Claims
- 1. A device for operatively connecting workpieces to a component having a point of use thereon, comprising:
positioning means for placing at least one workpiece closely adjacent the point of use on the component; and attaching means located proximal said positioning means; said attaching means being adapted to operatively connect said at least one workpiece to the component at the point of use without first repositioning the component or the device.
- 2. The device of claim 1 wherein said workpieces are integrated workpieces.
- 3. The device of claim 2 further comprising feeding means for moving the workpieces on a path through the device.
- 4. The device of claim 3 further comprising a separating tool, adjacent said feeding means, for separating the integrated workpieces.
- 5. The device of claim 1 further comprising a burnishing tool, located adjacent said attaching means, for cleaning the point of use on the component before said at least one workpiece is operatively connected to said point of use without first repositioning the component or the device.
- 6. The device of claim 1 wherein said positioning means is adapted to test the connection between said workpiece and the component after said workpiece is operatively connected to said point of use without first repositioning the component or the device.
- 7. The device of claim 6 wherein said positioning means is adapted to test the electrical connection between said workpiece and the component.
- 8. The device of claim 6 wherein said positioning means is adapted to test the mechanical connection between said workpiece and the component.
- 9. The device of claim 6 wherein said positioning means is adapted to provide for a visual inspection of the connection between said workpiece and the component.
- 10. The device of claim 1 wherein said attaching means operatively connects said workpiece to the component with a layer of adhesive material.
- 11. The device of claim 10 further comprising coating means for applying a layer of flux to said workpieces.
- 12. The device of claim 1 further comprising a first coating means for applying solderable materials to said workpieces.
- 13. The device of claim 12 further comprising a second coating means for applying a layer of flux to said workpieces.
- 14. The device of claim 1 wherein said device further comprises a shaping tool for selectively forming said workpieces into a shape for use.
- 15. The device of claim 1 further comprising a coating means for applying a layer of adhesive to said workpieces.
- 16. The device of claim 1 further comprising means for selectively moving said device with respect to the component.
- 17. A method for operatively connecting at least one workpiece to a component, having with a point of use thereon, provided with at least one implementation device having a positioning tool, an attaching tool and an accessory assembly, comprising the steps of:
operating said positioning tool to place at least one workpiece closely adjacent the point of use on the component; and operating said attaching tool to operatively connect said at least one workpiece to the component at the point of use thereon without first repositioning the component or the implementation device.
- 18. The method of claim 17 further comprising the step of burnishing the point of use on the component with said accessory assembly without first repositioning the component or the implementation device.
- 19. The method of claim 17 further comprising the step of testing the mechanical strength of the connection between the at least one workpiece and the component with said accessory assembly without first repositioning the component or the implementation device.
- 20. The method of claim 17 further comprising the step of testing the electrical connection between the at least one workpiece and the component with said accessory assembly without first repositioning the component or the implementation device.
- 21. The method of claim 17 further comprising the step of shaping said at least one workpiece prior to operatively connecting the at least one workpiece to the point of use on the component.
- 22. The method of claim 17 further comprising the step of disposing a layer of solderable material on said at least one workpiece prior to operatively connecting the at least one workpiece to the point of use on the component.
- 23. The method of claim 22 further comprising the step of disposing a layer of flux on said at least one workpiece prior to operatively connecting the at least one workpiece to the point of use on the component.
- 24. The method of claim 17 further comprising the step of disposing a layer of adhesive on said at least one workpiece prior to operatively connecting the at least one workpiece to the point of use on the component.
- 25. The device of claim 17 wherein said workpieces are integrated workpieces.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This is a continuation-in-part application of Petitioner's earlier U.S. application Ser. No. 09/510,281 filed Feb. 21, 2000, entitled ELECTRICAL TERMINAL IMPLEMENTATION DEVICE.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09510281 |
Feb 2000 |
US |
Child |
09859075 |
May 2001 |
US |