High frequency circuit assemblies and related methods.
Test contactors are used on printed circuit boards to test various parameters and/or components of semiconductor devices. Electronic devices have become smaller yet more powerful, resulting crowded and complex circuit boards. For example, modern automobiles are using RADAR equipment for collision avoidance, parking assist, automated driving, cruise control, etc. The radio frequencies used in such systems are typically 76-81 GHz (W-band). Also, the radio frequencies used for Wi-Fi applications are in the range of 56-64 GHz. The upcoming 5G cellular/cellular backhaul market uses frequencies in the sub 6 GHz, as well as 24-30 GHz, 37-48 GHz, and 64-71 GHz bands. Furthermore, semiconductor devices include antenna in package to minimize the footprint of the overall wireless chipset. Circuits that operate at these frequencies need to have terminations. At high frequency, the resistive termination device typically are a thin film process and surface mount devices. However, standard surface mount components tend to have parasitic impedance at higher frequencies. In addition, there are limits on where thin film components are used. The thin film process is expensive and difficult to implement in certain devices, such as a test contactor assembly.
What is needed is a way to effectively terminate high frequency circuits.
What is described herein is the implementation of radar absorbing material for use as an electronic termination component in high frequency circuits.
A high speed circuit assembly includes a high speed circuit including at least one transmission line extending to a transmission line end, and radar absorbing in contact with the at least one transmission line.
In one or more embodiments, the high speed circuit is a lead frame.
In one or more embodiments the high speed circuit assembly further includes a frame assembly disposed near the lead frame, and the frame assembly is a ground reference for the lead frame.
In one or more embodiments the high speed circuit assembly further includes a frame assembly disposed near the lead frame, and the frame assembly is a power supply.
In one or more embodiments, the radar absorbing material is disposed between the frame assembly and the transmission line end.
In one or more embodiments, the frame assembly includes a recess, and the radar absorbing material is disposed at least partially within the recess.
In one or more embodiments, the radar absorbing material is an attenuator for the high speed circuit.
In one or more embodiments, the high speed circuit includes at least one ring coupler.
In one or more embodiments, the radar absorbing material absorbs signals in a range of 1 GHz-110 GHz.
In one or more embodiments, the radar absorbing material absorbs signals in the range of 18 GHz-40 GHz.
In one or more embodiments, the radar absorbing material absorbs signals in the range of 40 GHz-80 GHz.
In one or more embodiments, the radar absorbing material absorbs signals in the range of 6 GHz-35 GHz.
In one or more embodiments, the radar absorbing material absorbs signals in the range of 1 GHz-30 GHz.
In one or more embodiments, the radar absorbing material absorbs signals in the range of 1 GHz-4 GHz.
A method includes applying a high frequency signal to a high speed circuit assembly, where the high speed circuit includes at least one transmission line extending to a transmission line end, and radar absorbing material in contact with the at least one transmission line. The method further includes terminating the high frequency signal with the radar absorbing material.
A test socket assembly including a frame assembly having a socket opening sized and configured to receive a device under test therein, and a high speed circuit including at least one transmission line extending to a transmission line end. The high speed circuit includes a lead frame assembly disposed adjacent to the frame assembly. The test socket assembly further includes radar absorbing material in contact with the at least one transmission line. The radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe and extending to a transmission line end, and a radar absorbing material in contact with the at least one transmission line and a radar absorbing structure in contact with the contactor signal probe, the radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line extending to a transmission line end, and a radar absorbing material in close proximity with the at least one transmission line, the radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe and extending to a transmission line end, and a radar absorbing material in close proximity with the at least one transmission line and a radar absorbing structure in close proximity with the contactor signal probe, the radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe and extending to a transmission line end, and a radar absorbing structure in contact with the contactor signal probe, a radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe and extending to a transmission line end, and a radar absorbing structure in close proximity with the contactor signal probe, a radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe, a radar absorbing structure in contact with the contactor signal probe, the radar absorbing structure terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line extending to a transmission line end, a radar absorbing material in close proximity with the at least one transmission line, the radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe and extending to a transmission line end, and a radar absorbing material in close proximity with the at least one transmission line and a radar absorbing structure in close proximity with the contactor signal probe, the radar absorbing material terminates the at least one transmission line.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe, and a radar absorbing structure in contact with the contactor signal probe.
In some embodiments, a high speed circuit assembly including a high speed circuit including at least one transmission line including a contactor signal probe, and a radar absorbing structure in close proximity with the contactor signal probe.
These and other embodiments, aspects, advantages, and features of the present invention will be set forth in part in the description which follows, and will become apparent to those skilled in the art by reference to the following description of the invention and referenced drawings or by practice of the invention. The aspects, advantages, and features of the invention are realized and attained by means of the instrumentalities, procedures, and combinations particularly pointed out in the appended claims and their equivalents.
The following detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the apparatus may be practiced. These embodiments, which are also referred to herein as “examples” or “options,” are described in enough detail to enable those skilled in the art to practice the present embodiments. The embodiments may be combined, other embodiments may be utilized or structural or logical changes may be made without departing from the scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense and the scope of the invention is defined by the appended claims and their legal equivalents.
In this document, the terms “a” or “an” are used to include one or more than one, and the term “or” is used to refer to a nonexclusive “or” unless otherwise indicated. In addition, it is to be understood that the phraseology or terminology employed herein, and not otherwise defined, is for the purpose of description only and not of limitation.
A device is described herein including the implementation of radar absorbing material for use as an electronic termination component in high frequency circuits. In one or more embodiments, the device includes a test socket assembly 100.
