Patent Grant
11456363
The present invention relates to an indium phosphide crystal substrate.
W. A. Gault et al., “The Growth of High Quality III-V Crystal by the Vertical Gradient Freeze Method,” Defect Control in Semiconductors, 1990, pp. 653-660 (NPL 1) discloses a method of growing high-quality indium phosphide by the vertical gradient freeze (VGF) method. Japanese Patent Laying-Open No. 2008-239480 (PTL 1) discloses semiconductor crystals (such as GaAs crystals) composed of gallium arsenide, the semiconductor crystal having a diameter not smaller than six inches and an average dislocation density not higher than 1×104 cm−2, and further discloses semiconductor crystals preferably having average residual strain not more than 1×10−5 measured by a photoelastic method. M. Yamada, “High-sensitivity computer-controlled infrared polariscope,” Review of Scientific Instruments, Vol. 64, No. 7, July 1993, pp. 1815-1821 (NPL 2) discloses a method of measuring, by using a high-sensitivity computer-controlled infrared polariscope, small phase retardation and birefringence of a principal axis caused by residual strain in a commercially available semi-insulating gallium arsenide (111) wafer grown by the LEC method.
An indium phosphide crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the indium phosphide crystal substrate includes any of a flat portion and a notch portion. The indium phosphide crystal substrate contains any of sulfur atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, tin atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a first flat region extending over a width from the flat portion to a position at a distance of 2 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a first notch region extending over a width from the notch portion to a position at a distance of 2 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the indium phosphide crystal substrate contains the sulfur atoms, the indium phosphide crystal substrate has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when the indium phosphide crystal substrate contains any of the tin atoms and the iron atoms, the indium phosphide crystal substrate has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2.
An indium phosphide crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the indium phosphide crystal substrate includes any of a flat portion and a notch portion. The indium phosphide crystal substrate contains any of sulfur atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, tin atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. The indium phosphide crystal substrate has average residual strain not less than 5×10−6 and not more than 5×10−5 in any of a first flat region extending over a width from the flat portion to a position at a distance of 2 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a first notch region extending over a width from the notch portion to a position at a distance of 2 mm in a direction perpendicular to a curve indicating the notch portion in the main surface.
An indium phosphide crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 pin and not greater than 800 μm. A part of an outer edge of the indium phosphide crystal substrate includes any of a flat portion and a notch portion. The indium phosphide crystal substrate contains any of sulfur atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, tin atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a second flat region extending over a width from the flat portion to a position at a distance of 1 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a second notch region extending over a width from the notch portion to a position at a distance of 1 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the indium phosphide crystal substrate contains the sulfur atoms, the indium phosphide crystal substrate has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when the indium phosphide crystal substrate contains any of the tin atoms and the iron atoms, the indium phosphide crystal substrate has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2.
An indium phosphide crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 pun and not greater than 800 μm. A part of an outer edge of the indium phosphide crystal substrate includes any of a flat portion and a notch portion. The indium phosphide crystal substrate contains any of sulfur atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×10′8 cm−3, tin atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a second flat region extending over a width from the flat portion to a position at a distance of 1 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a second notch region extending over a width from the notch portion to a position at a distance of 1 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, the indium phosphide crystal substrate has average residual strain not less than 5×10−6 and not more than 5×10−5.
Indium phosphide disclosed in W. A. Gault et al., “The Growth of High Quality III-V Crystal by the Vertical Gradient Freeze Method,” Defect Control in Semiconductors, 1990, pp. 653-660 (NPL 1) is disadvantageously high in ratio of defects due to cracking (a crack defect ratio) in a flat portion and the vicinity thereof or a notch portion and the vicinity thereof in manufacturing of a substrate including any of the flat portion and the notch portion in a part of an outer edge (in manufacturing of a substrate with flat portion/notch portion) and in growth of an epitaxial layer on the substrate including any of the flat portion and the notch portion in a part of the outer edge (in growth of an epitaxial layer on a substrate with flat portion/notch portion).
Though “The Growth of High Quality III-V Crystal by the Vertical Gradient Freeze Method,” Defect Control in Semiconductors, 1990, pp. 653-660 (NPL 1) has discussed an average and a distribution of dislocation densities over all crystals of indium phosphide, it has not discussed an average dislocation density or average residual strain in the flat portion and the vicinity thereof or the notch portion and the vicinity thereof.
Though Japanese Patent Laying-Open No. 2008-239480 (PTL 1), “The Growth of High Quality III-V Crystal by the Vertical Gradient Freeze Method,” Defect Control in Semiconductors, 1990, pp. 653-660 (NPL 1), and M. Yamada, “High-sensitivity computer-controlled infrared polariscope,” Review of Scientific Instruments, Vol. 64, No. 7, July 1993, pp. 1815-1821 (NPL 2) have defined an average dislocation density or average residual strain over all crystals of gallium arsenide or the entire wafer, they have not discussed an average dislocation density or average residual strain in the flat portion and the vicinity thereof or the notch portion and the vicinity thereof in the indium phosphide crystal substrate.
Therefore, an object is to provide an indium phosphide crystal substrate low in ratio of defects due to cracking (crack defect ratio) in a flat portion and the vicinity thereof or a notch portion and the vicinity thereof in manufacturing of a substrate with flat portion/notch portion and in growth of an epitaxial layer on the substrate with flat portion/notch portion.
