Patent Application
20220367236
Embodiments of the disclosure generally relate to methods for improving temperature uniformity across a wafer on a heater pedestal. In particular, embodiments of the disclosure relate methods of modifying the physical dimensions and arrangement of elements to improve temperature uniformity.
Semiconductor processing chambers typically contain a pedestal suspended in the chamber for supporting the wafer or substrate to be processed. In many embodiments, the pedestal also contains a heater for maintaining the substrate at an elevated temperature during processing.
The pedestals also contain several gas channels to aid in processing the substrate. For example, in some cases, the pedestals contain a vacuum channel which is used to provide a vacuum to secure the substrate to the pedestal. Another example is an edge purge channel which provides a flow of purge gas to the region near the peripheral edge of the substrate to avoid unwanted deposition.
Unfortunately, both of these gas channels can lower the substrate temperature immediately surrounding the channels. This temperature variation or “non-uniformity” (N/U) can affect the reaction rate of the process occurring on the substrate surface during processing, resulting in a variation in thickness across the substrate surface (i.e., thickness non-uniformity).
Accordingly, there is a need for improved heater pedestals which provide better temperature uniformity. Also, there is a need for modifying existing heater pedestals to provide better temperature uniformity.
One or more embodiments of the disclosure are directed to a method of modifying a heater pedestal to decrease temperature non-uniformity across a substrate supported on the heater pedestal. The method comprises modifying the height of mesas within one or more concentric regions of the heater pedestal, modifying the number of mesas on the heater pedestal, modifying a depth of a chucking channel securing the substrate to the heater pedestal, modifying the composition of an edge ring surrounding the substrate, or modifying the height of the edge ring.
Additional embodiments of the disclosure are directed to a method of modifying a heater pedestal to decrease temperature non-uniformity across a substrate supported on the heater pedestal. The method comprises moving a heater plate containing one or more heater coils above a lower top plate containing an edge purge channel and a vacuum chucking channel, modifying an orientation of an edge purge gas flow relative to an edge of the heater plate, or modifying a thickness of the heater pedestal to increase a flow path distance of the edge purge gas flow proximate to the heater plate.
Further embodiments of the disclosure are directed to a heater pedestal for supporting a substrate during processing. The pedestal comprises a base plate comprising an edge purge channel extending from near the center of the pedestal towards the peripheral edge of the pedestal, and a vacuum channel extending from near the center of the pedestal towards a plurality of outlets. A heater plate is on the base plate. The heater plate comprises two concentric heaters: a first heater covering the center of the pedestal to a radius of about 135 mm, and a second heater covering from a radius of about 135 mm to the peripheral edge of the pedestal. A top plate is on the heater plate. The top plate comprises a plurality of top outlets and a plurality of substrate support mesas in the top surface of the top plate. The top outlets provide a fluid connection to the outlets through the heater plate and the top plate. An edge ring surrounds the periphery of the base plate, the heater plate, the top plate, and, if present, the substrate.
So that the features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.
Before describing several exemplary embodiments of the disclosure, it is to be understood that the disclosure is not limited to the details of construction or process steps set forth in the following description. The disclosure is capable of other embodiments and of being practiced or being carried out in various ways.
As used in this specification and the appended claims, the term “substrate” refers to a surface, or portion of a surface, upon which a process acts. It will also be understood by those skilled in the art that reference to a substrate can also refer to only a portion of the substrate, unless the context clearly indicates otherwise. Additionally, reference to depositing on a substrate can mean both a bare substrate and a substrate with one or more films or features deposited or formed thereon
A “substrate” as used herein, refers to any substrate or material surface formed on a substrate upon which film processing is performed during a fabrication process. For example, a substrate surface on which processing can be performed include materials such as silicon, silicon oxide, strained silicon, silicon on insulator (SOI), carbon doped silicon oxides, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials, depending on the application. Substrates include, without limitation, semiconductor wafers. Substrates may be exposed to a pretreatment process to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure and/or bake the substrate surface. In addition to film processing directly on the surface of the substrate itself, in the present disclosure, any of the film processing steps disclosed may also be performed on an underlayer formed on the substrate as disclosed in more detail below, and the term “substrate surface” is intended to include such underlayer as the context indicates.
