1. Technical Field
The disclosure relates to heat dissipation, and particularly to a heat dissipation device for dissipating heat generated by an electronic component.
2. Description of Related Art
Electronic components operating at high speed generate excessive heat which must be displaced efficiently to ensure normal operation. Typically, a heat dissipation device attached to the electronic component provides such heat dissipation.
A conventional heat dissipation device includes a metal base for contacting and absorbing heat from the electronic component, a straight heat pipe with an evaporator section thereof attached to the base, and a heat sink including a plurality fins attached to a condenser section of the heat pipe. By this configuration, firstly, the heat generated by the electronic component is conducted to the base, and then transferred to the heat sink through the heat pipe, and finally is dissipated to ambient by the fins.
For enhancing a heat dissipation effectiveness of the heat dissipation device, a heat dissipation area of the heat sink is greatly increased. However, a heat contacting area between the heat pipe and the heat sink, due to the restriction by the configurations of the heat pipe and the heat sink, cannot be increased. Thus, most of heat generated by the electronic component and absorbed by the evaporator section of the heat pipe can not be transferred to the heat sink timely, and therefore the heat dissipation effectiveness of the heat dissipation device is limited.
It is thus desirable to provide a heat dissipation device which can overcome the described limitations.
Reference will now be made to the drawing figures to describe the present heat dissipation device in detail.
The heat-absorbing block 40 has a planar bottom surface 41 (
Each of the heat pipes 10 includes an evaporator section 14, a first condenser section 11 and a second condenser section 12 extending perpendicularly from two opposite ends of the evaporator section 14 in the same direction, and a third condenser section 13 extending from a free end of the second condenser section 12 towards a free end of the first condenser section 11. The first condenser section 11 is parallel to the second condenser section 12, and has a length slightly shorter than the second condenser section 12. The third condenser section 13 is parallel to the evaporator section 14, and has a length slightly longer than the evaporator section 14. The first condenser section 11, the evaporator section 14, the second condenser section 12 and the third condenser section 13 cooperatively form a rectangle with an opening 16 being formed between a free end of the third condenser section 13 and the free end of the first condenser section 11.
The heat sink 20 in whole has a substantially rectangular configuration. The heat sink 20 includes a first fin assembly 21, and two second fin assemblies 23 arranged at two opposite sides of the first fin assembly 21, respectively.
The first fin assembly 21 includes a plurality of parallel first fins 210 arranged side by side and a plurality of parallel heat dissipation vanes 212 arranged side by side and located on two opposite sides (i.e., front and rear sides) of the first fins 210. Each of the heat dissipation vanes 212 has a size smaller than the first fin 210. In this embodiment, each of the first fins 210 and the heat dissipation vanes 212 extends along a left-to-right direction of the heat sink 20. The first fins 210 are located on a middle portion of the first fin assembly 21. The heat dissipation vanes 212 on the front side of the first fin assembly 21 are grouped into two spaced units on a left end and a right end of the heat sink 20, respectively, thus to form two horny portions 213 on the front side of the first fin assembly 21. A first receiving room 216 is defined between the two horny portions 213 on the front side of the first fin assembly 21. Similarly, the heat dissipation vanes 212 on the rear side of the first fin assembly 21 are grouped into two units on the left end and the right end of the heat sink 20, respectively, thus to form another two horny portions 213 on the rear side of the first fin assembly 21, and a second receiving room 216 is defined between the another two horny portions 213 on the rear side of the first fin assembly 21. Accordingly, a top plan view of the first fin assembly 21 is generally H-shaped.