According to the above, an indium phosphide crystal substrate low in ratio of defects due to cracking (crack defect ratio) in a flat portion and the vicinity thereof or a notch portion and the vicinity thereof in manufacturing of a substrate with flat portion/notch portion and in growth of an epitaxial layer on the substrate with flat portion/notch portion can be provided.
Embodiments of the present invention will initially be listed and described. In order to clearly distinguish among a plurality of flat regions and notch regions, denotations as a first flat region and a first notch region or a second flat region and a second notch region are given.
[1] An indium phosphide (InP) crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of sulfur (S) atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, tin (Sn) atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron (Fe) atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a first flat region extending over a width from the flat portion to a position at a distance of 2 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a first notch region extending over a width from the notch portion to a position at a distance of 2 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the InP crystal substrate contains S atoms, the InP crystal substrate has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when the InP crystal substrate contains any of Sn atoms and Fe atoms, the InP crystal substrate has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2. Since the InP crystal substrate in the present manner has an average dislocation density within a prescribed range in any of the first flat region and the first notch region, it is low in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
[2] An InP crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of S atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. The InP crystal substrate has average residual strain not less than 5×10−6 and not more than 5×10−5 in any of a first flat region extending over a width from the flat portion to a position at a distance of 2 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a first notch region extending over a width from the notch portion to a position at a distance of 2 mm in a direction perpendicular to a curve indicating the notch portion in the main surface. Since the InP crystal substrate in the present manner has average residual strain within a prescribed range in any of the first flat region and the first notch region, it is low in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
[3] An InP crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of S atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a first flat region extending over a width from the flat portion to a position at a distance of 2 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a first notch region extending over a width from the notch portion to a position at a distance of 2 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the InP crystal substrate contains S atoms, the InP crystal substrate can have an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5, and when the InP crystal substrate contains any of Sn atoms and Fe atoms, the InP crystal substrate can have an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5. Since the InP crystal substrate in the present manner has an average dislocation density and average residual strain each within a prescribed range in any of the first flat region and the first notch region, it is lower in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
[4] An InP crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of sulfur (S) atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, tin (Sn) atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and iron (Fe) atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a second flat region extending over a width from the flat portion to a position at a distance of 1 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a second notch region extending over a width from the notch portion to a position at a distance of 1 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the InP crystal substrate contains S atoms, the InP crystal substrate has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when the InP crystal substrate contains any of Sn atoms and Fe atoms, the InP crystal substrate has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2. Since the InP crystal substrate in the present manner has an average dislocation density within a prescribed range in any of the second flat region and the second notch region and can control the average dislocation density in a partial region located in the vicinity of an outer circumferential portion of any of the first flat region and the first notch region to be within a certain range, the InP crystal substrate is low in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
[5] An InP crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of S atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×10′8 cm−3, Sn atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. The InP crystal substrate has average residual strain not less than 5×10−6 and not more than 5×10−5 in any of a second flat region extending over a width from the flat portion to a position at a distance of 1 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a second notch region extending over a width from the notch portion to a position at a distance of 1 mm in a direction perpendicular to a curve indicating the notch portion in the main surface. Since the InP crystal substrate in the present manner has average residual strain within a prescribed range in any of the second flat region and the second notch region and can control the average residual strain in a partial region located in the vicinity of an outer circumferential portion of any of the first flat region and the first notch region to be within a certain range, the InP crystal substrate is low in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
[6] An InP crystal substrate according to one manner of the present invention includes a main surface having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. A part of an outer edge of the InP crystal substrate includes any of a flat portion and a notch portion. The InP crystal substrate contains any of S atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. In any of a second flat region extending over a width from the flat portion to a position at a distance of 1 mm in a direction perpendicular to a straight line indicating the flat portion in the main surface and a second notch region extending over a width from the notch portion to a position at a distance of 1 mm in a direction perpendicular to a curve indicating the notch portion in the main surface, when the InP crystal substrate contains S atoms, the InP crystal substrate can have an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5, and when the InP crystal substrate contains any of Sn atoms and Fe atoms, the InP crystal substrate can have an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5. Since the InP crystal substrate in the present manner has an average dislocation density and average residual strain each within a prescribed range in any of the second flat region and the second notch region, it is lower in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
<InP Crystal Substrate>
Referring to
“Being perpendicular to a curve indicating the notch portion in the main surface” in the InP crystal substrate in the present embodiment means being perpendicular to a tangential line at each point on the curve indicating the notch portion in the main surface. The “curve” here means a line not being straight at least in part and may include a straight line in part. The crack defect ratio is varied by a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, or a difference in manufacturing of a substrate or growth of an epitaxial layer, and being low in crack defect ratio means a relatively low crack defect ratio so long as a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, and manufacturing of the substrate or growth of an epitaxial layer are identical.
InP crystal substrate 11 in the present embodiment has a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm. From a point of view of lowering in crack defect ratio also in InP crystal substrate 11 large in diameter, InP crystal substrate 11 has a diameter not smaller than 100 mm and not greater than 205 mm. From a point of view of lowering in crack defect ratio, InP crystal substrate 11 has a thickness not smaller than 300 μm and not greater than 800 μm.
