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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13023
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package including an encapsulant
Patent number
12,341,118
Issue date
Jun 24, 2025
Samsung Electronics Co., Ltd.
Seungwan Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
12,334,476
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,288,764
Issue date
Apr 29, 2025
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
Patent number
12,218,090
Issue date
Feb 4, 2025
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a manufacturing method thereof
Patent number
12,199,014
Issue date
Jan 14, 2025
Samsung Electronics Co., Ltd.
Kyeong Bin Lim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fine pitch copper pillar package and method
Patent number
12,191,241
Issue date
Jan 7, 2025
Amkor Technology Singapore Holding Pte Ltd.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
Patent number
12,176,902
Issue date
Dec 24, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
Patent number
12,159,850
Issue date
Dec 3, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
12,148,727
Issue date
Nov 19, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
12,113,006
Issue date
Oct 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
12,087,720
Issue date
Sep 10, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit component with conductive terminals of different...
Patent number
12,074,066
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
12,068,234
Issue date
Aug 20, 2024
United Microelectronics Corp.
Chun-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
12,057,362
Issue date
Aug 6, 2024
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
Patent number
12,057,837
Issue date
Aug 6, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
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Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
Patent number
12,014,972
Issue date
Jun 18, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
12,009,575
Issue date
Jun 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Nan-Chin Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Advanced device assembly structures and methods
Patent number
11,999,001
Issue date
Jun 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Packaged die and RDL with bonding structures therebetween
Patent number
11,996,401
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
Information
Patent Grant
Chiplets with connection posts
Patent number
11,990,438
Issue date
May 21, 2024
X Display Company Technology Limited
Carl Prevatte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display module and display apparatus
Patent number
11,963,429
Issue date
Apr 16, 2024
Chengdu BOE Optoelectronics Technology Co., Ltd.
Yu Wang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Semiconductor packages having vias
Patent number
11,961,812
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Changeun Joo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packaging apparatus and method of manufacturing semic...
Patent number
11,923,214
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Junghyun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package method and chip package structure
Patent number
11,901,324
Issue date
Feb 13, 2024
Shanghai AVIC OPTO Electronics Co., Ltd.
Kerui Xi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive traces in semiconductor devices and methods of forming same
Patent number
11,894,299
Issue date
Feb 6, 2024
TAIWAN SEMICONDUCTOR LTD
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
Publication number
20250233029
Publication date
Jul 17, 2025
Samsung Electronics Co., Ltd.
Jungwoo JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE OF STACKED DIES
Publication number
20250218987
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Han Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250210559
Publication date
Jun 26, 2025
Innolux Corporation
Kuo-Shun Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING PACKAGES WITH DUMMY DIES HAVING A CONSTRUCTION THAT MIM...
Publication number
20250201645
Publication date
Jun 19, 2025
Microsoft Technology Licensing, LLC
Rahul AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS
Publication number
20250192022
Publication date
Jun 12, 2025
STMicroelectronics International N.V.
Gregoire DELACOURT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR CUSTOMIZED SESMICONDIUCTOR PACKAGING, SERVER, SYSTEM...
Publication number
20250183150
Publication date
Jun 5, 2025
UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
Jimin Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250174535
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Heewoo AN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Publication number
20250167115
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Jimo GU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
Publication number
20250167123
Publication date
May 22, 2025
SK HYNIX INC.
Jae Jun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250167056
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Gyuhyeong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
Publication number
20250157985
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250105082
Publication date
Mar 27, 2025
JCET Management Co., Ltd.
Xiao GU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
Publication number
20250105208
Publication date
Mar 27, 2025
UltraMemory Inc.
Shigeru NAKAHARA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEP...
Publication number
20250096164
Publication date
Mar 20, 2025
QUALCOMM TECHNOLOGIES, INC.
Yeng Kwan Hoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
Publication number
20250096097
Publication date
Mar 20, 2025
Hana Micron Inc.
Jae-Sung LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Publication number
20250079290
Publication date
Mar 6, 2025
Shinko Electric Industries Co., Ltd.
Yuki KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING WIRING...
Publication number
20250070003
Publication date
Feb 27, 2025
TOPPAN Holdings Inc.
Kenta SUGAWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
Publication number
20250062216
Publication date
Feb 20, 2025
SILICON BOX PTE. LTD.
Sehat SUTARDJA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIPS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
Publication number
20250046768
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Hansae Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20250029913
Publication date
Jan 23, 2025
Samsung Electronics Co., Ltd.
Jaesic LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250022828
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Hyoeun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
Publication number
20240429191
Publication date
Dec 26, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
Publication number
20240405007
Publication date
Dec 5, 2024
Huawei Technologies Co., Ltd
Lei ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
Publication number
20240395753
Publication date
Nov 28, 2024
Samsung Electronics Co., Ltd.
Bong geun Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
Publication number
20240395746
Publication date
Nov 28, 2024
SK HYNIX INC.
Jae Jun LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240387495
Publication date
Nov 21, 2024
Samsung Electronics Co., Ltd.
Minwoo LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20240380401
Publication date
Nov 14, 2024
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
Publication number
20240379489
Publication date
Nov 14, 2024
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
SHUN-HSING LIAO
H01 - BASIC ELECTRIC ELEMENTS