Claims
- 1. A device for manufacturing two substrates together, comprising:a first core; a separator; and, a second core attached with adhesive to the first core with the separator sandwiched between the first core and the second core.
- 2. The device recited in claim 1, comprising:a plurality of layers attached to the first and second core, wherein at least ones of the plurality of layers are simultaneously formed layers.
- 3. The device recited in claim 2, wherein the adhesive and separator are removable so that the first core forms a first substrate with at least one layer attached to the first core, and the second core forms a second substrate with at least one layer attached to the second core.
- 4. The device recited in claim 1, where the separator is disposed in a central region of the first core and the second core.
- 5. The device recited in claim 4, where the separator is substantially centered with respect to the first core and the second core.
- 6. The device recited in claim 1, where the separator is made at least partially of a non-stick material.
- 7. The device recited in claim 6, where the separator is made at least partially of a Teflon material.
- 8. The device recited in claim 2, where layers of the plurality of layers are provided only on a single side of each of the first and second core, to provide single-sided-built-up cores.
- 9. The device recited in claim 1, where each of the first and second core with layers attached, is a multi-layered printed circuit board (PCB).
- 10. The device recited in claim 1, where the separator provides a predetermined level of rigidity to the first and second core to facilitate rigidity thereof during a manufacturing process.
- 11. The device recited in claim 1, where the adhesive is provided at an entirety of outer edges of at least one of the first and second core.
- 12. A substrate manufacturing facility comprising:a plurality of two-substrate devices, each including: a first core; a separator; and, a second core attached with adhesive to the first core with the separator sandwiched between the first core and the second core.
- 13. The facility recited in claim 12, comprising:a plurality of layers attached to the first and second core, wherein at least ones of the plurality of layers are simultaneously formed layers.
- 14. The facility recited in claim 13, wherein the adhesive and separator are removable so that the first core forms a first substrate with at least one layer attached to the first core, and the second core forms a second substrate with at least one layer attached to the second core.
- 15. The facility recited in claim 12, where the separator is disposed in a central region of the first core and the second core.
- 16. The facility recited in claim 15, where the separator is substantially centered with respect to the first core and the second core.
- 17. The facility recited in claim 12, where the separator is made at least partially of a non-stick material.
- 18. The facility recited in claim 12, where the separator is made at least partially of a Teflon material.
- 19. The facility recited in claim 13, where layers of the plurality of layers are provided only on a single side of each of the first and second core, to provide single-sided-built-up cores.
- 20. The facility recited in claim 12, where each of the first and second core with layers attached, is a multi-layered printed circuit board (PCB).
- 21. The facility recited in claim 12, where the separator provides a predetermined level of rigidity to the first and second core to facilitate rigidity thereof during a manufacturing process.
- 22. The facility recited in claim 12, where the adhesive is provided at an entirety of outer edges of at least one of the first and second core.
- 23. A substrate inventory comprising:a plurality of two-substrate devices, each including: a first core; a separator; and, a second core attached with adhesive to the first core with the separator sandwiched between the first core and the second core.
- 24. The inventory recited in claim 23, comprising:a plurality of layers attached to the first and second core, wherein at least ones of the plurality of layers are simultaneously formed layers.
- 25. The inventory recited in claim 24, wherein the adhesive and separator are removable so that the first core forms a first substrate with at least one layer attached to the first core, and the second core forms a second substrate with at least one layer attached to the second core.
- 26. The inventory recited in claim 23, where the separator is disposed in a central region of the first core and the second core.
- 27. The inventory recited in claim 26, where the separator is substantially centered with respect to the first core and the second core.
- 28. The inventory recited in claim 23, where the separator is made at least partially of a non-stick material.
- 29. The inventory recited in claim 28, where the separator is made at least partially of a Teflon material.
- 30. The inventory recited in claim 24, where layers of the plurality of layers are provided only on a single side of each of the first and second core, to provide single-sided-built-up cores.
- 31. The inventory recited in claim 23, where each of the first and second core with layers attached, is a multi-layered printed circuit board (PCB).
- 32. The inventory recited in claim 23, where the separator provides a predetermined level of rigidity to the first and second core to facilitate rigidity thereof during a manufacturing process.
- 33. The inventory recited in claim 23, where the adhesive is provided at an entirety of outer edges of at least one of the first and second core.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a divisional of U.S. Ser. No. 10/046,231 filed 16 Jan. 2002, now issued as U.S. Pat. No. 6,555,444.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5780311 |
Beasom et al. |
Jul 1998 |
A |