Claims
- 1. A method of connecting a leadless chip carrier (LCC) to a substrate, said chip carrier having a like array of metallic pads, said substrate having a like array of metallic pads corresponding to the peripheral pads and at least one central metallic pad, said method comprising:
- depositing on each said substrate pads corresponding to the peripheral pads a layer of solder paste of a given composition and thickness;
- depositing on said at least one central pad a layer of said solder paste of said thickness over an area of at least about double the area of said central pad; and
- applying thermal energy to said LCC so that the LCC shades said central pad and its layer of solder paste from the thermal energy to melt the solder paste at said peripheral array of pads prior to the melting of the solder paste at said central pad, said solder at said central pad tending to form a ball to thereby lift the LCC and stretch the melted solder at said peripheral array of pads.
- 2. The method of claim 1 further including depositing a layer of said solder paste on said LCC pads.
- 3. The method of claim 1 wherein said thickness is in the range of about 10-30 mils.
- 4. The method of claim 1 wherein said at least one central pad comprises a symmetrical array of at least four pads, each of larger area than the areas of the pads of said peripheral array, said method comprising depositing a layer of said solder paste on each said at least four pads of said given thickness, each layer over an area of about double the area of the corresponding one of said at least four pads.
- 5. The method of claim 1 wherein said applying thermal energy includes exposing said LCC to infrared radiation for a given time interval.
- 6. A method of soldering an LCC device to contacts on a substrate wherein the LCC device and substrate each have an outer array of contact pads and at least one central metallic pad, said method comprising:
- coating said pads of at least the substrate with a layer of solder paste of a given composition and thickness;
- coating said at least one pad of at least the substrate with a layer of said solder paste of said given composition and thickness over an area greater than the area of said at least one pad; and
- applying thermal radiation onto said LCC so that the LCC shades the at least one central pad from the radiation so that the solder paste on the at least one central pad melts after the solder paste on the outer array of contact pad melts.
Parent Case Info
This application is a continuation Ser. No. 945,686, filed Dec. 23, 1986 and now abandoned.
Government Interests
This invention was made with Government support under contract No. DAAL01-85-C-0633 awarded by the Department of the Army. The Government has certain rights in this invention.
US Referenced Citations (10)
Non-Patent Literature Citations (2)
Entry |
"Soldering Techniques for Surface Mounted Leadless Chip Carriers," by: R. G. Spiecker et al., presented at Int'l. Society for Hybrid Microelectronics (ISHM), Atlanta, GA, Oct. 6-8, 1986. |
"Development of a New Micro-Solder Bonding Method for VLSI's," by R. Satoh et al., IEPS Proceedings, 1983, pp. 455-461. |
Continuations (1)
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Number |
Date |
Country |
Parent |
945686 |
Dec 1986 |
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