BRIEF DESCRIPTION OF DRAWINGS
The invention can be more fully understood by reading the following detailed description of the preferred embodiments, with reference made to the accompanying drawings, wherein:
FIGS. 1A to 1F are six cross-sectional views demonstrating a nickel/gold fabrication process disclosed in U.S. Pat. No. 6,576,540; and
FIGS. 2A to 2J are ten cross-sectional views demonstrating a method for fabricating a metal protecting layer on an electrically connecting pad of a circuit board according to the present invention.