Claims
- 1. A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
(a) preparing a MEMS wafer having a plurality of MEMS structure sites thereon; (b) mounting, upon the MEMS wafer, punched tape, the punched tape having holes in areas corresponding to locations of the MEMS structure sites on the MEMS wafer; (c) mounting, upon the punched tape, a cover tape to produce a laminated MEMS wafer, the cover tape being without openings; and (d) dicing the laminated MEMS wafer into a plurality of MEMS dies.
- 2. The method as claimed in claim 1, wherein the laminated MEMS wafer is diced using a saw.
- 3. The method as claimed in claim 1, wherein the laminated MEMS wafer is diced using a laser.
- 4. The method as claimed in claim 1, wherein the laminated MEMS wafer is diced using scribing and breaking.
- 5. The method as claimed in claim 1, wherein the cover tape includes an adhesive medium.
- 6. The method as claimed in claim 5, wherein the adhesive medium is an ultraviolet light releasable medium.
- 7. The method as claimed in claim 5, wherein the adhesive medium is a heat releasable medium.
- 8. The method as claimed in claim 5, wherein the adhesive medium is a combination of an ultraviolet light and heat releasable medium.
- 9. The method as claimed in claim 5, wherein the adhesive medium comprises a thermoplastic organic material.
- 10. The method as claimed in claim 5, wherein the adhesive medium comprises an ultraviolet light sensitive organic material.
- 11. The method as claimed in claim 1, further comprising the step of:
(e) applying a contiguous tape on a backside of the MEMS wafer, the backside of the MEMS wafer being a side opposite of a side having the MEMS structure sites located thereon.
- 12. The method as claimed in claim 11, wherein the contiguous tape is applied to a backside of the MEMS wafer after the cover tape is mounted on the MEMS wafer.
- 13. The method as claimed in claim 11, wherein the contiguous tape is applied to a backside of the MEMS wafer before the cover tape is mounted on the MEMS wafer.
- 14. The method as claimed in claim 1, wherein the laminated MEMS wafer is diced with a wafer saw with a cover tape side of the laminated MEMS wafer facing towards a cutting device of the wafer saw such that the wafer cap is sawn before the MEMS wafer.
- 15. The method as claimed in claim 1, further comprising the step of:
(e) removing individual dies from the diced laminated MEMS wafer before the wafer cap is removed from the laminated MEMS wafer.
- 16. The method as claimed in claim 1, further comprising the step of:
(e) mounting dies from the diced laminated MEMS wafer into a package before the wafer cap is removed from the laminated MEMS wafer.
- 17. The method as claimed in claim 1, further comprising the step of:
(e) mounting dies from the diced laminated MEMS wafer into a package after the wafer cap is removed from the laminated MEMS wafer.
- 18. The method as claimed in claim 1, wherein the cover tape comprises a static dissipative material.
- 19. The method as claimed in claim 1, wherein the punched tape comprises a static dissipative material.
- 20. The method as claimed in claim 11, wherein the contiguous tape comprises a static dissipative material.
PRIORITY INFORMATION
[0001] This application claims priority from both U.S. Provisional Patent Application, Serial No. 60/251,287, filed on Dec. 5, 2000 and U.S. Provisional Patent Application, Serial No. 60/251,288, filed on Dec. 5, 2000.
Provisional Applications (2)
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Number |
Date |
Country |
|
60251287 |
Dec 2000 |
US |
|
60251288 |
Dec 2000 |
US |