Claims
- 1. A resin composition comprising at least one thermosetting resin and decabromodiphenylethane.
- 2. The resin composition of claim 1 wherein the thermosetting resin includes a polyimide resin.
- 3. The resin composition of claim 2 wherein the decabromodiphenylethane is present in the resin system in an amount ranging from about 0.1 to about 20.0 wt % on a dry basis.
- 4. The resin composition of claim 1 including an curing agent.
- 5. The resin composition of claim 1 including a filler.
- 6. The resin composition of claim 1 including a toughener.
- 7. A prepreg comprising a resin composition and a core material, wherein the resin composition comprises at least one thermosetting resin and decabromodiphenylethane.
- 8. The prepreg of claim 7 wherein the thermosetting resin includes a polyimide resin.
- 9. The prepreg of claim 8 wherein the decabromodiphenylethane is present in the resin composition in an amount ranging from about 0.1 to about 20.0 wt % on a dry basis.
- 10. The prepreg of claim 7 wherein the resin composition includes an curing agent.
- 11. The prepreg of claim 7 wherein the resin composition includes a filler.
- 12. The prepreg of claim 7 wherein the resin composition includes a toughener.
- 13. A laminate comprising one or more prepregs and one or more sheets of conducting foil, wherein the one or more prepregs comprises a resin composition and a core material, and wherein the resin composition comprises at least one thermosetting resin and decabromodiphenylethane.
- 14. The laminate of claim 13 wherein the thermosetting resin includes a polyimide resin.
- 15. The laminate of claim 14 wherein the decabromodiphenylethane is present in the resin composition in an amount ranging from about 0.1 to about 20.0 wt % on a dry basis.
- 16. The laminate of claim 13 wherein the resin composition includes an curing agent.
- 17. The laminate of claim 13 wherein the resin composition includes a filler.
- 18. The laminate of claim 13 wherein the resin composition includes a toughener.
- 19. A composite manufactured from the resin composition of claim 1.
- 20. A composite manufactured from the resin composition of claim 2.
- 21. A resin composition comprising a polyimide resin, decabromodiphenylethane and methacrylate butadiene styrene core shell particles.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority from U.S. Provisional Application Serial No. 60/363,576, filed Mar. 12, 2002. This application is also a continuation in part of U.S. patent application Ser. No. 10/309,720, filed Dec. 4, 2002, which claims the benefit of U.S. Provisional Application Serial No. 60/337,362, filed Dec. 5, 2001. This application is also a continuation in part of U.S. patent application Ser. No. 10/310,418, filed Dec. 5, 2002, which claims the benefit of U.S. Provisional Application Serial No. 60/337,322, filed Dec. 5, 2001. The disclosure of each of the above documents is incorporated herein by reference in its entirety.
Provisional Applications (3)
|
Number |
Date |
Country |
|
60363576 |
Mar 2002 |
US |
|
60337362 |
Dec 2001 |
US |
|
60337322 |
Dec 2001 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
10309720 |
Dec 2002 |
US |
Child |
10385044 |
Mar 2003 |
US |
Parent |
10310418 |
Dec 2002 |
US |
Child |
10385044 |
Mar 2003 |
US |