In one or more embodiments, the test socket assembly 100 is used with a device under test (DUT) 200, and can communicate via compliant interconnects with the device under test 200. The test socket assembly 100 allows direct communication between test hardware and the device under test while maintaining a contacted spring probe interface for remaining standard inputs and outputs on a BGA/QFN/WLCSP, or any other packaging technology. The test socket assembly 100 can include compliant interconnects and compliant or static lead frames and other features as described in U.S. Pat. No. 10,037,933, which is incorporated herein by reference in its entirety.
In one or more embodiments the test socket assembly 100 includes frame assembly 130, a high speed circuit assembly 210 (
The test socket assembly 100 is used with a device under test (DUT) 200. A socket opening within the frame assembly 130 receives the DUT 200 therein and assists in aligning the DUT 200 with the test socket assembly 100. The socket opening is sized and configured to receive the DUT 200 therein.
The test socket assembly 100 includes a high speed lead frame assembly 140 and one or more compliant interconnects, and at least one return. The spring return provides force back up into the assembly 100 and supports the lead frame assembly 140. The lead frame assembly 140 is disposed adjacent to the frame assembly 130, and is electrically coupled with the one or more compliant interconnects, which are also disposed within the frame assembly 130. The lead frame assembly 140 is sandwiched between the frame assembly 130 and the contactor body 131.
In one or more embodiments, as shown in
In one or more embodiments, the high speed circuit 220 has an operating frequency and an operating frequency wavelength. In one or more embodiments, the at least one transmission line 222 is defined by a length. In one or more embodiments, the length of the at least one transmission line 222 is greater than 0.1*operating frequency wavelength. The relation between frequency and wavelength is:
wavelength(λ)=Speed of light(c)/[√ε*Frequency(f)]
where √ε is the dielectric constant of the material used in the transmission line structure (microstrip, coplanar waveguide, stripline, slotted line, etc.
In one or more embodiments, the at least one transmission line 222 includes signal termination at the transmission line end 224. In one or more embodiments, radar absorbing material is disposed at the transmission line end 224. In one or more embodiments, the radar absorbing material is in contact with the at least one transmission line 222. In one or more embodiments, the radar absorbing material is in close proximity with the transmission line 222. Close proximity is a measure of distance on the order of microns or tens of microns. In some embodiments, close proximity is between about one micron and 100 microns. In some embodiments, close proximity is between about one micron and about 80 microns. In some embodiments, close proximity is between about one micron and about 60 microns. In some embodiments, close proximity is between about one micron and about 40 microns. In some embodiments, close proximity is between about one micron and about 20 microns. In some embodiments, close proximity is between about one micron and about 10 microns. In some embodiments, close proximity is between about 5 micron and about 10 microns. In one or more embodiments, the radar absorbing material is used to terminate the signal of the transmission line 222. In some embodiments, the transmission line 222 is not terminated by the radar absorbing material.
The radar absorbing material (RAM) is a material which has been specially designed and shaped to absorb incident RF radiation (also known as non-ionising radiation), as effectively as possible, from as many incident directions as possible. The more effective the RAM, the lower the resulting level of reflected RF radiation. The radar absorbing material 250 includes a cut section of material, sized to achieve an effective termination of the transmission line 222.
In one or more embodiments, the radar absorbing material absorbs signals in a range of 1 GHz-110 GHz. In one or more embodiments, the radar absorbing material absorbs signals in the range of 18 GHz-40 GHz. In one or more embodiments, the radar absorbing material absorbs signals in the range of 40 GHz-80 GHz. In one or more embodiments, the radar absorbing material absorbs signals in the range of 6 GHz-35 GHz. In one or more embodiments, the radar absorbing material absorbs signals in the range of 1 GHz-30 GHz. In one or more embodiments, the radar absorbing material absorbs signals in the range of 1 GHz-4 GHz.
In one or more embodiments the high speed circuit assembly 210 further includes a frame assembly 230 disposed near the lead frame 240, and the frame assembly 230 is a ground reference or a ground plane 260 for the lead frame 240. In one or more embodiments the high speed circuit assembly 210 further includes a frame assembly 230 disposed near the lead frame 240, and the frame assembly 230 is a power supply. In one or more embodiments, the radar absorbing material 250 is disposed between the frame assembly 230 and the transmission line end 224. In one or more embodiments, the frame assembly 230 includes a recess 232, and the radar absorbing material 250 is disposed at least partially within the recess 232. In one or more embodiments, the radar absorbing material 250 is an attenuator for the high speed circuit 220. For example, the radar absorbing material 250 can be disposed on top of the transmission line 222, as shown in
In one or more embodiments, the high speed circuit 220 is a lead frame 240 with a ring coupler 226, as shown in
A method includes applying a high frequency signal to a high speed circuit assembly, where the high speed circuit includes at least one transmission line extending to a transmission line end, and radar absorbing material in contact with the at least one transmission line. The method further includes terminating the high frequency signal with the radar absorbing material.
The high speed circuit assembly includes an effective and inexpensive solution to termination of transmission lines that would be otherwise prohibitively expensive or difficult to terminate with conventional terminators, particularly at high frequencies. The test socket assembly described and shown herein is a test socket that is compatible with semiconductor back-end manufacturing, yet is capable in operating at the W-band frequencies and includes a high speed circuit with radar absorbing material as a terminator of a transmission line end. Optionally, the test socket assembly includes a hybrid ring coupler embedded within the contactor as a splitter, and including the radar absorbing material terminator. The hybrid ring coupler allows for the large bandwidth and high isolation when splitting a signal from one line to two lines and can be used for splitting high frequency signals.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. It should be noted that embodiments discussed in different portions of the description or referred to in different drawings can be combined to form additional embodiments of the present application. The scope should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
This application claims priority to U.S. Provisional Application No. 62/728,427 that was filed on Sep. 7, 2018. The entire content of the application referenced above is hereby incorporated by reference herein.
Number | Date | Country | |
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62728427 | Sep 2018 | US |