Patent Application
20230413487
The subject matter herein generally relates to a heat sink and an electronic device having the heat sink.
Most electronic devices include circuit board and a plurality of components on the circuit board. The plurality of components generates heat during operation, and the heat generated by the plurality of components needs to be dissipated in time to avoid affecting the normal operation of the components.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
An embodiment of a heat sink is provided for dissipating heat from multiple heat sources. The heat sink includes a substrate, a heat pipe, a first fin group, and a plurality of heat conducting members. The substrate includes a first surface and a second surface facing away from the first surface. The heat pipe is embedded in the substrate. The first fin group is arranged on the first surface. Each of the plurality of heat conducting members is embedded in the substrate and protrudes out of the substrate from the second surface. The heat pipe is in contact with each of the plurality of heat conducting members. In at least one embodiment, the heat sources are arranged along a direction, the heat pipe embedded in the substrate extends along the direction. Each of the plurality of heat conducting members corresponds to one of the heat sources, and is in contact with the corresponding heat source.
In the above heat sink, the plurality of heat conducting members are in contact with the heat sources and transmit the heat to the heat pipe, the heat pipe uniformly spreads the absorbed heat to the substrate and dissipates the heat though the first fin group.
Referring to
In the above heat sink 100, the plurality of heat conducting members 40 are in contact with the heat sources 90 and transmit the heat to the heat pipe 20, the heat pipe 20 uniformly spreads the absorbed heat to the substrate 10 and dissipates the heat though the first fin group 30.
Referring to
In at least one embodiment, a plurality of heat pipes 20 are arranged adjacently and received in the channel 13 to suit the heat transfer requirements. Optionally, the number of the heat pipes 20 may be two, three, four, and so on.
In at least one embodiment, a soldering layer or an adhesive layer may be arranged between a portion of each of the plurality of heat conducting members 40 in the substrate 10 and the substrate 10 to further improve a connection strength between the plurality of heat conducting members 40 and the substrate 10.
Referring to
Specifically, a cooling medium (not shown) in the heat pipe 20. During use, the heat emitted by the heat sources 90 is transferred to the evaporation surface 21 through the plurality of heat conducting members 40, and the cooling medium on the evaporation surface 21 is heated and vaporized to absorb heat energy and rapidly expand in volume, so that the cooling medium in the gas phase quickly fills the entire heat pipe 20. When the cooling medium in the gas phase contacts the condensation surface 22, a condensation phenomenon occurs. The condensation phenomenon releases the heat on the condensation surface 22, and the condensation surface 22 transfers the heat to the substrate 10. The cooling medium condensed on the condensation surface 22 will return to the evaporation surface 21 for recirculation.
In at least one embodiment, the heat pipe 20 may be flat, and both the evaporation surface 21 and the condensation surface 22 are flat planes.
Referring to
Referring to
In at least one embodiment, the heat sink 100 may further include a second fin group 50. The second fin group 50 is arranged on the first surface 11 and adjacent to the first fin group 30 along the second direction Y. The second fin group 50 includes a plurality of second fins 51 arranged at intervals on the first surface 11 along the first direction X. Each of the plurality of second fins 51 extends along the second direction Y. A second dissipation gap 50a is formed between any adjacent second fins 51.
The second fin group 50 and the first fin group 30 cooperate to dissipate heat from the substrate 10. Along the first direction X, each of the first fins 31 and each of the second fins 51 may be staggered. Further, along the first direction X, a width of the first dissipation gap 30a may be greater than a width of the second dissipation gap 50a, which reduces the risk of the first fin group 30 blocking airflow from entering the second fin group 50, thereby improving the air intake volume of the second fin group 50. So that the heat dissipation capability of the second fin group 50 and first fin group 30 to the substrate 10 is improved. In at least one embodiment, more than one second fins 51 may correspond to the first dissipation gap 30a.
The width of the first dissipation gap 30a is defined as L1, the width of the second dissipation gap 50a is defined as L2. In at least one embodiment, L1 is between 2.0 mm to 3.0 mm, that is, 2.0 mm≤L1≤3.0 mm; L2 is between 1.0 mm to 2.0 mm, that is, 1.0 mm≤L2≤2.0 mm.
In at least one embodiment, a ratio A between the width of the second dissipation gap 50a and the width of the first dissipation gap 30a satisfies the following conditions: A=L2/L1, ⅓≤A<1. In at least one embodiment, A=⅓.
Preferably, A may be ½, ⅔, and so on.
In at least one embedment, along the first direction X, a thickness of each of the plurality of first fins may be 0.3 mm, a thickness of each of the plurality of second fins may be 0.3 mm.
Referring to
In at least one embodiment, the number of the connecting holes 14 may be four and the connecting holes 14 are evenly distributed on the substrate 10, so that the fastening force between the substrate 10 and electronic device is evenly distributed.
In at least one embodiment, a heat conductivity coefficient of each of the plurality of heat conducting members 40 may be greater than a heat conductivity coefficient of the substrate 10, thereby improving the heat dissipation efficiency.
In at least one embodiment, each of the plurality of heat conducting members 40 may be made of copper, the substrate 10 may be made of aluminum. Compared with the traditional method in which the substrate made of copper is directly in contact with the heat sources, the amount of copper used can be reduced, and the production cost can be reduced.
In at least one embodiment, the first surface 11 and the second surface 12 are stacked along a third direction Z. Along the third direction Z, a thickness of the substrate 10 may be greater than or equal to 4 mm, a thickness of each of the plurality of heat conducting members 40 may be greater than or equal to 1 mm.
In at least one embodiment, the substrate 10, the first fin group 30 and the second fin group 50 may be integrally formed to improve the structure strength and reduce the production cost.
In at least one embodiment, the plurality heat sources 90 are arranged on the circuit board 91 in a straight line, and correspondingly, the heat pipe 20 extends in a straight line.
In at least one embodiment, the plurality heat sources 90 are arranged on the circuit board 91 along an arc or irregularly, and correspondingly, the heat pipe 20 extends along an arc or irregularly.
In at least one embodiment, along the third direction X, a projection of a periphery of the substrate 10 on a plane where the circuit board 91 is located may be within the circuit board 91, which is beneficial to reduce the space occupied by the substrate 10 in the electronic device 200.
In at least one embodiment, along the third direction X, a projection of a periphery of each of the plurality of heat conducting members 40 on the a plane where the corresponding heat source 90 is located may overlap with a periphery of the corresponding heat source 90, thereby improving the heat dissipation efficiency.
In the above heat sink 100 and the electronic device 200, the plurality of heat conducting members 40 can be in contact with the plurality of heat sources at the same time to transfer the heat of the heat sources 90 to the heat pipe 20, and the heat is uniformly diffused to the substrate 10 through the heat pipe 20. Finally, the heat of the substrate 10 is dissipated through the first fin group 30. So that the heat dissipation efficiency to the heat sources is improved.
It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202221522118.7 | Jun 2022 | CN | national |
