Patent Application
20230317423
The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
In forming semiconductor devices, plasma processing chambers are used to process the substrates. Some plasma processing chambers have component parts that are eroded during plasma processing. Coatings may be used to protect the component parts. However, temperature differentials and other factors may cause the coatings to delaminate from the component part.
Several commercial and technological processes require the use of reactive fluorine species; some of these processes also involve elevated temperatures and/or high vacuum environments. For example, a chamber cleaning process may use a remote fluorine plasma. If the chamber is not allowed to sufficiently cool, plasma-facing surfaces of the chamber may be exposed to the reactive fluorine species at a temperature above 500° C. at pressures below 10 Torr. Such an environment causes corrosion/erosion of the plasma-facing surface. Components designed to survive such environments are typically made of or coated with aluminum, nickel, aluminum oxide, or aluminum nitride. Reaction products of nickel fluoride and aluminum fluoride are formed when these surfaces are exposed to reactive fluorine species. The nickel fluoride and aluminum fluoride serve to arrest further reaction with fluorine at low and moderate temperatures but pose a risk to the intended process under conditions of high temperature and/or high vacuum. The nickel fluoride and aluminum fluoride are potentially emitted (eg. evaporated, delaminated, detached) from the material surface. As the reaction proceeds, particles of nickel fluoride and aluminum fluoride can also be generated, resulting in particulate and/or chemical contamination of the intended process. These risks limit the temperature at which components can safely be exposed to reactive fluorine species to approximately 400 to 500 degrees Celsius.
To achieve the foregoing and in accordance with the purpose of the present disclosure, a component for use in a plasma processing chamber system is provided. The component comprises a bulk component body comprising magnesium aluminum oxynitride and sintering aids, wherein the sintering aids comprise at least one of yttria, yttrium aluminate, rare earth metal oxide, and rare earth metal aluminate.
In another manifestation, a method for forming a component for use in a processing chamber is provided. A bulk component body is sintered from a sintering powder comprising sintering aids and a mixture of powders that form magnesium aluminum oxynitride when sintered together, wherein the sintering is at a temperature of at least 1000° C. to form a component comprising magnesium aluminum oxynitride and sintering aids, wherein the sintering aids comprise at least one of yttria, yttrium aluminate, rare earth metal oxide, and rare earth metal aluminate.
These and other features of the present disclosure will be described in more detail below in the detailed description and in conjunction with the following figures.
The present disclosure is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
The present disclosure will now be described in detail with reference to a few preferred embodiments thereof as illustrated in the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. It will be apparent, however, to one skilled in the art, that the present disclosure may be practiced without some or all of these specific details. In other instances, well-known process steps and/or structures have not been described in detail in order to not unnecessarily obscure the present disclosure.
Embodiments provide a component for a plasma processing chamber that is resistant to erosion when exposed to a reactive fluorine from a remote fluorine plasma at a temperature above 500° C. and a pressure below 10 Torr. Such a component may comprise magnesium aluminum oxynitride and sintering aids.
To facilitate understanding,
In this embodiment, the sintering that is used to form the bulk component body from sintering powder may use one of various sintering processes, such as cold pressed, hot pressed, warm pressed, hot isostatic press, green sheet, and spark plasma sintering. In some embodiments, the sintering powder may be heated to at least 1000° C. for at least 2 hours. In some embodiments, the sintering is heated for at least 1 day. In this embodiment, pressure is provided in a range of about 28 megapascals (MPa) to about 69 MPa. In this embodiment, the powder is heated to a temperature in the range of about 1100° C. to 1700° C.
In various embodiments, the bulk component body 204 is machined and polished after sintering. The machining may be at least one of drilling, grinding, water-jet cutting, media blasting, and laser ablation.
The component 200 is mounted in a plasma processing chamber (step 108). In this embodiment, the component 200 may be used as a pedestal for supporting a process wafer or substrate in a plasma processing chamber.
