Multistep processes involving only mechanical separation

Industry

CPC
B81C1/00888

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00888Multistep processes involving only mechanical separation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method with stealth dicing process for fabricating MEMS semiconduct...
- Patent number 11,939,216
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing physical quantity detection sensor, and phy...
- Patent number 11,535,513
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Yasuo Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of a microfluidic chip package or assembly with separab...
- Patent number 11,198,119
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Emmanuel Delamarche
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,174,156
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 10,626,010
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing thin MEMS chips on SOI substrate and micromech...
- Patent number 10,584,029
- Issue date Mar 10, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a semiconductor module
- Patent number 10,435,292
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dry scribing methods, devices and systems
- Patent number 10,322,931
- Issue date Jun 18, 2019
- STMicroelectronics S.r.l.
- Matteo Perletti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 10,189,707
- Issue date Jan 29, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of strain gauge fabrication using a transfer substrate
- Patent number 10,183,862
- Issue date Jan 22, 2019
- GM Global Technology Operations LLC
- Stephen A. Berggren
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of a microfluidic chip package or assembly with separab...
- Patent number 10,112,193
- Issue date Oct 30, 2018
- International Business Machines Corporation
- Emmanuel Delamarche
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anodic oxide film structure cutting method and unit anodic oxide fi...
- Patent number 9,764,949
- Issue date Sep 19, 2017
- Point Engineering Co., Ltd.
- Bum Mo Ahn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 9,676,618
- Issue date Jun 13, 2017
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for controlling wafer-breaker devices
- Patent number 9,576,826
- Issue date Feb 21, 2017
- Skyworks Solutions, Inc.
- Cesar D. Lara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing electrochemical sensor modules
- Patent number 9,504,162
- Issue date Nov 22, 2016
- Pepex Biomedical, Inc.
- James L. Say
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for shielding MEMS structures during front side wafer dicing
- Patent number 9,458,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and a method for manufacturing the same
- Patent number 9,399,574
- Issue date Jul 26, 2016
- Knowles Electronics LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micro-machined ultrasonic transducer and method of singu...
- Patent number 9,206,038
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Byung-gil Jeong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor stacked package and method of fabricating the same
- Patent number 8,836,134
- Issue date Sep 16, 2014
- Xintec Inc.
- Po-Shen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing separated micromechanical components situa...
- Patent number 8,466,042
- Issue date Jun 18, 2013
- Robert Bosch GmbH
- Franz Laermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cap for MEMS package
- Patent number 8,238,107
- Issue date Aug 7, 2012
- Lingsen Precision Industries, Ltd.
- Jen-Chuan Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,227,909
- Issue date Jul 24, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded wafer assembly system and method
- Patent number 7,943,489
- Issue date May 17, 2011
- Texas Instruments Incorporated
- Daryl Ross Koehl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dicing method using volatile protective agent
- Patent number 7,790,578
- Issue date Sep 7, 2010
- Fujitsu Limited
- Toshikazu Furui
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for positioning dicing line of wafer
- Patent number 7,763,525
- Issue date Jul 27, 2010
- Denso Corporation
- Keisuke Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer packaging and singulation method
- Patent number 7,682,934
- Issue date Mar 23, 2010
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of cutting laminate with laser and laminate
- Patent number 7,491,288
- Issue date Feb 17, 2009
- Fujitsu Limited
- Toshikazu Furui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing method
- Patent number 7,459,378
- Issue date Dec 2, 2008
- Disco Corporation
- Satoshi Genda
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MIRROR DEVICE
- Publication number 20240002219
- Publication date Jan 4, 2024
- Hamamatsu Photonics K.K.
- Tomoyuki IDE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20230174371
- Publication date Jun 8, 2023
- Huawei Technologies Co., Ltd
- Qin SHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...
- Publication number 20210309513
- Publication date Oct 7, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20200223689
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING PHYSICAL QUANTITY DETECTION SENSOR, AND PHY...
- Publication number 20200079647
- Publication date Mar 12, 2020
- Mitsubishi Electric Corporation
- Yasuo YAMAGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20200039820
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...
- Publication number 20190039885
- Publication date Feb 7, 2019
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARAB...
- Publication number 20180361380
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Emmanuel Delamarche
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BIOSENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180354781
- Publication date Dec 13, 2018
- SILICON OPTRONICS, INC.
- Chi-Hsing HSU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
INTEGRATED DEVICE DIES AND METHODS FOR SINGULATING THE SAME
- Publication number 20180012803
- Publication date Jan 11, 2018
- Analog Devices, Inc.
- Craig Ventola
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20170225950
- Publication date Aug 10, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARAB...
- Publication number 20160367984
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Emmanuel Delamarche
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20160244322
- Publication date Aug 25, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package And A Method For Manufacturing The Same
- Publication number 20150166335
- Publication date Jun 18, 2015
- Knowles Electronic LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER AND METHOD OF SINGU...
- Publication number 20150054095
- Publication date Feb 26, 2015
- Samsung Electronics Co., Ltd.
- Byung-gil JEONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN AB...
- Publication number 20130214370
- Publication date Aug 22, 2013
- S3C, Inc.
- Javed Hussain
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130187263
- Publication date Jul 25, 2013
- Xintec Inc.
- Po-Shen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
- Publication number 20130130424
- Publication date May 23, 2013
- S3C, Inc.
- Roger Horton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO DEVICE PACKAGING
- Publication number 20120012963
- Publication date Jan 19, 2012
- Zhuqing Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING METHOD
- Publication number 20110230000
- Publication date Sep 22, 2011
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAP FOR MEMS PACKAGE
- Publication number 20110174532
- Publication date Jul 21, 2011
- LINGSEN PRECISION INDUSTRIES LTD.
- Jen-Chuan YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEPARATED MICROMECHANICAL COMPONENTS SITUA...
- Publication number 20110163398
- Publication date Jul 7, 2011
- Franz Laermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156242
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded Wafer Assembly System and Method
- Publication number 20100075482
- Publication date Mar 25, 2010
- Daryl Ross Koehl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Fabrication Method
- Publication number 20090081828
- Publication date Mar 26, 2009
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Carl B. Freidhoff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor-type semiconductor device and manufacturing method thereof
- Publication number 20080237767
- Publication date Oct 2, 2008
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE MANUFACTURING METHOD AND DICING METHOD
- Publication number 20080132037
- Publication date Jun 5, 2008
- Fujitsu Limited
- Toshikazu FURUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF WAFER SEGMENTING
- Publication number 20080026491
- Publication date Jan 31, 2008
- Shun-Ta Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Multistep processes involving only mechanical separation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method with stealth dicing process for fabricating MEMS semiconduct...

