This application claims priority of Taiwanese Patent Application No. 107127933, filed on Aug. 10, 2018.
The disclosure relates to shield, more particularly to an electromagnetic shield.
When an electronic device is in use, electronic components in the device may generate electromagnetic radiation which could interfere with the operation of other electronic devices. Referring to
Therefore, the object of the disclosure is to provide an electromagnetic shield that can alleviate at least one of the drawbacks of the prior art.
According to the disclosure, an electromagnetic shield is adapted to be mounted on a circuit board and to cover an electronic component disposed on the circuit board so as to shield electromagnetic radiation produced by the electronic component.
The electromagnetic shield includes a cover unit and a conductive surrounding wall.
The cover unit includes a metallic main body. The main body has a first surface, a second surface that is opposite to the first surface, and an abutment portion that protrudes from the first surface and that is adapted to be connected to the electronic component.
The conductive surrounding wall is connected to the cover unit, is adapted to abut tightly against the circuit board, and is adapted to cooperate with the main body and the circuit board to define an electromagnetic shielding space that encloses the electronic component.
Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiment with reference to the accompanying drawings, of which:
Referring to
The cover unit 2 includes a metallic main body 21, a thermal conducting plate 22, a thermal radiation film 23, a plurality of sleeve members 24, a plurality of securing members 25, and a plurality of springs 26. In this embodiment, the cover unit 2 includes four sleeve members 24, and four securing members 25. In this embodiment, regarding the material of the main body 21, aluminum is chosen for the lower price, the lighter weight and the fact that it is easy to process. The main body 21 has a first surface 211, a second surface 212 that is opposite to the first surface 211, an abutment portion 213 that protrudes from the first surface 211, and four through holes 214 respectively disposed in four corner portions of the main body 21 and extending from the first surface 211 to the second surface 212. In this embodiment, the abutment portion 213 is produced by stamping, and is adapted to be connected to the electric component 8. The thermal conducting plate 22 is disposed on the abutment portion 213 and is adapted to abut against the electronic component 8 such that heat produced by the electronic component 8 may be transmitted by heat conduction through the thermal conducting plate 22 to the main body 21. The thermal radiation film 23 covers the second surface 212 of the main body 21 for facilitating dissipation of heat which is generated by the electronic component 8.
In this embodiment, the through holes 214 of the main body 21 are respectively aligned with the securing holes 73 of the circuit board 7. The sleeve members 24 are mounted to the main body 21 and respectively disposed in the through holes 214. In other embodiments, the sleeve members 24 may be molded as one piece with the main body 21. The securing members 25 extend through the main body 21 and respectively through the sleeve members 24, and are connected to the circuit board 7 to thereby secure the main body 21 and the conductive surrounding wall 3 to the circuit board 7. In this embodiment, the securing members 25 are made of a flexible plastic. Further referring to
The conductive surrounding wall 3 is made of a low-density and compressible material. In this embodiment, the conductive surrounding wall 3 has four straight conductive foam blocks 31 coupled together to form a rectangular structure, but is not limited in this respect. In certain embodiments, the conductive surrounding wall 3 may have only one annular conductive foam block 31. Each conductive foam block 31 has first and second surfaces 311, 312 opposite to each other. The first surface 311 of each conductive foam block 31 is connected to the main body 21 by a conductive double-sided tape (not shown) , and the second surface 312 of each conductive foam block 31 is adapted to abut tightly against the side surface of the circuit board 7 and is electrically connected to a respective one of the copper foils 72.
In this embodiment, the cover unit 2 further includes four springs 26. Each of the springs 26 is sleeved on the cylindrical body 251 of a respective one of the securing members 25 and is connected between a respective one of the securing members 25 and a respective one of the sleeve members 2 for bringing the circuit board 7 to tightly contact the conductive surrounding wall 3. Specifically, each spring 26 has opposite ends respectively abutting against the head portion 252 of the respective one of the securing members 25 and the respective one the sleeve members 24. The springs 26 are adapted for biasing the respective one of the limiting portions 255 to abut tightly against the side surface of the circuit board 7 and for bringing the circuit board 7 to tightly contact the conductive surrounding wall 3.
Referring to
In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiment(s). It will be apparent, however, to one skilled in the art, that one or more other embodiments maybe practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects, and that one or more features or specific details from one embodiment may be practiced together with one or more features or specific details from another embodiment, where appropriate, in the practice of the disclosure.
While the disclosure has been described in connection with what is considered the exemplary embodiment, it is understood that this disclosure is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Number | Date | Country | Kind |
---|---|---|---|
107127933 | Aug 2018 | TW | national |