To facilitate understanding,
The plasma power supply 306 and the wafer bias voltage power supply 316 may be configured to operate at specific radio frequencies such as, for example, 13.56 megahertz (MHz), 27 MHz, 2 MHz, 60 MHz, 400 kilohertz (kHz), 2.54 gigahertz (GHz), or combinations thereof. Plasma power supply 306 and wafer bias voltage power supply 316 may be appropriately sized to supply a range of powers in order to achieve the desired process performance. For example, in one embodiment, the plasma power supply 306 may supply the power in a range of 50 to 5000 Watts, and the wafer bias voltage power supply 316 may supply a bias voltage of in a range of 20 to 2000 volts (V). In addition, the TCP coil 310 and/or the component 200 may be comprised of two or more sub-coils or sub-electrodes. The sub-coils or sub-electrodes may be powered by a single power supply or powered by multiple power supplies.
As shown in
A process wafer 366 is placed in the plasma processing chamber 304 (step 112). The process wafer 366 is placed on the component 200, as shown. A plasma process is applied to the process wafer 366 (step 116). In this example, the plasma process of the process wafer 366 is used to provide an etch of part of a stack on the process wafer 366, such as for etching a tungsten containing layer in the stack. In this embodiment, the plasma process would heat the pedestal to a temperature above 550° C. In addition, the plasma process deposits residue on the interior of the plasma processing chamber. After the plasma processing of the process wafer 366, the process wafer 366 is removed from the plasma processing chamber 304 (step 120). The plasma processing chamber 304 is cleaned to remove deposited residue (step 124). In this embodiment, a reactive fluorine from a remote fluorine plasma is used to clean the interior of the plasma processing chamber 304. A pressure in the range of 1 milliTorr (mTorr) to 10 Torr is provided. The component 200 has not sufficiently cooled and remains at a temperature above 500° C. After the cleaning is completed, a new process wafer 366 may be placed in the plasma processing chamber 304 (step 112) to begin a new cycle.
It has been found that components in the prior art when exposed to reactive fluorine species at temperatures above 500° C. and pressures below 10 Torr form nickel fluoride or aluminum fluoride particles that act as contaminants. Allowing the component 200 more time to cool causes a decrease in throughput. However, magnesium aluminum oxynitride components with sintering aids are more resistant to corrosion/erosion and the formation of contaminants in such conditions. It is believed that the presence of nitride makes the component 200 more resistant to thermal shock and coefficient of thermal expansion (CTE)-compatible. In some embodiments, the reactive fluorine may be created by a thermal process instead of being from a remote plasma. In addition, the addition of nitride provides improved mechanical properties to allow the bulk component to be made of magnesium aluminum oxynitride, instead of having only a layer of magnesium aluminum oxide.
In various embodiments, the component 200 may be other parts of a plasma processing chamber 304, such as confinement rings, edge rings, the electrostatic chuck, ground rings, chamber liners, door liners, the pinnacle, a showerhead, a dielectric power window, gas injectors, edge rings, ceramic transfer arms, or other components. Other components of other types of plasma processing chambers may be used. Examples of other types of plasma processing chambers in which the component 200 may be used are capacitively coupled plasma processing chambers and bevel plasma processing chambers. The component 200 may be plasma exclusion rings on a bevel etch chamber In another example, the plasma processing chamber may be a dielectric processing chamber or conductor processing chamber.
In some embodiments, the component is sintered from powder comprising magnesium aluminum oxynitride with a spinel phase. In other embodiments, a set of reagents are chosen and prepared in proportions calculated to produce magnesium aluminum oxynitride spinel. In a preferred embodiment, the mixture of reagents comprises magnesium aluminate spinel, aluminum nitride, and a sintering aid. Other embodiments include mixtures of aluminum oxide, magnesium oxide, and aluminum nitride; mixtures of aluminum oxynitride and magnesium oxide; mixtures of magnesium aluminate spinel and metallic aluminum, to which an excess of nitrogen gas is supplied during high-temperature processing to carry out nitridation prior to or simultaneous with sintering; mixtures of magnesium oxide and aluminum nitride, to which a controlled amount of oxygen is supplied during high temperature processing so as to partially oxidize the mixture, etc.