Two through holes 217 are defined in the left end and the right end of the first fin assembly 21, respectively. Each of the through holes 217 extends through the first fins 210 and the heat dissipation vanes 212 along a front-to-rear direction. Each of the through holes 217 receives the third condenser section 13 of a corresponding heat pipe 10 therein. A groove 218 is defined in a middle portion of a bottom side of the first fins 210. The groove 218 has an upper portion having a width substantially the same as the flat middle portion 421 of the heat-absorbing block 40, and slightly larger than a sum of the widths of the evaporator sections 14 of the heat pipes 10. A distance between each of the through holes 217 and the groove 218 substantially equals to the distance between the third condenser section 13 and the evaporator section 14 of each heat pipe 10, i.e., the length of the second condenser section 12. When assembled, the block 40 couples to the bottom side of the first fins 210, and thus the groove 218 and the flat middle portion 421 of the heat-absorbing block 40 cooperatively form a receiving space having a depth equal to a diameter of the evaporator section 14 of the heat pipe 10; thus, the evaporator sections 14 of the heat pipes 10 can be sandwiched closely between the bottom side of the first fins 210 and the flat middle portion 421 of the heat-absorbing block 40.
The second fin assemblies 23 have substantially the same configuration to each other, and are received in the first and the second receiving rooms 216 of the first fin assembly 21, respectively. Each of the second fin assemblies 23 includes a base 230, a plurality of second fins 231 extending perpendicularly and upwardly from a top surface of the base 230 and a plurality of second fins 231 extending perpendicularly and downwardly from a bottom surface of the base 230. The second fins 231 are parallel to each other and arranged side by side. Each of the second fins 231 extends along the front-to-rear direction of the heat sink 20, being perpendicular to the first fins 210.
The base 230 includes an elongated plated portion 232 and a pair of aliform portions 233 extending upwardly and slantways from two opposite ends (i.e., left and right ends) of the plated portion 232, respectively, to render the base 230 to have a substantially V-shaped configuration. A pair of slots 234 concaved from inner sides of the aliform portions 233, respectively, which face the first fin assembly 21. One slot 234 receives the second condenser section 12 of one of the heat pipes 10, and the other slot 234 receives the first condenser section 11 of the other heat pipe 10. A trough 236 is defined under the plated portion 232 of the base 230 to prevent the heat pipes 10 from interfering with the second fin assemblies 23. The trough 236 communicates with bottom ends of the slots 234, and has a shape substantially equal to the groove 218 of the first fin assembly 21. The trough 236 and the groove 218 cooperatively form a receiving channel under the bottom side of the heat sink 20 for receiving the evaporator sections 14 of the heat pipes 10 side by side.
During assembly of the heat sink 20, referring to
The heat-absorbing block 40 is installed on the electronic component with the bottom surface 41 thereof attaching to the electronic component; the heat sink 20 with the heat pipes 30 is mounted on the heat-absorbing block 40; and the heat sink 20 is mounted on the printed circuit board via the clip 30. The bottom side of the first fin assembly 21 and the second fin assemblies 23 and the evaporator sections 14 of the heat pipes 10 are in thermal contact with the top surface 42 of the heat-absorbing block 40.
During operation of the heat dissipation device, the heat-absorbing block 40 absorbs heat from the electronic component; the heat is spread on the first fins 210, the heat dissipation vanes 212 and the second fins 231 via the heat pipes 10; and finally the heat is dissipated to ambient air via the first fins 210, the heat dissipation vanes 212 and the second fins 231. Since each of the heat pipes 10 includes the first condenser section 11, the second condenser section 12 and the third condenser section 13 which are fully in thermal contact with the first fin assembly 21 and the second fin assemblies 23, a large heat contacting area between the heat pipes 10 and the heat sink 20 is provided. The heat pipes 10 have excellent heat transfer performance due to their low thermal resistance, and therefore heat generated by the electronic component is absorbed by the evaporator sections 14 of the heat pipes 10 and is quickly and effectively transferred to different portions of the heat sink 20 far from the electronic component, via the large heat contacting area between the condenser sections 11, 12, 13 of the heat pipe 10 and the heat sink 20, respectively. Accordingly, the heat dissipation efficiency of the heat dissipation device is improved.
It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200810068103.6 | Jun 2008 | CN | national |