Claims
- 1. A method of manufacture of a display apparatus of light emitting devices disposed on a substrate with light emitting devices having light emitting chips and first layers covering the light emitting chips comprising:
a step to dispose light emitting devices on the substrate; and a step to form a second layer including light scattering material at least over the upper surfaces of the first layer on the observer's side of the substrate.
- 2. A display apparatus method of manufacture as recited in claim 1 further comprising a step to simultaneously form a second layer including light scattering material at least over the upper surface of the substrate on the observer's side.
- 3. A display apparatus method of manufacture as recited in claim 2 wherein the second layer is formed over the upper surfaces of the first layer and the substrate by spray application.
- 4. A display apparatus method of manufacture as recited in claim 3 with each light emitting device comprising:
a light emitting chip; a first layer covering the light emitting chip; and a second layer including light scattering material provided at least over the first layer; and wherein the surface of the second layer has a plurality of protrusions following the topology of the light scattering material; the light emitting device has a package with a cavity and the light emitting chip is disposed on the surface at the base of the cavity; the first layer is positioned at least within the cavity; the upper surface of the first layer is a concave surface; the second layer is positioned at least over the concave surface of the first layer; and the light scattering material has particulate form.
Priority Claims (3)
Number |
Date |
Country |
Kind |
219932/2000 |
Jul 2000 |
JP |
|
202600/2001 |
Jul 2001 |
JP |
|
217915/2001 |
Jul 2001 |
JP |
|
Parent Case Info
[0001] This application is a Divisional application of Ser. No. 10/640,672, filed Aug. 14, 2003, which is a Divisional application of Ser. No. 09/907,715, now U.S. Pat. No. 6,657,382.
[0002] This application is based on applications No. 2000-219932 filed in Japan on Jul. 21, 2000, No. 2001-202600 filed in Japan on Jul. 3, 2001, and No. 2001-217915 filed in Japan on Jul. 18, 2001, the contents of which are incorporated hereinto by reference.
Divisions (2)
|
Number |
Date |
Country |
Parent |
10640672 |
Aug 2003 |
US |
Child |
10880497 |
Jul 2004 |
US |
Parent |
09907715 |
Jul 2001 |
US |
Child |
10640672 |
Aug 2003 |
US |