are displayed by suitably reducing the resolution from the original images. When the image enlarging display and kind-of-defect code input window 107 is called up by the above-described double click, therefore, the pointer operation analysis section shown in
As shown in
The description has been made by assuming that the review support device is constituted by a defect review SEM and a review report preparation terminal connected to the defect review SEM. However, the method of review report preparation by means of a drag-and-drop operation in the present embodiment can also be applied to an inspection support device or a review support device constituted by a database and a review report preparation terminal, as shown in
1 Clean room
2 Semiconductor manufacturing apparatus
3 Group of appearance inspection devices
4 Group of optical-type review devices
5 Group of SEM-type review devices
6 Inspection device
7, 58 Communication network
8, 59 Database
9, 60 Workstation
10 to 12, 57 Terminals
13 Defect inspection support device in Embodiment 1
14 Map and image display view in Embodiment 1
15, 80 Defect map
16 Thumbnail image
17, 87 Defect ID input box
18, 88 Arrow button
19 Arrow
20 Defect ID display section
21 Inspected image display section
22 Inspection image from appearance inspection device
23 Reviewed image display section
24 Image obtained by review device
25 Review category input and display section
26 Defect feature quantity display section
27 Defect selecting button
28 Defect ID scroll bar
29 Lateral scroll bar
30 Review data output button
31 Image and feature quantity list display view
32 Map and image display view tab
33 Image and feature quantity list display view tab
34 Thumbnail image display boxes
35, 81 Highlighting pointer
36 Numeric value representing defect ID
37 Displayed-kind-of-image selecting pull-down menu
38 Window for selecting kinds of image to be displayed in displayed-kind-of-image selecting pull-down menu
39 Displayed-kind-of-image selecting button
40 OK button
41, 106 Cancel button
42 Display information changing and layout editing pull-down menu
43 Number-of-displayed-image selecting pull-down menu
44 Memory
45 CPU
46 User interface
47 Database reference section
48 Pointer operation analysis section
49 Display control section
50 Output control section
51 Pointer position detection section
52 Demanding operation analysis section
53 Map drawing section
54 Object display section
55 Defect Review support device in Embodiment 2
56 Defect review SEM
61 Appearance inspection device
62 Optical-type review device
63 Charged particle optical barrel
64 Vacuum specimen chamber
65 Specimen stage
66 Overall control section
67 Image processing section
68 Electron source
69 Upper condenser lens
70 Beam current diaphragm
71 Lower condenser lens
72 Scanning deflector
73 Reflector plate
74 Objective lens
75 Left shadow image detector
76 Right shadow image detector
77 Secondary electron detector
78 Map and image display view in Embodiment 2
79 First thumbnail image
82, 85 Defect ID
83 Balloon view
84 Second thumbnail image
86 Image display box
89 Enlarged defect map diagram
90 Enlarged map display position moving scroll bar
91 Image list
92 Highlighted display
93 Displayed image selecting scroll bar
100 Data filtering window
101 Kinds-of-defect window
102 RDC window
103 Defect feature quantity input section
104 “Select all” button
105 Confirmation button
107 Image enlarging display and kind-of-defect code input window
108 Slide button
109 Kind-of-defect code input section
Number | Date | Country | Kind |
---|---|---|---|
2009-209923 | Sep 2009 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2010/004160 | 6/23/2010 | WO | 00 | 5/10/2012 |