Bonding process for forming semiconductor device structure

Method of manufacturing physical quantity detection sensor, and phy...

Fabrication of a microfluidic chip package or assembly with separab...

Bonding process for forming semiconductor device structure

Semiconductor module

Bonding process for forming semiconductor device structure

Method for producing thin MEMS chips on SOI substrate and micromech...

Method for producing a semiconductor module

Dry scribing methods, devices and systems

Embedded structures for high glass strength and robust packaging

Method of strain gauge fabrication using a transfer substrate

Fabrication of a microfluidic chip package or assembly with separab...

Anodic oxide film structure cutting method and unit anodic oxide fi...

Embedded structures for high glass strength and robust packaging

Systems and methods for controlling wafer-breaker devices

Manufacturing electrochemical sensor modules

Method for shielding MEMS structures during front side wafer dicing

MEMS package and a method for manufacturing the same

Capacitive micro-machined ultrasonic transducer and method of singu...

Semiconductor stacked package and method of fabricating the same

Method for manufacturing separated micromechanical components situa...

Cap for MEMS package

Semiconductor package and method of manufacturing the same

Bonded wafer assembly system and method

Dicing method using volatile protective agent

Method for positioning dicing line of wafer

Wafer packaging and singulation method

Method of cutting laminate with laser and laminate

Wafer dividing method

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MIRROR DEVICE

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

MEMS DEVICE

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

METHOD OF MANUFACTURING PHYSICAL QUANTITY DETECTION SENSOR, AND PHY...

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...

FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARAB...

BIOSENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED DEVICE DIES AND METHODS FOR SINGULATING THE SAME

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

FABRICATION OF A MICROFLUIDIC CHIP PACKAGE OR ASSEMBLY WITH SEPARAB...

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

MEMS Package And A Method For Manufacturing The Same

CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER AND METHOD OF SINGU...

SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN AB...

SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME

PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER

MICRO DEVICE PACKAGING

MEMS DEVICE MANUFACTURING METHOD

CAP FOR MEMS PACKAGE

METHOD FOR MANUFACTURING SEPARATED MICROMECHANICAL COMPONENTS SITUA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Bonded Wafer Assembly System and Method

MEMS Fabrication Method

Sensor-type semiconductor device and manufacturing method thereof

DEVICE MANUFACTURING METHOD AND DICING METHOD

METHOD OF WAFER SEGMENTING