A part of the outer edge of InP crystal substrate 11 in the present embodiment includes any of flat portion 11f (
InP crystal substrate 11 in the present embodiment contains any of S atoms at a concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at a concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at a concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3. Since an average dislocation density in InP crystal substrate 11 is varied by a concentration of contained S atoms, Sn atoms, and Fe atoms, the crack defect ratio can be lowered by adjusting, at a prescribed concentration of S atoms, Sn atoms, or Fe atoms, the average dislocation density in any of the first flat region and the first notch region to be within a prescribed range. InP crystal substrate 11 is provided with N-type conductivity with increase in concentration of contained S atoms. InP crystal substrate 11 is provided with N conductivity with increase in concentration of contained Sn atoms. InP crystal substrate 11 is provided with a semi-insulating property with increase in concentration of contained Fe atoms, and at a concentration of Fe atoms not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3, the InP crystal substrate has resistivity approximately not lower than 1.0×106 Ω·cm and not higher than 1.0×109 Ω·cm.
From a point of view of lowering in crack defect ratio of InP crystal substrate 11 in the present embodiment in manufacturing of the substrate and in growth of an epitaxial layer on the substrate, in any of first flat region 11fr extending over width WR from flat portion 11f to a position at a distance of 2 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and first notch region 11nr extending over width WR from notch portion 11n to a position at a distance of 2 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface, when InP crystal substrate 11 contains S atoms at the concentration above, it has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when InP crystal substrate 11 contains any of Sn atoms and Fe atoms at the concentration above, the InP crystal substrate has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2.
From a point of view of further lowering in crack defect ratio of InP crystal substrate 11 in the present embodiment in manufacturing of the substrate and in growth of an epitaxial layer on the substrate, in any of second flat region 11fr extending over width WR from flat portion 11f to a position at a distance of 1 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and second notch region 11nr extending over width WR from notch portion 11n to the position at a distance of 1 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface, when InP crystal substrate 11 contains S atoms at the concentration above, it has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2, and when InP crystal substrate 11 contains any of Sn atoms and Fe atoms at the concentration above, it has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2.
The second flat region and the second notch region are partial regions closer to flat portion 11f and notch portion 11n in the first flat region and the first notch region, respectively. The second flat region and the second notch region which are parts of the first flat region and the first notch region on a side of the outer circumferential portion may be higher in average dislocation density than the first flat region and the first notch region, respectively. Since crack originates from the outer circumferential portion, a value of the average dislocation density in the second flat region affects more on the crack defect ratio. Therefore, the InP crystal substrate having the average dislocation density within the range above also in the second flat region and the second notch region which may be high in average dislocation density is lower in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
Though a length LR of flat portion 11f is not particularly restricted, from a point of view of enhanced visibility and machine recognizability as well as securing a region from which a chip is taken, an OF length not shorter than 28 mm and not longer than 65 mm and an IF length not shorter than 13 mm and not longer than 45 mm are preferred. An InP crystal substrate having a diameter of four inches more preferably has an OF length not shorter than 28 mm and not longer than 38 mm and an IF length not shorter than 13 mm and not longer than 23 mm. An InP crystal substrate having a diameter of six inches more preferably has an OF length not shorter than 43 mm and not longer than 53 mm and an IF length not shorter than 25 mm and not longer than 35 mm. An InP crystal substrate having a diameter of eight inches more preferably has an OF length not shorter than 52 mm and not longer than 63 mm and an IF length not shorter than 32 mm and not longer than 43 mm.
From a point of view of enhanced visibility and machine recognizability as well as securing a region from which a chip is taken, a notch in notch portion 11n is shaped preferably by cutting off a portion having a size not smaller than 0.5 mm and not greater than 1.5 mm from the outer edge toward the center at an opening angle not smaller than 85° and not greater than 950 and more preferably by cutting off a portion having a size not smaller than 1.00 mm and not greater than 1.25 mm from the outer edge toward the center at an opening angle not smaller than 89° and not greater than 95°, and the direction of the central cut of the notch is preferably set to a [010] direction when viewed from the center.
Referring to
“Being perpendicular to the curve indicating the notch portion in the main surface” in the InP crystal substrate in the present embodiment means being perpendicular to a tangential line at each point on the curve indicating the notch portion in the main surface. The “curve” here means a line not being straight at least in part and may include a straight line in part. The crack defect ratio is varied by a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, or a difference in manufacturing of a substrate or growth of an epitaxial layer, and being low in crack defect ratio means a relatively low crack defect ratio so long as a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, and manufacturing of the substrate or growth of an epitaxial layer are identical.
Since the diameter not smaller than 100 mm and not greater than 205 mm, the thickness not smaller than 300 μm and not greater than 800 μm, S atoms at the concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at the concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at the concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3, of InP crystal substrate 11 in the present embodiment are the same as the diameter not smaller than 100 mm and not greater than 205 mm, the thickness not smaller than 300 μm and not greater than 800 μm, S atoms at the concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at the concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at the concentration not lower than 5.0×1018 cm−3 and not higher than 1.0×1017 cm−3, of InP crystal substrate 11 in Embodiment I-1, respectively, description will not be repeated. Since average residual strain in any of the first flat region and the first notch region of InP crystal substrate 11 is varied by a concentration of contained S atoms, Sn atoms, and Fe atoms, the crack defect ratio can be lowered by adjusting, at a prescribed concentration of S atoms, Sn atoms, or Fe atoms, average residual strain in any of the first flat region and the first notch region to be within a prescribed range.
From a point of view of lowering in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate, InP crystal substrate 11 in the present embodiment has average residual strain not less than 5×10−6 and not more than 5×10−5 in any of first flat region 11fr extending over width WR from flat portion 11f to a position at a distance of 2 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and first notch region 11nr extending over width WR from notch portion 11n to a position at a distance of 2 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface.
From a point of view of further lowering in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate, InP crystal substrate 11 in the present embodiment preferably has average residual strain not less than 5×10−6 and not more than 5×10−5 in any of second flat region 11fr extending over width WR from flat portion 11f to a position at a distance of 1 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and second notch region 11nr extending over width WR from notch portion 11n to a position at a distance of 1 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface.
The second flat region and the second notch region are partial regions closer to flat portion 11f and notch portion 11n in the first flat region and the first notch region, respectively. The second flat region and the second notch region which are parts of the first flat region and the first notch region on the outer circumferential side may be greater in average residual strain than the first flat region and the first notch region, respectively. Since crack originates from the outer circumferential portion, a value of average residual strain in the second flat region more affects the crack defect ratio. Therefore, the InP crystal substrate having the average residual strain within the range above also in the second flat region and the second notch region which may be great in average residual strain is lower in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
Since length LR (an OF length and an IF length) of flat portion 11f and the shape and the direction of the central cut of the notch of notch portion 11n of InP crystal substrate 11 in the present embodiment are the same as length LR (an OF length and an IF length) of flat portion 11f and the shape and the direction of the central cut of the notch of notch portion 11n of InP crystal substrate 11 in Embodiment I-1, respectively, description will not be repeated.
Referring to
“Being perpendicular to the curve indicating the notch portion in the main surface” in the InP crystal substrate in the present embodiment means being perpendicular to a tangential line at each point on the curve indicating the notch portion in the main surface. The “curve” here means a line not being straight at least in part and may include a straight line in part. The crack defect ratio is varied by a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, or a difference in manufacturing of a substrate or growth of an epitaxial layer, and being lower in crack defect ratio means a relatively lower crack defect ratio so long as a diameter of the InP crystal substrate, a type (S atoms, Sn atoms, or Fe atoms) or a concentration of contained atoms, and manufacturing of the substrate or growth of an epitaxial layer are identical.
Since the diameter not smaller than 100 mm and not greater than 205 mm, the thickness not smaller than 300 μm and not greater than 800 μm, S atoms at the concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at the concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at the concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3, of InP crystal substrate 11 in the present embodiment are the same as the diameter not smaller than 100 mm and not greater than 205 mm, the thickness not smaller than 300 μm and not greater than 800 μm, S atoms at the concentration not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3, Sn atoms at the concentration not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3, and Fe atoms at the concentration not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3, of InP crystal substrate 11 in Embodiments I-1 and I-2, respectively, description will not be repeated. Since the average dislocation density and the average residual strain in any of the first flat region and the first notch region of InP crystal substrate 11 are varied by the concentration of contained S atoms, Sn atoms, and Fe atoms, the crack defect ratio can be lowered by adjusting, at a prescribed concentration of S atoms, Sn atoms, or Fe atoms, the average dislocation density and the average residual strain in any of the first flat region and the first notch region to be within prescribed ranges.
From a point of view of lowering in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate in InP crystal substrate 11 in the present embodiment, in any of first flat region 11ft extending over width WR from flat portion 11f to a position at a distance of 2 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and first notch region 11nr extending over width WR from notch portion 11n to a position at a distance of 2 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface, when InP crystal substrate 11 contains S atoms, it preferably has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5, and when InP crystal substrate 11 contains any of Sn atoms and Fe atoms, it preferably has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5. The average dislocation density in InP crystal substrate 11 is measured as in Embodiment I-1 and the average residual strain in InP crystal substrate 11 is measured as in Embodiment I-2.
From a point of view of further lowering in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate in InP crystal substrate 11 in the present embodiment, in any of second flat region 11fr extending over width WR from flat portion 11f to a position at a distance of 1 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface and second notch region 11nr extending over width WR from notch portion 11n to a position at a distance of 1 mm in the direction perpendicular to the curve indicating notch portion 11n in the main surface, when InP crystal substrate 11 contains S atoms, it more preferably has an average dislocation density not lower than 10 cm−2 and not higher than 500 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5, and when InP crystal substrate 11 contains any of Sn atoms and Fe atoms, it more preferably has an average dislocation density not lower than 500 cm−2 and not higher than 5000 cm−2 and average residual strain not less than 5×10−6 and not more than 5×10−5.
The second flat region and the second notch region are partial regions closer to flat portion 11f and notch portion 11n in the first flat region and the first notch region, respectively. The second flat region and the second notch region which are parts of the first flat region and the first notch region on the outer circumferential side may be higher in average dislocation density and average residual strain than the first flat region and the first notch region, respectively. Since crack originates from the outer circumferential portion, values of the average dislocation density and the average residual strain in the second flat region more affects the crack defect ratio. Therefore, the InP crystal substrate having the average dislocation density and the average residual strain within the ranges above also in the second flat region and the second notch region which may be high in average dislocation density and average residual strain is lower in crack defect ratio in manufacturing of the substrate and in growth of an epitaxial layer on the substrate.
Since length LR (an OF length and an IF length) of flat portion 11f and a size of a cut portion in notch portion 11n in InP crystal substrate 11 in the present embodiment are the same as length LR (an OF length and an IF length) of flat portion 11f and a size of a cut portion in notch portion 11n in InP crystal substrate 11 in Embodiments I-1 and I-2, respectively, description will not be repeated.
<Method of Manufacturing InP Crystal Substrate>
Referring to
Referring to
Arrangement of heat-insulating material 104 is not particularly restricted. From the points of view above, however, the portion high in insulation of heat-insulating material 104 is preferably arranged on the outer side of the outer edge (outer circumference) of any of intended flat portion 10f and intended notch portion 10n of InP crystalline body 10 (that is, a portion to be any of flat portion 11f and notch portion 11n of InP crystal substrate 11). For example, a portion in heat-insulating material 104 on the outer side of the outer edge (outer circumference) of any of intended flat portion 10f and intended notch portion 10n of InP crystalline body 10 is preferably larger in thickness or made of a material higher in insulation than a portion other than that.
Heat-insulating material 104 may be an integrated material as shown in
Though a material for heat-insulating material 104 is not particularly restricted so long as it achieves a heat insulating effect, a carbon material, ceramics, silicon nitride (SiN), silicon carbide (SiC), quartz, and a cylindrical container filled with indium phosphide (InP) are preferred.
Referring to
Referring to
The method of grinding and/or polishing the outer edge (outer circumference) of cut InP crystal substrate 11 is not particularly restricted, and a grindstone 201 as shown, for example, in
In the method of manufacturing InP crystal substrate 11 in Embodiments II-1 to II-3, by combining the method of manufacturing InP crystal substrate 11 in Embodiment II-1 with the method of manufacturing InP crystal substrate 11 in Embodiment II-3 or by combining the method of manufacturing InP crystal substrate 11 in Embodiment II-2 with the method of manufacturing InP crystal substrate 11 in Embodiment II-3, a temperature difference between a portion of the InP crystal substrate where any of flat portion 11f and notch portion 11n is formed and a portion on the inner side of InP crystal substrate 11 can further be suppressed and a crystal defect such as dislocation and strain in first and second flat regions 11fr and first and second notch regions 11nr of InP crystal substrate 11 can further be lessened, so that an average dislocation density and average residual strain in first and second flat regions 11fr and first and second notch regions can be adjusted to be within prescribed ranges.
InP crystal substrate 11 including a main surface having a plane orientation of (100), including two flat portions 11f of orientation flat (OF) having a length of 32.5 mm and identification flat (IF) having a length of 18 mm in an outer edge, and having a diameter of four inches (101.6 mm), a thickness of 650 μm, and an S atomic concentration of 2.0×1018 cm−3 was fabricated by using a crystal growth apparatus shown in
1. Growth of InP Crystalline Body
InP crystalline body 10 was grown by the VB method shown in
2. Fabrication of InP Crystal Substrate
InP crystal substrate 11 was cut from taken InP crystalline body 10. By grinding and polishing the outer edge (outer circumference) of cut InP crystal substrate 11, two flat portions 11f of OF having a length of 32.5 mm and IF having a length of 18 mm were formed in a part of the outer edge (outer circumference) of InP crystal substrate 11. An amount of cooling water 202w injected from cooling water container 202u was increased only while flat portion 11f was formed. Thus, the average dislocation density and the average residual strain in the first flat region of obtained InP crystal substrate 11 could be adjusted to be within prescribed ranges.
3. Evaluation of Average Dislocation Density
The main surface of obtained InP crystal substrate 11 was mirror-polished, and thereafter the InP crystal substrate was immersed for two minutes at 25° C. in a mixture solution of 85 mass % of phosphoric acid and 47 mass % of hydrobromic acid at a volume ratio of 2:1. Thereafter, the average dislocation density was measured by using a microscope, as an average per unit area of etch pits (etch pit average density) produced in first flat region 11fr (a region extending over a width from flat portion 11f to a position at a distance of 2 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface) in the main surface. In Experimental Examples including the present Experimental Example, the average dislocation density in first or second flat region 11fr or first or second notch region 11nr in the main surface is the same as the average dislocation density in first flat region 11frc or first notch region 11nrc in the central portion exposed by grinding.
4. Evaluation of Average Residual Strain
After the main surface of obtained InP crystal substrate 11 was mirror-polished, incident light having a beam diameter of 100 μm and a wavelength of 1.3 μm was transmitted perpendicularly to the main surface, to points arranged at pitches of 200 μm over the entire main surface in mirror-polished first flat region 11fr (a region extending over a width from flat portion 11f to a position at a distance of 2 mm in the direction perpendicular to the straight line indicating flat portion 11f in the main surface). Phase retardation of birefringence and an orientation of a principal axis of a sample were calculated based on relation between obtained intensity of transmitted light and a polarization angle. Absolute values of differences in elongation and contraction strain in a direction of radius and a direction of a tangential line at those points in a cylindrical coordinate system were calculated, and an average of the absolute values of the differences in elongation and contraction strain at those points was calculated as the average residual strain.
