Claims
- 1. A metal-clad laminate comprising a substrate, an interacted coupling agent layer extending over and bonded to a major surface of said substrate, a layer of ultra-thin copper adjacent said layer of interacted coupling agent and a composite bonding layer interconnecting said copper layer and said interacted coupling agent layer, said composite bonding layer being substantially free of copper oxide and comprising regions of copper alloyed with a second metal and oxide of said second metal.
- 2. The metal-clad laminate of claim 1 wherein the substrate is a sheet of resin reinforced with glass fibers.
- 3. The metal-clad laminate of claim 1 wherein the second metal is selected from the group consisting of zinc and tin.
- 4. The metal-clad laminate of claim 1 wherein the coupling agent layer contains a plurality of coupling agent materials.
- 5. The metal-clad laminate of claim 1 wherein a carrier sheet is adhered to the surface of the layer of ultra-thin copper.
- 6. The metal-clad laminate of claim 1 wherein oxide of an additional non-copper metal is also present in the composite bonding layer.
- 7. The metal-clad laminate of claim 6 wherein the additional non-copper metal is selected from the group consisting of tin, zinc, manganese, magnesium, nickel, aluminum and calcium.
- 8. The metal-clad laminate of claim 1 wherein the coupling agent is organosilane-based.
- 9. The metal-clad laminate of claim 8 wherein the second metal is tin and the coupling agent is .gamma.-aminopropyltriethoxysilane-based.
- 10. The metal-clad laminate of claim 8 wherein the second metal is zinc and the coupling agent is N-.beta.-(N-vinylbenzyl-amino)ethyl-.gamma.-aminopropyltrimethoxysilane.monohydrogen chloride-based.
- 11. The method of making a copper-clad laminate comprising the steps of:
- (a) maintaining a carrier sheet with the temperature of a major surface thereof in a preselected temperature range while forming a copper film on said major surface by vapor depositing copper directly thereon,
- (b) depositing a layer of an oxide material over said copper film under conditions of temperature and pressure substantially precluding the formation of copper oxide, said oxide material comprising an oxide of a non-copper metal,
- (c) coating said oxide material layer with a solution containing coupling agent,
- (d) drying said coupling agent and
- (e) laminating the resulting assembly to a major surface of a substrate at elevated temperature and pressure, said substrate major surface having binding sites available for said coupling agent.
- 12. The method of claim 11 including the additional step of heating the resulting laminate to a temperature in the range of from about 125.degree. C. to about 300.degree. C. for a time ranging from about 20 seconds to about several minutes.
- 13. The method of claim 11 including the additional step of aging the resulting laminate for a period of at least 4 days.
- 14. The method of claim 11 including the additional step of stripping the carrier sheet from the resulting laminate.
- 15. The product resulting from the practice of the method of claim 11.
Parent Case Info
This application is a continuation-in-part of U.S. patent application Ser. No. 406,588--Green, et al, filed Aug. 9, 1982 (now abandoned) and assigned to the assignee of this application.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3984598 |
Sarazin et al. |
Oct 1976 |
|
4364731 |
Norling et al. |
Dec 1982 |
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4383003 |
Lifshin et al. |
May 1983 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
406588 |
Aug 1982 |
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