Claims
- 1. A reconfigurable device for soldering workpieces to an adjacent component having a point of use thereon, comprising:a frame member; positioning and testing means operatively connected to said frame member for placing at least one of the workpieces closely adjacent the point of use on the component and for testing a soldered connection; and attaching means operatively connected to said frame member for soldering said at least one of the workpieces to the point of use, after the at least one of the workpieces is placed by said positioning means, without relocating or repositioning the component or the device.
- 2. The device of claim 1 wherein said workpieces are integrated prior to said positioning means placing said at least one of the workpieces closely adjacent the point of use.
- 3. The device of claim 2 further comprising feeding means operatively connected to said frame member for moving the integrated workpieces on a path through the device.
- 4. The device of claim 3 further comprising a separating tool operatively connected to said frame member adjacent said feeding means for separating the integrated workpieces.
- 5. The device of claim 1 further comprising a burnishing tool operatively connected to said frame member adjacent said attaching means for cleaning the point of use on the component before said at least one of the workpieces is placed closely adjacent the point of use; said burnishing tool being operatively coupled with said positioning and testing means so that said positioning and testing means can place the at least one of the workpieces closely adjacent the point of use after said burnishing tool cleans the point of use, without relocating the component or the device.
- 6. The device of claim 1 wherein said positioning and testing means is adapted to test the solder connection between said at least one of the workpieces and the component after said at least one of the workpieces is soldered to said point of use without first repositioning the component or the device.
- 7. The device of claim 6 wherein said positioning and testing means is comprised of means for testing the electrical connection between said at least one of the workpieces and the component.
- 8. The device of claim 6 wherein said positioning and testing means is comprised of means for testing the strength of the mechanical connection between said at least one of the workpieces and the component.
- 9. The device of claim 1 further comprising means operatively connected to said frame member for selectively moving said device with respect to the component.
- 10. A method for operatively connecting at least one workpiece to a component having a point of use thereon comprising the steps of:providing at least one reconfigurable workpiece implementation device having a frame member; a positioning and testing means operatively connected to said frame member for placing the at least one workpiece closely adjacent the point of use and for testing a soldered connection; and attaching means operatively connected to said frame member for soldering the at least one workpiece to the point of use, after the at least one of the workpieces is placed by said positioning means, without relocating or repositioning the device; positioning the component adjacent to said workpiece implementation device; operating said positioning and testing means to place the at least one workpiece closely adjacent the point of use on the component; and operating said attaching means to solder the at least one workpiece to the point of use after the at least one workpiece is placed closely adjacent the point of use with the positioning and testing means without the necessity of first relocating or repositioning the component or the workpiece implementation device.
- 11. The method of claim 10 further comprising the steps of providing said workpiece implementation device with a burnishing tool and cleaning the point of use with said burnishing tool after said component is positioned adjacent said implementation device; said positioning and testing means then performing the step of placing the at least one workpiece closely adjacent the point of use without relocating the component or the workpiece implementation device.
- 12. The method of claim 10 further comprising the step of testing the mechanical strength of the connection between the at least one workpiece and the point of use using said positioning and testing means, after the at least one workpiece is soldered to the point of use, without relocating or repositioning the component or the workpiece implementation device.
- 13. The method of claim 10 further comprising the step of testing the electrical connection between the at least one workpiece and the component with said positioning and testing means, after the at least one workpiece is soldered to the point of use, without relocating or repositioning the component or the workpiece implementation device.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation-in-part application of Petitioner's earlier U.S. application Ser. No. 09/510,281 now U.S. Pat. No. 6,438,818 filed Feb. 21, 2000, entitled ELECTRICAL TERMINAL IMPLEMENTATION DEVICE.
US Referenced Citations (22)
Non-Patent Literature Citations (1)
Entry |
Metals Handbook, 2nd ed., 1998, 1123-1134. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/510281 |
Feb 2000 |
US |
Child |
09/859075 |
|
US |