Claims
- 1. A method of manufacturing a matrix switch board having a front surface and a back surface, said board being used for selectively connecting and disconnecting a specified line via a removable pin, said method comprising the steps of:(a) forming through holes at predetermined positions where first and second wiring patterns will be formed on a board on which conductive layers are formed on the front and back surfaces of the board, wherein said through holes have side walls that extend from the front surface to the back surface; (b) patterning said conductive layers formed on the front and back surfaces of the board by using a resist to produce said first and second wiring patterns, respectively, on the front and back surfaces, but not on the side walls of the through holes, which wiring patterns cross each other in respective planes; (c) etching said board patterned in the step (b); and (d) plating said first and second wiring patterns, and not the side walls, to form parts of the respective wiring patterns overhanging in a substantially center axis direction of the through hole.
- 2. The method as claimed in claim 1, wherein said step (b) comprises a step of patterning said first and second wiring patterns so that a part of the wiring patterns where no through hole is formed is thinner than a part of the wiring patterns where said through holes are formed.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-286219 |
Nov 1995 |
JP |
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Parent Case Info
This application is a Divisional of application Ser. No. 08/671,618, filed Jun. 28, 1996, now U.S. Pat. No. 5,886,309.
US Referenced Citations (9)
Foreign Referenced Citations (4)
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35 23 804 |
Jan 1987 |
DE |
195 24 019 |
Oct 1996 |
DE |
623250 |
Nov 1994 |
EP |
62-21255 |
Jan 1987 |
JP |