Patent Application
20060011811
1. Field of the invention
The invention relates to an image sensor module structure, and in particular to an image sensor module is capable of manufacturing to be light, thin, and small.
2. Description of the Related Art
Referring to
Accordingly, when the photosensitive chip 20 has a large scale, it is inconvenient, or even impossible, in the manufacturing processes for bonding and electrically connecting wires to the first electrodes 16 of the substrate 10. Therefore, the size of the substrate 10 has to be enlarge so as to increase the space for wire bonding.
An objective of the invention is to provide an image sensor module structure, that is ease to be package and capable of reducing the volume of the module and the manufacturing cost.
Another objective of the invention is to provide an image sensor module structure capable of packaging image sensor chip having different sizes without changing the package volume. The objective of the producing packages having the same volume can be achieved.
To achieve the above-mentioned object, the invention provides a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The photosensitive chip is mounted on the upper surface of the substrate, and is electrically connected to the first electrodes of the substrate. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder. The upper end of the opening is formed with an internal thread, and the lower end of the opening is formed with a breach. The lens holder is adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.
Please refer to
The substrate 50 has an upper surface 58 on which first electrodes 62 are formed, and a lower surface 60 on which second electrodes 64 are formed. The first electrodes 62 are corresponding to electrically connect to the second electrode 64
The photosensitive chip 52 is mounted on the upper surface 58 of the substrate 50, and is electrically connected to the first electrodes 62 of the substrate 50 by wires 66.
The lens holder 54 has an upper end face 68, a lower upper face 70, and an opening 71 penetrating through the lens holder 54. The upper end of the opening 71 is formed with an internal thread 72, and the lower end of the opening 71 is formed with a breach 74. So that the internal diameter of the upper end of the opening 71 is smaller than the lower end of the opening 71, in the embodiment, the breach 74 of the opening 71 is a triangular form. The lens holder 54 is adhered on the upper surface 58 of the substrate 50 by glue 76, therefore, the photosensitive chip 52 is located within the opening 71 of the lens holder 54. Then, the glue 76 is filled within the breach 74 of the lens holder 54 and is covered over the wires 66.
The lens barrel 56 has an upper end face 80, a lower end face 82, and an external thread 84 screwed to the internal thread 72 of the lens holder 54.
Therefore, it is possible to select the substrate 50 having a smaller size to package the photosensitive chip 52 having the same original size. Thus, it is possible to obtain an image sensor module structure having smaller volume and to decrease the material costs for the substrate 50.
While the invention has been described by way of an example and in terms of a preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
| Number | Date | Country | Kind |
|---|---|---|---|
| 093211284 | Jul 2004 | TW | national |
