Claims
- 1. A method for removing material from a substrate, the method comprising:
- generating an oxygen plasma in a plasma generating and discharge device including a sapphire plasma tube, generating the plasma comprising
- generating a temperature of about 270.degree. C. in the plasma generating and discharge device,
- generating a pressure of about 1.5 torr in the plasma generating and discharge device,
- supplying from about 500 watts to about 2000 watts of power to the plasma generating and discharge device,
- introducing about 2000 sccm of at least one oxygen-containing gas into the plasma generating and discharge device;
- introducing about 5 sccm of at least one fluorine-containing compound into the plasma generating and discharge device;
- introducing about 300 sccm of a forming gas into the plasma generating and discharge device; and
- directing the plasma toward the material to be removed from the substrate.
- 2. The method according to claim 1, wherein the forming gas includes at least one nitrogen-containing compound and at least one hydrogen-containing compound.
- 3. The method according to claim 2, wherein the at least one nitrogen-containing compound includes at least one member selected from the group consisting of N.sub.2 and NO.sub.2 and the at least one hydrogen-containing compound includes at least one member selected from the group consisting of H.sub.2 and CHF.sub.3.
- 4. The method according to claim 2, wherein the forming gas includes about 10% hydrogen.
- 5. The method according to claim 1, wherein at least one oxygen-containing compound to form said plasma is provided by introducing at least one oxygen-containing compound selected from the group consisting of molecular oxygen, atomic oxygen, ozone, and oxygen-containing compounds.
- 6. The method according to claim 5, wherein said at least one oxygen-containing compound includes at least one compound selected from the group consisting of N.sub.2 O, NO.sub.2, NO, CO.sub.2, or CO.
- 7. The method according to claim 5, wherein said at least one oxygen-containing compound, said forming gas, and said at least one fluorine-containing compound are introduced into said plasma generating and discharge device simultaneously.
- 8. The method according to claim 1, wherein said plasma generating and discharge device utilizes microwave frequency electromagnetic radiation to generate said plasma.
- 9. The method according to claim 1, wherein said at least one fluorine-containing compound include s at least one member selected from the group consisting of CF.sub.4, C.sub.2 F.sub.6, CHF.sub.3, CFH.sub.3, C.sub.2 H.sub.2 F.sub.4, C.sub.2 H.sub.4 F.sub.2, CH.sub.2 F.sub.2, CH.sub.3 CF.sub.3, C.sub.3 F.sub.8, SF.sub.6, and NF.sub.3.
- 10. The method according to claim 1, wherein the substrate is heated to a temperature of from about 20.degree. C. to about 350.degree. C.
- 11. The method according to claim 1, wherein said plasma generating and discharge device is supplied with power from about 500 watts to about 2000 watts.
- 12. The method according to claim 1, wherein said plasma generating and discharge device is supplied with a level of power sufficient to result in removal of material from the substrate without causing unwanted effects to the substrate.
- 13. The method according to claim 1, further comprising the steps of:
- operating the plasma generating and discharge device at multiple temperatures, multiple power levels for multiple periods of time, multiple pressures, and multiple levels of said at least one fluorine-containing compound and said forming gas.
Parent Case Info
This application claims benefit of provisional 60/026,614 filed Sep. 24, 1996.
US Referenced Citations (16)