the whole bump connector protruding from the surface

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H01L2224/13023

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13023the whole bump connector protruding from the surface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,218,090
- Issue date Feb 4, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,159,850
- Issue date Dec 3, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,113,006
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,068,234
- Issue date Aug 20, 2024
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 12,057,837
- Issue date Aug 6, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,009,575
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nan-Chin Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and display apparatus
- Patent number 11,963,429
- Issue date Apr 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yu Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor packages having vias
- Patent number 11,961,812
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
- Patent number 11,923,214
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Junghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package method and chip package structure
- Patent number 11,901,324
- Issue date Feb 13, 2024
- Shanghai AVIC OPTO Electronics Co., Ltd.
- Kerui Xi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIPS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20250046768
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250029913
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jaesic LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022828
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240395753
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Bong geun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20240380401
- Publication date Nov 14, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20240379489
- Publication date Nov 14, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371742
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240347503
- Publication date Oct 17, 2024
- United Microelectronics Corp.
- Shing-Ren SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS
- Publication number 20240234356
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
- Publication number 20240215269
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT
- Publication number 20240204048
- Publication date Jun 20, 2024
- Intel Corporation
- Hwichan Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...
- Publication number 20240178146
- Publication date May 30, 2024
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...
- Publication number 20240170431
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chang-Kun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105694
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jung Hoo YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063250
- Publication date Feb 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sang Jo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047374
- Publication date Feb 8, 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

the whole bump connector protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor device and a manufacturing method thereof

Fine pitch copper pillar package and method

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor device assembly with die support structures

Semiconductor package

Semiconductor device assembly with surface-mount die support struct...

Integrated circuit component with conductive terminals of different...

Semiconductor structure

Semiconductor device and method for manufacturing semiconductor device

Logic drive using standard commodity programmable logic IC chips co...

Semiconductor devices including through-silicon-vias and methods of...

Package structure

Advanced device assembly structures and methods

Multiple plated via arrays of different wire heights on a same subs...

Packaged die and RDL with bonding structures therebetween

Chiplets with connection posts

Solderless interconnection structure and method of forming same

Display module and display apparatus

Semiconductor packages having vias

Semiconductor packaging apparatus and method of manufacturing semic...

Chip package method and chip package structure

Semiconductor device having electrode pads arranged between groups...

Semiconductor package with routing patch and conductive interconnec...

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device with discrete blocks

Semiconductor package and manufacturing method thereof

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor structure and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIPS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

EPITAXIAL SOURCE OR DRAIN REGION WITH A WRAPPED CONDUCTIVE CONTACT

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...

CHIPLETS WITH CONNECTION POSTS

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF