1. Technical Field
The disclosure relates to a heat dissipation device.
2. Description of Related Art
A heat dissipation device is often applied to dissipate heat from heat generating components, such as central procession units (CPUs).
Conventionally, a heat dissipation device includes a plurality of fins made of aluminum and formed by extrusion type, a substrate arranged under the fins, and a heat pipe arranged on the substrate and connected to the fins and the heat pipe. The fins are soldered to the substrate and the heat pipe via stannum. The heat dissipation efficiency of the heat dissipation device is reduced since the thermal resistance of the stannum between the fins and the substrate. Further, the fins need a soldering process to fix on the substrate and the manufacture of the heat dissipation device is costly.
Thus, it is desired to overcome the described limitations.
The holder 10 is engaged with the base 20 to fix the base 20, the fin set 30 and the heat pipes 40 for dissipating heat generated from electronic elements.
The base 20 has a rectangle shape, and can be made of metal with high thermal conductivity selected from a group consisting of copper, aluminum and combination thereof. The base 20 includes a top surface 21 and a bottom surface 22 opposite to the top surface 21. A plurality of latch part 23 project from the top surface 21 of the base 20 and extend along a lengthwise direction of the base 20. Each latch part 23 includes a latch portion 231 and a supporting portion 232 connected to the latch portion 231 and the top surface 21 of the base 20. In the present embodiment, a cross section view of the latch part 23 is a substantial Y-shape, and a cross section view of the latch portion 231 is a substantial V-shape. The latch part 23 is integrally formed with the base 20 as a single piece and formed by extrusion type. Height of the latch portion 231 is larger than that of the supporting portion 232. A recess 24 is defined between every two neighboring latch parts 23. Each recess 24 includes a clasp recess 241 arranged between two neighboring latch portions 231 and a connecting recess 242 arranged between the two corresponding supporting portions 232. In the present embodiment, a cross section of the clasp recess 241 is substantially wedged. A cross section of the connecting recess 242 is rectangle-shaped. A width of the connecting recess 242 is equal to a width of a largest portion of the clasp recess 241. It can be understood that the latch part 23 can only include the latch portion 231, a cross section of the latch portion 231 is a substantial V-shape, and bottom portion of the latch portion 231 engages with the top surface 21 of the base.
Two grooves 221 are defined in the bottom surface 22 of the base 20. The grooves 221 extend along the lengthwise direction of the base 20. The two grooves 221 are respectively used to receive evaporation sections 42 of the two heat pipes 40. In the present embodiment, each evaporation section 42 of the heat pipe 40 has an interference fit with the corresponding groove 221 to fix the heat pipe 40 on the base 20. A bottom surface (not labeled) of the heat pipe 40 is coplanar with the bottom surface 22 of the base 20, and the bottom surface of the heat pipe 40 has a thermally conductive relationship with an electronic element via a heat conductor substrate 50. Two elongated cutouts 223 are defined in the bottom surface 22 of the base 20. The cutouts 223 are located at two opposite sides of the base 20 respectively, and extend along the lengthwise direction of the base 20. The cutouts 223 are used for engagingly receiving the holder 10.
Referring to
Referring to
The fin set 30 is firmly secured on the base 20 via every two T-shaped latch part 23 located at two lateral sides of each fin 31, and the heat pipe 40 has a firmly interferential match with the fin set 30 and the base 20. Compared with the conventional heat dissipation device, the present disclosure omits the process of soldering the base 20, the fin set 30 and the heat pipe 30 together, and the heat dissipation device 100 still has high heat dissipation efficiency, a simple structure, an easy operation, and a lower cost.
Referring to
Step 1: a plurality of fins 31 is provided. A plurality of tenons 32 are formed at a bottom portion of each fin 31. Each tenon 32 is wedged.
Step 2: a base 20 is provided. A plurality of latch part 23 project from a top surface 21 of the base 20 and extend along a lengthwise direction of the base 20. A recess 24 is defined between two neighboring latch parts 23. Each latch part 23 includes a latch portion 231 and a supporting portion 232 connected to the latch portion 231 and the top surface 21 of the base 20. In the present embodiment, a cross section of the latch part 23 is Y-shaped, and a cross section of the latch portion 231 is V-shaped. The recess 24 has a configuration in complement with that of the tenon 32.
Step 3: the tenons 32 of each fin 31 are received in the recesses 24 of the base 20, and the fins 31 engage with the base 20 one by one.
Step 4: a part of each latch part 23 located between two neighboring fins 31 are punched downward to a bottom surface 22 of the base 20 to make the part of the each latch part 23 distorted into a T-shape. In other words, the V-shaped latch portion 231 of the each latch part 23 between two neighboring fins 31 is distorted to form a T-shaped latch portion 231, whereby the distorted part of latch portion 231 is flat, and a width of the distorted part of latch portion 231 is larger than that of the original latch portion 231. Therefore, the fin 31 is firmly secured on the recesses 24 of the base 20 via the two T-shaped latch part 23 located at two lateral sides of the fin 31.
It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201210095717.X | Apr 2012 | CN | national |