One or more embodiments of the disclosure are directed to a pedestal heater. Some embodiments of the disclosure advantageously provide lower temperature non-uniformity across a supported wafer during processing. Some embodiments of the disclosure advantageously provide lower thickness non-uniformity of a deposited film across a supported wafer during processing. Some embodiments of the disclosure advantageously reduce the temperature signature of a chucking channel on a supported wafer during processing.
For the purposes of the disclosure, reference will be made to variability plots and the values derived therefrom. Variability plots measure a substrate across the entire substrate surface. In some embodiments, the variability plots measure 49 points or 73 points on the substrate surface. In some embodiments, the variability plots measure the temperature of the substrate. In some embodiments, the variability plots measure the thickness of a deposited film.
In some embodiments, the deposited film is a TiAl film deposited by atomic layer deposition at a substrate temperature of about 350° C.
Throughout the disclosure reference will be made to a measure of non-uniformity referred to as 3-sigma. A 3-sigma value denotes the percentage of measured points which fall outside of 3 standard deviations from the mean. Accordingly, a lower 3-sigma value corresponds to higher uniformity and lower non-uniformity.
Referring to
The shaft 105 provides a conduit for gas flows (e.g., purge, vacuum), electrical connections (e.g., heater power, metrology sensors, etc.), and mechanical connections (e.g., motor connections, structural support).
The base plate 110 is connected to the shaft 105 and provides structural support for the heater plate 120 and the top plate 130. The heater plate 120 comprises one or more heater to maintain a supported substrate at a fixed temperature during processing. Due to numerous factors, the temperature across the surface of the substrate may vary or have some degree of non-uniformity.
In some embodiments, the heater plate 120 comprises more than one heating element. In some embodiments, the more than one heating element are arranged concentrically so that one or more heater operates primarily on an inner region of the substrate while an additional one or more heater operates on an outer or peripheral region of the substrate. In some embodiments, the heater plate 120 contains two heating elements. In some embodiments, a first heating zone is heated by heater 630 and covers up to a radius of 135 mm, while a second heating zone is heated by heater 640 and covers a radius of 135 mm to the outer peripheral edge of the heater pedestal. In some embodiments, the heater pedestal has a radius of 152 mm.
The top plate 130 is positioned on the heater plate 120 and provides support for the substrate during processing. In some embodiments, the top plate 130 has a radius of about 150 mm.
As shown in
For the purposes of this disclosure, the mesas 210 can be identified as being within concentric zones 215a-215d. Zone 215a is the region bounded by line A. Zone 215b is region between line A and line B. Zone 215c is the region between line B and line C. Zone 215d is the region between line C and the periphery of the top plate 130.
While four zones are shown in
Also shown in
Referring to
Without being bound by theory, it is believed that the gas flows through vacuum channel 430 and edge purge channel 440 lower the local temperature of a substrate positioned above these channels by reducing the thermal conductance of the pedestal. For the heater pedestal design shown in
As a result of this temperature non-uniformity, the inventors have discovered multiple methods for modifying a heater pedestal 100 to decrease the temperature non-uniformity across a substrate supported on the heater pedestal 100.
In some embodiments, the methods comprise increasing the relative thermal conductance of the pedestal above the vacuum channel 430 to counteract any loss of conductance as a result of the channel. In some embodiments, the methods comprise decreasing the thermal conductance of the pedestal which is not above the vacuum channel 430 to provide a more uniform thermal conductance across the pedestal.
In some embodiments, the methods comprise modifying the height of the mesas within one or more of the regions. In some embodiments, the height of the mesas is increased in one or more of the regions. In some embodiments, the height of the mesas is increased by up to 200%. In some embodiments, the height of the mesas 210 within zone 215a may be increased by 100%, the height of mesas 210 within zone 215b increased by 50%, the height of mesas 210 in zone 215c increased by 0%, and the height of mesas 210 within zone 215d increased by 50%. In some embodiments, the height of the mesas 210 within zone 215a may be increased by 2 mil, the height of mesas 210 within zone 215b increased by 1 mil, the height of mesas 210 in zone 215c increased by 0 mil, and the height of mesas 210 within zone 215d increased by 1 mil.
In some embodiments, the methods comprise reducing the number of mesas 210 on the heater pedestal 100. In some embodiments, the outermost ring of mesas 210 is removed. In some embodiments, the number of mesas is reduced by greater than or equal to 15%. In some embodiments, the number of mesas is reduced from 622 to 528.