Other methods may be used to form a component body out of magnesium aluminum oxynitride with the spinel phase. For example, an additive manufacturing process, such as 3D printing of a magnesium aluminum oxynitride with spinel phase powder may be used to form a component body. In some embodiments, the additive manufacturing may use localized heating to form the component body. In other embodiments, additive manufacturing may be used to form a green component body. The green component body is then fired.
In some embodiments, other reactive halogen species may be used in place of reactive fluorine species. When the component 200 is exposed to reactive fluorine or another reactive halogen, the fluorine may replace oxygen and other components leaving a magnesium fluoride layer. The magnesium fluoride is stable and is less likely to form particles than nickel fluoride or aluminum fluoride. The magnesium fluoride layer provides a barrier to further fluorine attack. The sintering aid limits grain boundary growth. The sintering aid acts as a barrier to prevent one grain from absorbing another grain. In some embodiments, the magnesium aluminum oxide spinel component is transparent so that the component may be used as a window or viewport.
In various embodiments, the powders that form magnesium aluminum oxynitride when sintered together comprise between 2% to 17% Mg by weight and 0.2% to 6% N by weight. Therefore, the ratio of Mg to N by weight is in the range from 30:1 to 3:10. In some embodiments, the molar ratio of magnesium to nitrogen in the bulk component body is in the range of 2:1 to 4:1. In these embodiments, the remaining powders that form magnesium aluminum oxynitride when sintered together comprise Al and O. In some embodiments, a powdered magnesium aluminum oxynitride (MgAlON) in the spinel phase is used as one of the powders that form magnesium aluminum oxynitride when sintered together. In other embodiments, the powders that form magnesium aluminum oxynitride when sintered together comprise a powder of MgAl2O4 mixed with enough aluminum nitride (AlN) to provide the above percentage of nitrogen with respect to magnesium. Aluminum oxide (Al2O3) powder is added so that both the Mg and N are within the above percentage ranges. In some embodiments, the powders that form magnesium aluminum oxynitride when sintered together are mixed with the sintering aids and an organic binder is used to form granules where the granules include a uniform mixture of the sintering powder. In some embodiments, at least two-thirds of the bulk component body by volume must have at least 10% Mg by mole fraction.
In some embodiments, the magnesium aluminum oxynitride of the component would have a phase, such as [(AlN)X·(Al2O3)1-X]Y·[Al2O3·MgO]1-Y with 0.30≤X≤0.37 and with 0.1≤Y≤0.9. In these embodiments, the molar ratio of N to Mg would be (X*Y):(1-Y). The molar ratio of AlON:AlMg-spinel would be Y:(1-Y).
In various embodiments, when formulating a powder mixture to form a ceramic with this fluorine resistance, proportions of raw materials are chosen such that the phases formed are largely resistant to fluorine. For example,
Because periclase MgO displays adequate fluorine resistance, ceramics with a mixture of spinel and periclase have benefits comparable to phase-pure spinel. Whether or not periclase functions as a sintering aid, additional raw materials can then be added to the powder mixture, especially if they are chosen so as to not cause unwanted reactions. For example, if a small mole fraction of yttria (Y2O3) were added as a sintering aid, this would react with Al2O3, and either enough additional Al2O3 should be included in the formulation to compensate, or a region of the phase diagram should be chosen such that the desired region extends significantly in the direction facing away from the Al2O3 vertex of the pseudo-ternary diagram.
While this disclosure has been described in terms of several preferred embodiments, there are alterations, modifications, permutations, and various substitute equivalents, which fall within the scope of this disclosure. It should also be noted that there are many alternative ways of implementing the methods and apparatuses of the present disclosure. It is therefore intended that the following appended claims be interpreted as including all such alterations, modifications, permutations, and various substitute equivalents as fall within the true spirit and scope of the present disclosure.
This application claims the benefit of priority of U.S. Application No. 63/107,722, filed Oct. 30, 2020, which is incorporated herein by reference for all purposes.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2021/056873 | 10/27/2021 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 63107722 | Oct 2020 | US |