5. Evaluation of Crack Defect Ratio
The crack defect ratio refers to a percentage of samples where crack occurred with respect to the total number of samples in manufacturing of a substrate and in growth of an epitaxial layer below.
(1) In Manufacturing of Substrate
A crack defect ratio of obtained InP crystal substrate 11 was calculated at the time when the InP crystal substrate was subjected to double-sided polishing as primary polishing for 90 minutes under such conditions as the number of rotations of an upper surface of 15 rpm, the number of rotations of a lower surface of 35 rpm, carrier revolution of 10 rpm, and carrier rotation of 5 rpm with an abrasive containing colloidal silica being dropped at 300 cm−3/minute and with the use of a polishing cloth of a nonwoven type and subjected to single-sided polishing as finishing polishing for 15 minutes under such conditions as the number of revolutions of the upper surface of 60 rpm and the number of revolutions of the lower surface of 60 rpm with an abrasive not containing colloidal silica being dropped at 150 cm−3/minute and with the use of a polishing cloth of a suede type.
(2) In Growth of Epitaxial Layer
A crack defect ratio of obtained InP crystal substrate 11 was calculated after it was subjected to primary polishing and finishing polishing and thereafter an InP layer having a thickness of 1 μm was grown as an epitaxial layer on the main surface subjected to finishing polishing by metal-organic chemical vapor deposition (MOCVD) under such conditions as a temperature of a crystal growth atmosphere of 600° C., a pressure of the crystal growth atmosphere of 50 Torr, and a V/III ratio (representing a ratio of a molarity of a V group element to a molarity of a III group element, to be understood similarly below) of 100.
Table 1 summarizes a crack defect ratio in manufacturing of the substrate and Table 2 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 10 cm−2 to 500 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 2 cm−2 and 1500 cm−2 with Examples where the average residual strain in the first flat region was from 5.0×10−2 to 5.0×10−5 and Comparative Examples where the average residual strain in the first flat region was 3.0×10−6 and 1.0×10−4 in the present Experimental Example (Experimental Example 1).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 1 except for setting an S atomic concentration to 5.0×1018 cm−3. Table 3 summarizes a crack defect ratio in manufacturing of the substrate and Table 4 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 15 cm−2 to 480 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 1 cm−2 and 2000 cm−2 with Examples where the average residual strain in the first flat region was from 5.3×10−6 to 4.5×10−5 and Comparative Examples where the average residual strain in the first flat region was 2.2×10−6 and 2.0×10−4 in the present Experimental Example (Experimental Example 2).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 1 except for setting an S atomic concentration to 8.0×1018 cm−3. Table 5 summarizes a crack defect ratio in manufacturing of the substrate and Table 6 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 12 cm−2 to 460 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 3 cm−2 and 1000 cm−2 with Examples where the average residual strain in the first flat region was from 5.1×10−6 to 4.8×10−5 and Comparative Examples where the average residual strain in the first flat region was 1.0×10−6 and 1.5×10−4 in the present Experimental Example (Experimental Example 3).
InP crystal substrate 11 was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 1 except for setting an Sn atomic concentration to 1.0×1018 cm−3 instead of the S atomic concentration of 2.0×1018 cm−3. Table 7 summarizes a crack defect ratio in manufacturing of the substrate and Table 8 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 500 cm−2 to 5000 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 200 cm−2 and 8500 cm−2 with Examples where the average residual strain in the first flat region was from 5.0×10−6 to 4.7×10−5 and Comparative Examples where the average residual strain in the first flat region was 3.0×10−6 and 1.2×10−4 in the present Experimental Example (Experimental Example 4).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 4 except for setting an Sn atomic concentration to 3.0×101 cm−3. Table 9 summarizes a crack defect ratio in manufacturing of the substrate and Table 10 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 550 cm−2 to 4800 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 100 cm−2 and 12000 cm−2 with Examples where the average residual strain in the first flat region was from 5.1×10−6 to 4.8×10−5 and Comparative Examples where the average residual strain in the first flat region was 2.5×10−6 and 2.0×10−4 in the present Experimental Example (Experimental Example 5).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 4 except for setting an Sn atomic concentration to 4.0×1018 cm−3. Table 11 summarizes a crack defect ratio in manufacturing of the substrate and Table 12 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 510 cm−2 to 4700 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 10 cm−2 and 7500 cm−2 with Examples where the average residual strain in the first flat region was from 5.5×10−6 to 5.0×10−5 and Comparative Examples where the average residual strain in the first flat region was 4.0×10−6 and 1.5×10−4 in the present Experimental Example (Experimental Example 6).