In some embodiments, the methods comprise modifying the depth of the chucking channel 220. In some embodiments, the depth of the chucking channel is decreased. In some embodiments, the depth of the chucking channel is decreased by greater than or equal to 25%. In some embodiments, the depth of the chucking channel is decreased from about 15 mil to about 11 mil.
The inventors have surprisingly found that by implementing one or more of the disclosed methods, the temperature non-uniformity (3-sigma) can be reduced by greater than or equal to 40%. For example, a heater pedestal without modification provides a 3-sigma value of about 3%, but a heater pedestal modified by the disclosed methods provides a 3-sigma value of about 1.8% for temperature non-uniformity.
Similarly, the inventors have also surprisingly found that by implementing one or more of the disclosed methods, the thickness non-uniformity (3-sigma) of a film deposited on the substrate can be reduced by greater than or equal to 50%. For example, a heater pedestal without modification provides a 3-sigma value of about 3%, but a heater pedestal modified by the disclosed methods provides a 3-sigma value of about 1.5% for thickness non-uniformity.
In some embodiments, the disclosed methods decrease temperature non-uniformity by greater than or equal to 40%. In some embodiments, the disclosed methods decrease thickness non-uniformity of a deposited film by greater than or equal to 50%. In some embodiments, the temperature reduction at the chucking channel is reduced.
Referring to
In some embodiments, the modified heater pedestal 600 comprises an edge ring 620. In some embodiments, the edge ring 620 consists essentially of Al2O3. In some embodiments, the edge ring 620 consists essentially of AlN.
Without being bound by theory, it is believed that if the edge ring composition has a higher thermal conductivity (AlN higher than Al2O3), then the amount of energy imparted to the purge gas will be higher resulting in a higher temperature purge gas and less edge cooling effect.
In some embodiments, when the top plate 130 is split to accommodate the heater plate 120, as described above, the heater pedestal 600 and edge ring 620 are increased in thickness to accommodate the increase in distance between the lower top plate 130a and the upper top plate 130b.
In some embodiments, the outlets 445 of the edge purge channel 440 are oriented vertically. In some embodiments, the vertical orientation of the outlets 445 increases the residence time of the purge gas near the heater plate 120.
Without being bound by theory, it is believed that one or more of the following factors provides improved temperature non-uniformity. First, the heater plate is closer to the substrate than the vacuum channel 430 and the edge purge channel 440. Accordingly, the temperature drop typically observed as a result of these channels lower. Further, the temperature effect of the channels is more easily counteracted by the heater(s) before affecting the substrate.
Second, the increased thickness between the edge purge channel and the substrate results in an increased flow path distance for the purge gas while proximate to the heater. The resulting temperature increase in the purge gas is believed to have less of a cooling effect on the edge of the substrate.
The inventors have surprisingly found that by implementing one or more of these methods, the thickness non-uniformity (3-sigma) of a film deposited on the substrate can be reduced by greater than or equal to 60%. For example, a heater pedestal without modification provides a 3-sigma value of about 3%, but a heater pedestal modified by the disclosed methods provides a 3-sigma value of about 1.2% for thickness non-uniformity.
In some embodiments, the disclosed methods decrease thickness non-uniformity of a deposited film by greater than or equal to 60%. In some embodiments, the temperature reduction at the chucking channel is reduced or eliminated.
In some embodiments, the height H of the edge ring 620 is modified. In some embodiments, the height H of the edge ring 620 is decreased so that the top of the edge ring 620 is substantially coplanar with the top surface 615 of the substrate 610. As used in this regard, “substantially coplanar” means that the top of the edge ring 620 and the top surface 615 of the substrate 610 are within +/−5 mil.
Reference throughout this specification to “one embodiment,” “certain embodiments,” “one or more embodiments” or “an embodiment” means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. Thus, the appearances of the phrases such as “in one or more embodiments,” “in certain embodiments,” “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily referring to the same embodiment of the disclosure. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.
Although the disclosure herein has been described with reference to particular embodiments, those skilled in the art will understand that the embodiments described are merely illustrative of the principles and applications of the present disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made to the method and apparatus of the present disclosure without departing from the spirit and scope of the disclosure. Thus, the present disclosure can include modifications and variations that are within the scope of the appended claims and their equivalents.
This application claims priority to U.S. Provisional Application No. 63/189,203, filed May 16, 2021, the entire disclosure of which is hereby incorporated by reference herein.
| Number | Date | Country | |
|---|---|---|---|
| 63189203 | May 2021 | US |
