Claims
- 1. A device housing receiving at least two printed circuit boards, said device housing being formed as one part and comprising:
- a rear wall having an interior side and made of plastic and serving as a backplane for electrically coupling printed circuit boards inserted in said housing;
- a plurality of metallized strip conductors coupled to the interior side of said rear wall;
- at least one metallized conducting surface having a greater surface area than each of the plurality of metallized strip conductors coupled to the interior side of said rear wall and at least one of said metallized strip conductors; and
- a plurality of metallized protruding connectors injection molded onto the interior side of said rear wall, said metallized protruding connectors coupled to said printed circuit boards and ones of said plurality of metallized strip conductors and at least one metallized conducting surface.
- 2. The device housing of claim 1, wherein said metallized protruding connectors comprise metallized pins and said printed circuit boards being electrically and mechanically coupled to a plurality of female multipoint connectors, such that said metallized pins are capable of being inserted into said female multipoint connectors as a plug-in connection.
- 3. The device housing of claim 1, wherein said metallized protruding connectors comprise adjacent pairs of metallized pins, each of said circuit boards comprises a connective surface such that insertion of one of said circuit boards between one said pairs of metallized pins causes electrical contact between the connective surface of said circuit board and said pair of metallized pins.
- 4. The device housing of claim 1, wherein at least one of said metallized strip conductors is capable of being coupled to at least one of a ground and a shield potential for electromagnetic shielding.
- 5. The device housing of claim 1, further comprising: a plurality of metallized cooling ribs molded onto the interior side of said rear wall.
- 6. The device housing of claim 1, wherein said rear wall includes a mounting part including a metallized contact surface, said metallized contact surface capable of being coupled to a ground support within said device housing.
Priority Claims (1)
Number |
Date |
Country |
Kind |
90113079.9 |
Jul 1990 |
EPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 07/725,576, filed on Jul. 3, 1991 now abandoned.
US Referenced Citations (12)
Foreign Referenced Citations (3)
Number |
Date |
Country |
1045500 |
Dec 1958 |
FRX |
3222178 |
Dec 1983 |
FRX |
3732249 |
Apr 1989 |
FRX |
Non-Patent Literature Citations (1)
Entry |
Siemens-Katalog Simatic S5, Automatisierungsgerate (Automation Devices) S5-101 R and S5-105 R, Catalog ST 50, 1984. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
725576 |
Jul 1991 |
|