Claims
- 1. A reactive species useful in plasma cleaning of semiconductor processing chambers, wherein said reactive species is generated by exposing a non-metallic carbon-comprising material, which is a liquid or a solid under standard conditions of about 25.degree. C. and atmospheric pressure, to a plasma, wherein the suitability of said reactive species for cleaning of process chambers is determined by measuring the removal rate of involatile deposits from the surface of said process chamber.
- 2. A material useful in plasma cleaning of semiconductor processing chambers, said material comprising: a non-metallic, carbon-comprising material which is a liquid or a solid under standard conditions of about 25.degree. C. and atmospheric pressure and which reduces the consumption of dry cleaning reactive species at the location of said non-metallic, carbon-comprising material during said cleaning of said semiconductor processing chamber, wherein the suitability of said non-metallic, carbon-comprising material for reducing the consumption of plasma-generated dry cleaning reactive species is determined by measuring the consumption rate of such dry cleaning reactive species at the location of said non-metallic, carbon-comprising material.
- 3. The reactive species of claim 1, or claim 22, or claim 23, or claim 24, or claim 25, wherein said non-metallic, carbon-comprising material from which said species is generated is in a form which can occupy the space typically occupied by a workpiece in a semiconductor processing chamber.
- 4. The reactive species of claim 3, wherein said non-metallic carbon-comprising material from which said species is generated is in the form of a solid disk or sheet.
- 5. The reactive species of claim 4, wherein said non-metallic carbon-comprising material from which said species is generated is in the form of a coating upon a non-reactive-species-generating substrate.
- 6. The reactive species of claim 1, wherein said non-metallic, carbon-comprising material from which said species is generated is formed from an organic carbon-containing compound.
- 7. The reactive species of claim 1, wherein said non-metallic, carbon-comprising material from which said species is generated is formed from a polymeric material.
- 8. The reactive species of claim 7, wherein said non-metallic, carbon-comprising material is formed from a material selected from the group consisting of polyimides, phenol formaldehyde novalac resins, and polymers generated using CHF.sub.3 as a starting material, and combinations thereof.
- 9. The reactive species of claim 7, wherein said polymeric material comprises a phenol formaldehyde novalac resin in combination with a diazoquinone sensitizer.
- 10. The carbon-comprising material of claim 2, wherein said non-metallic, carbon-comprising material occupies the space typically occupied by a workpiece in a semiconductor processing chamber.
- 11. The non-metallic, carbon-comprising material of claim 2 or claim 10, wherein said carbon-comprising material is in the form of a solid disk or sheet.
- 12. The non-metallic, carbon-comprising material of claim 2 or claim 10, wherein said carbon-comprising material is in the form of a coating upon a non-reactive-species-generating substrate.
Parent Case Info
This application is a Continuation, of prior U.S. application Ser. No. 08/442,904, filed on May 17, 1995 now abandoned, which is a divisional application of application Ser. No. 08/104,318, filed on Aug. 9, 1993 and issued as U.S. Pat. No. 5,486,235.
US Referenced Citations (24)
Foreign Referenced Citations (1)
Number |
Date |
Country |
663687 A1 |
Jul 1995 |
EPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
104318 |
Aug 1993 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
442904 |
May 1995 |
|