Claims
- 1. A process of manufacturing a matrix printed board, comprising the steps of:
- forming a first conductive layer on a substrate by screen printing:
- forming a first insulating layer on said first conductive layer, said first insulating layer having a hole through which an electrical contact portion of said first conductive layer is exposed;
- forming a second insulating layer on said first insulating layer, said second insulating layer having a hole corresponding to the hole in said first insulating layer through which an electrical contact portion of said first conductive layer is exposed, wherein an angle of inclination, with respect to an upper surface of the substrate, of the hole formed by said first insulating layer is greater than an angle of inclination of the hole formed by said second insulating layer; and
- forming a second conductive layer on said second insulating layer.
- 2. A process of claim 1, wherein said second conductive layer is formed by photolithography.
- 3. A process according to claim 1, wherein said first and second insulating layers are formed by a printing step.
- 4. A process according to claim 3, wherein the printing step is screen printing.
- 5. A process according to claim 1, wherein the hole formed in the first insulating layer is sized larger than the hole formed in the second insulating layer.
- 6. A process according to claim 1, wherein the insulating layers are made of a resin selected from an epoxy resin or polyimide resin.
- 7. A process according to claim 3, wherein the second conductive layer is patterned by a printing step.
Priority Claims (4)
Number |
Date |
Country |
Kind |
61-11983 |
Jan 1986 |
JPX |
|
61-11984 |
Jan 1986 |
JPX |
|
61-11985 |
Jan 1986 |
JPX |
|
61-11986 |
Jan 1986 |
JPX |
|
Parent Case Info
This application is a continuation of U.S. patent application Ser. No. 07/782,764, filed Oct. 22, 1991, which is a continuation of U.S. patent application Ser. No. 07/562,444, filed Aug. 2, 1990, which is a continuation of U.S. patent application Ser. No. 07/308,941, filed Feb. 8, 1989, which is a continuation of U.S. patent application Ser. No. 07/168,550, filed Mar. 9, 1988, which is a continuation of U.S. patent application Ser. No. 07/005,828, filed Jan. 22, 1987, now all abandoned.
US Referenced Citations (7)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0164921 |
Oct 1985 |
EPX |
Continuations (5)
|
Number |
Date |
Country |
Parent |
782764 |
Oct 1991 |
|
Parent |
562444 |
Aug 1990 |
|
Parent |
308941 |
Feb 1989 |
|
Parent |
168550 |
Mar 1988 |
|
Parent |
5828 |
Jan 1987 |
|