Patent Application
20130105123
1. Technical Field
The disclosure generally relates to heat dissipation devices, and more particularly to a heat dissipation device for dissipating heat from heat generating components which having different heights.
2. Description of Related Art
As electronic products continue to develop, heat generated from electronic components of the electronic products become more and more. If the heat can not be removed rapidly, the electronic components are prone to be overheated. Generally, a metallic base plate is mounted on the electronic components to absorb heat generated therefrom. However, if one electronic component has a height different from that of an adjacent electronic component, the base plate is not able to tightly contacting all of the electronic components with different heights; as a result, a larger heat resistance will exist between the electronic components and the base plate, which will adversely affect the heat dissipation of the electronic components.
What is needed, therefore, is an improved heat dissipation device which overcomes the above described shortcomings.
Embodiments of heat dissipation devices will now be described in detail below and with reference to the drawings.
Referring to
Referring also to
The first heat absorbing member 11, the second heat absorbing member 12 and the base plate 10 are formed by a single piece. The first heat absorbing member 11 and the second heat absorbing member 12 are punched from an end of the base plate 10 and each thereof is an elastic L-shaped sheet. The first heat absorbing member 11 includes a first connecting plate 112 bended from the base plate 10 and a first heat absorbing plate 114 bended from a top end of the first connecting plate 112. The second heat absorbing member 12 includes a second connecting plate 122 bended from the base plate 10 and a second heat absorbing plate 124 bended from a top end of the second connecting plate 122. The first connecting plate 112 and the second connecting plate 122 are aligned with and parallel to each other and perpendicular to the base plate 10. The first heat absorbing plate 114 and the second heat absorbing plate 124 are aligned with and parallel to each other. The first heat absorbing plate 114 and the second heat absorbing plate 124 are parallel to and spaced from the base plate 10. When the first heat absorbing member 11 and the second heat absorbing member 12 are compressed, the first heat absorbing plate 114 and the second heat absorbing plate 124 can elastically move toward the base plate 10. A size of the first heat absorbing plate 114 is equal to that of the second heat absorbing plate 124. A height of the first connecting plate 112 is different from that of the second connecting plate 122.
The heat dissipation device 1 includes a covering plate 40 having good heat conductive efficiency. The covering plate 40 is rectangular and a size thereof is equal to that of the base plate 10. A periphery of a side of the covering plate 40 is sealed to the bottom ends of the sidewalls 13. Thus, the covering plate 40 and the base plate 10 are assembled together. A plurality of spaced fins 41 is mounted on the other side of the covering plate 40 to dissipate heat thereof. The fins 41 are parallel to each other. In this embodiment, the fins 41 and the covering plate 40 each are an aluminum plate.
A heat absorbing block 50 is embedded in the opening 101 of the base plate 10 and a top portion thereof is beyond to the base plate 10. A top surface of the heat absorbing block 50 is used to contact a required electronic component. A height of the top portion of the absorbing block 50 is different from that of the first connecting plate 112 and the second connecting plate 122. Thus, the heat absorbing block 50, the first heat absorbing member 11, and the second heat absorbing member 12 can contact electronic components with different heights. In other embodiment, the height of the top portion of the heat absorbing block 50 may be equal to that of the first connecting plate 112 or the second connecting plate 122, as long as the absorbing block 50 contacts the required electronic component. In this embodiment, the heat absorbing block 50 is a solid metallic block. In other embodiment, the heat absorbing block 50 may be a vapor chamber.
Referring also to
Two supporting members 30 are received in the receiving chamber 14 and located at lateral sides of the evaporator sections 21 of the heat pipes 20. Each supporting member 30 is rectangular, and top and bottom surfaces thereof respectively abut the covering plate 40 and the base plate 10 to enhance an intensity of lateral sides of the covering plate 40 and the base plate 10. The top surface of each supporting member 30 is coplanar to the top surface of each heat pipe 20. The bottom surface of each supporting member 30 is coplanar to the bottom surface of each heat pipe 20. Each supporting member 30 has good heat conductive efficiency and can rapidly transfers heat thereof to the fins 41 to dissipate.
In use, the first heat absorbing member 11, the second heat absorbing member 12 and the heat absorbing block 50 respectively contact the electronic components having different heights and absorb heat generated from the electronic components. The heat rapidly transfers to the fins 41 to dissipate by the heat pipes 20 and the supporting members 30.
It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201110331491.4 | Oct 2011 | CN | national |