InP crystal substrate 11 was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 1 except for setting an Fe atomic concentration to 1.0×1016 cm−3 instead of the S atomic concentration of 2.0×1018 cm−3. Table 13 summarizes a crack defect ratio in manufacturing of the substrate and Table 14 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 500 cm−2 to 5000 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 200 cm−2 and 8500 cm−2 with Examples where the average residual strain in the first flat region was from 5.5×10−6 to 5.0×10−5 and Comparative Examples where the average residual strain in the first flat region was 2.0×10−6 and 2.0×10−4 in the present Experimental Example (Experimental Example 7).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 m which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 7 except for setting an Fe atomic concentration to 2.0×1016 cm−3. Table 15 summarizes a crack defect ratio in manufacturing of the substrate and Table 16 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 550 cm−2 to 4500 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 100 cm−2 and 15000 cm−2 with Examples where the average residual strain in the first flat region was from 5.0×10−6 to 4.9×10−5 and Comparative Examples where the average residual strain in the first flat region was 3.0×10−6 and 1.0×10−4 in the present Experimental Example (Experimental Example 8).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first flat region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 7 except for setting an Fe atomic concentration to 5.0×1016 cm−3. Table 17 summarizes a crack defect ratio in manufacturing of the substrate and Table 18 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first flat region was from 510 cm−2 to 4800 cm−2 and Comparative Examples where the average dislocation density in the first flat region was 260 cm−2 and 7500 cm−2 with Examples where the average residual strain in the first flat region was from 5.6×10−6 to 4.5×10−5 and Comparative Examples where the average residual strain in the first flat region was 3.5×10−6 and 1.5×10−4 in the present Experimental Example (Experimental Example 9).
InP crystal substrate 11 including a main surface having a plane orientation of (100), including notch portion 11n machined into a shape by cutting off a portion extending by 1.0 mm from the outer edge toward the center at an opening angle of 90° in a [010] direction when the direction of the central cut of the notch was viewed from the center of the substrate, and having a diameter of six inches (152.4 mm), a thickness of 650 μm, and an Fe atomic concentration of 2.0×1016 cm−3 was fabricated by using a crystal growth apparatus shown in
1. Growth of InP Crystalline Body
InP crystalline body 10 was grown by the VB method shown in
2. Fabrication of InP Crystal Substrate
InP crystal substrate 11 was cut from taken InP crystalline body 10. By grinding and polishing the outer edge (outer circumference) of cut InP crystal substrate 11, notch portion 11n machined into a shape by cutting off a portion extending by 1.0 mm from the outer edge toward the center at an opening angle of 90° in a [010] direction when the direction of the central cut of the notch was viewed from the center of the substrate was provided in a part of the outer edge (outer circumference) of InP crystal substrate 11. An amount of cooling water 202w injected from cooling water container 202u was increased only while notch portion 11n was provided. The average dislocation density and the average residual strain in obtained InP crystal substrate 11 could thus be adjusted to be within prescribed ranges.
The average dislocation density, the average residual strain, and the crack defect ratio of obtained InP crystal substrate 11 were evaluated as in Experimental Example 1. Table 19 summarizes a crack defect ratio in manufacturing of the substrate and Table 20 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first notch region was from 500 cm−2 to 4900 cm−2 and Comparative Examples where the average dislocation density in the first notch region was 250 cm−2 and 22000 cm−2 with Examples where the average residual strain in the first notch region was from 5.2×10−6 to 4.7×10−5 and Comparative Examples where the average residual strain in the first notch region was 2.5×10−6 and 1.5×10−4 in the present Experimental Example (Experimental Example 10).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the first notch region were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 10 except for setting a diameter to eight inches (203.2 mm). Table 21 summarizes a crack defect ratio in manufacturing of the substrate and Table 22 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the first notch region was from 520 cm−2 to 4500 cm−2 and Comparative Examples where the average dislocation density in the first notch region was 300 cm−2 and 19000 cm−2 with Examples where the average residual strain in the first notch region was from 5.5×10−6 to 5.0×10−5 and Comparative Examples where the average residual strain in the first notch region was 4.0×10−6 and 1.3×10−4 in the present Experimental Example (Experimental Example 11).
As shown in Experimental Examples 1 to 11, it can be seen that the crack defect ratio in manufacturing of the substrate and in growth of the epitaxial layer on the substrate is low in the InP crystal substrate having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm and including any of the flat portion and the notch portion in a part of the outer edge thereof when a concentration of S atoms is not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3 and when the average dislocation density is not lower than 10 cm−2 and not higher than 500 cm−2 or the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the first flat region and the first notch region and when a concentration of Sn atoms is not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3 or a concentration of Fe atoms is not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3 and when the average dislocation density is not lower than 500 cm−2 and not higher than 5000 cm−2 or the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the first flat region and the first notch region.
Furthermore, it can be seen that the crack defect ratio in manufacturing of the substrate and in growth of the epitaxial layer on the substrate is lower in the InP crystal substrate above when a concentration of S atoms is not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3 and when the average dislocation density is not lower than 10 cm−2 and not higher than 500 cm−2 and the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the first flat region and the first notch region and when a concentration of Sn atoms is not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3 or a concentration of Fe atoms is not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−2 and when the average dislocation density is not lower than 500 cm−2 and not higher than 5000 cm−2 and the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the first flat region and the first notch region.
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the second flat region (a region extending over a width from the flat portion to a position at a distance of 1 mm in the direction perpendicular to the straight line indicating the flat portion in the main surface) were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 2 except for setting a thickness of a heat-insulating material located on the outer side of the intended flat portion of the InP crystalline body to twice as large as the thickness in Experimental Example 2. Table 23 summarizes a crack defect ratio in manufacturing of the substrate and Table 24 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the second flat region was from 15 cm−2 to 480 cm−2 and Comparative Examples where the average dislocation density in the second flat region was 1 cm−2 and 2000 cm−2 with Examples where the average residual strain in the second flat region was from 5.3×10−6 to 4.5×10−5 and Comparative Examples where the average residual strain in the second flat region was 2.2×10−6 and 2.0×10−4 in the present Experimental Example (Experimental Example 12).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the second flat region (a region extending over a width from the flat portion to a position at a distance of 1 mm in the direction perpendicular to the straight line indicating the flat portion in the main surface) were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 5 except for setting a thickness of a heat-insulating material located on the outer side of the intended flat portion of the InP crystalline body to twice as large as the thickness in Experimental Example 5. Table 25 summarizes a crack defect ratio in manufacturing of the substrate and Table 26 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the second flat region was from 550 cm−2 to 4800 cm−2 and Comparative Examples where the average dislocation density in the second flat region was 100 cm−2 and 12000 cm−2 with Examples where the average residual strain in the second flat region was from 5.1×10−6 to 4.8×10−5 and Comparative Examples where the average residual strain in the second flat region was 2.5×10−6 and 2.0×10−4 in the present Experimental Example (Experimental Example 13).
The InP crystal substrate was fabricated, the average dislocation density and the average residual strain in the second notch region (a region extending over a width from the notch portion to a position at a distance of 1 mm in the direction perpendicular to the curve indicating the notch portion in the main surface) were measured, and a crack defect ratio in polishing of the InP crystal substrate and in growth of the InP layer having a thickness of 1 μm which was the epitaxial layer on the InP crystal substrate after polishing of the InP crystal substrate was calculated as in Experimental Example 10 except for setting a thickness of a heat-insulating material located on the outer side of the intended notch portion of the InP crystalline body to twice as large as the thickness in Experimental Example 10. Table 27 summarizes a crack defect ratio in manufacturing of the substrate and Table 28 summarizes a crack defect ratio in growth of the epitaxial layer, in combinations of Examples where the average dislocation density in the second notch region was from 500 cm−2 to 4900 cm−2 and Comparative Examples where the average dislocation density in the second notch region was 250 cm−2 and 22000 cm−2 with Examples where the average residual strain in the second notch region was from 5.2×10−6 to 4.7×10−5 and Comparative Examples where the average residual strain in the second notch region was 2.5×10−6 and 1.5×10−4 in the present Experimental Example (Experimental Example 14).
As shown in Experimental Examples 12 to 14, it can be seen that the crack defect ratio in manufacturing of the substrate and in growth of the epitaxial layer on the substrate is low in the InP crystal substrate having a diameter not smaller than 100 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm and including any of the flat portion and the notch portion in a part of the outer edge thereof when a concentration of S atoms is not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3 and when the average dislocation density is not lower than 10 cm−2 and not higher than 500 cm−2 or the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the second flat region and the second notch region and when a concentration of Sn atoms is not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3 or a concentration of Fe atoms is not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3 and when the average dislocation density is not lower than 500 cm−2 and not higher than 5000 cm−2 or the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the second flat region and the second notch region.
Furthermore, it can be seen that the crack defect ratio in manufacturing of the substrate and in growth of the epitaxial layer on the substrate is lower in the InP crystal substrate above when a concentration of S atoms is not lower than 2.0×1018 cm−3 and not higher than 8.0×1018 cm−3 and when the average dislocation density is not lower than 10 cm−2 and not higher than 500 cm−2 and the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the second flat region and the second notch region and when a concentration of Sn atoms is not lower than 1.0×1018 cm−3 and not higher than 4.0×1018 cm−3 or a concentration of Fe atoms is not lower than 5.0×1015 cm−3 and not higher than 1.0×1017 cm−3 and when the average dislocation density is not lower than 500 cm−2 and not higher than 5000 cm−2 and the average residual strain is not less than 5×10−6 and not more than 5×10−5 in any of the second flat region and the second notch region.
It should be understood that the embodiments and Examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims rather than the embodiments and Examples above and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
9 InP source material; 10 InP crystalline body; 10f intended flat portion; 10n intended notch portion; 10s InP seed crystal; 11 InP crystal substrate; 11f flat portion; 11fr, 11frc first flat region, second flat region; 11n notch portion; 11nr, 11nrc first notch region, second notch region; 100 crystal growth apparatus; 101 crucible; 102 crucible base; 103 heater; 104 heat-insulating material; 105 pressure vessel; 201 grindstone; 202u cooling water container; 202w cooling water; LR length; WR width; PL polarized light
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2018/006655 | 2/23/2018 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2019/163082 | 8/29/2019 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 20020039375 | Shoji | Apr 2002 | A1 |
| 20070101924 | Kawase | May 2007 | A1 |
| 20090072205 | Kawase | Mar 2009 | A1 |
| 20180033739 | Seddon | Feb 2018 | A1 |
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|---|---|---|
| H05-339100 | Dec 1993 | JP |
| H08-119800 | May 1996 | JP |
| H09-321105 | Dec 1997 | JP |
| 2000-103699 | Apr 2000 | JP |
| 2006-188403 | Jul 2006 | JP |
| 2006-203071 | Aug 2006 | JP |
| 2008-239480 | Oct 2008 | JP |
| 2011-148694 | Aug 2011 | JP |
| 2012-31004 | Feb 2012 | JP |
| WO-2004106597 | Dec 2004 | WO |
| Entry |
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| Number | Date | Country | |
|---|---|---|---|
| 20200066850 A1 | Feb 2020 | US |
