Continuous temporary metal layer over metal pattern

Industry

CPC
H05K2203/0542

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0542Continuous temporary metal layer over metal pattern

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Insulation structure for high temperature conditions and manufactur...
- Patent number 9,231,167
- Issue date Jan 5, 2016
- Samsung Electronics Co., Ltd.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Same layer microelectronic circuit patterning using hybrid laser pr...
- Patent number 9,113,547
- Issue date Aug 18, 2015
- Intel Corporation
- John Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element, and multilayer...
- Patent number 8,859,420
- Issue date Oct 14, 2014
- Invensas Corporation
- Kimitaka Endo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 8,365,402
- Issue date Feb 5, 2013
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor test probe card space transf...
- Patent number 8,322,020
- Issue date Dec 4, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Cheng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection element for electric circuits
- Patent number 8,299,368
- Issue date Oct 30, 2012
- Invensas Corporation
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and circuit device
- Patent number 8,258,409
- Issue date Sep 4, 2012
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging board and manufacturing method therefor, semiconductor mo...
- Patent number 8,153,186
- Issue date Apr 10, 2012
- Sanyo Eletric Co., Ltd.
- Masayuki Nagamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board (PCB)
- Patent number 8,122,599
- Issue date Feb 28, 2012
- SAMSUNG TECHWIN CO., LTD.
- Jae-Chul Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
- Patent number 8,043,514
- Issue date Oct 25, 2011
- Shinko Electric Industries Co., Ltd.
- Hiroshi Miyagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor test probe card space transf...
- Patent number 8,033,012
- Issue date Oct 11, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Cheng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulation structure for high temperature conditions and manufactur...
- Patent number 7,998,879
- Issue date Aug 16, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method of making interconnect element, and multilayer...
- Patent number 7,923,828
- Issue date Apr 12, 2011
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and manufacturing method thereof
- Patent number 7,868,464
- Issue date Jan 11, 2011
- TDK Corporation
- Kenichi Kawabata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 7,817,441
- Issue date Oct 19, 2010
- Unimicron Technology Corp.
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for embedding electrically conductive elements i...
- Patent number 7,631,423
- Issue date Dec 15, 2009
- Sanmina-SCI Corporation
- Lim Siong San
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via hole having fine hole land and method for forming the same
- Patent number 7,629,692
- Issue date Dec 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a metal protection layer on electrically con...
- Patent number 7,627,946
- Issue date Dec 8, 2009
- Phoenix Precision Technology Corporation
- Pao Hung Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging board and manufacturing method therefor, semiconductor mo...
- Patent number 7,595,553
- Issue date Sep 29, 2009
- Sanyo Electric Co., LTD
- Masayuki Nagamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming metal bumps
- Patent number 7,550,375
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering Inc.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board having landless via hole
- Patent number 7,516,545
- Issue date Apr 14, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the substrate for packaging integrated circ...
- Patent number 7,504,282
- Issue date Mar 17, 2009
- ASE (Shanghai) Inc.
- Chi-Chao Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a film printed circuit board
- Patent number 7,473,459
- Issue date Jan 6, 2009
- Himax Technologies Limited
- Chia-Hui Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor package substrate
- Patent number 7,399,399
- Issue date Jul 15, 2008
- Phoenix Precision Technology Corporation
- E-Tung Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate having bonding pads with plated lay...
- Patent number 7,396,753
- Issue date Jul 8, 2008
- Phoenix Precision Technology Corporation
- Chih-Liang Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed wiring board with conformally plated cir...
- Patent number 7,378,227
- Issue date May 27, 2008
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor element containing circuit board and power amplifier module
- Patent number 7,368,998
- Issue date May 6, 2008
- TDK Corporation
- Toshiyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer printed wiring board
- Patent number 7,363,706
- Issue date Apr 29, 2008
- CMK Corporation
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board by utilizing electro plating
- Patent number 7,347,949
- Issue date Mar 25, 2008
- Shinko Electric Industries, Co., Ltd.
- Hiroshi Miyagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor device substrate
- Patent number 7,317,245
- Issue date Jan 8, 2008
- Amkor Technology, Inc.
- Kyu Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
- Publication number 20130119012
- Publication date May 16, 2013
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20120199389
- Publication date Aug 9, 2012
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING CIRCUIT BOARD
- Publication number 20120124830
- Publication date May 24, 2012
- Unimicron Technology Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR TEST PROBE CARD SPACE TRANSF...
- Publication number 20120017428
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming Cheng Hsu
- G01 - MEASURING TESTING
Information Patent Application
INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTUR...
- Publication number 20110260198
- Publication date Oct 27, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER...
- Publication number 20110252637
- Publication date Oct 20, 2011
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAME LAYER MICROELECTRONIC CIRCUIT PATTERNING USING HYBRID LASER PR...
- Publication number 20100101084
- Publication date Apr 29, 2010
- John Guzek
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100101851
- Publication date Apr 29, 2010
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20100078213
- Publication date Apr 1, 2010
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounting Board and Method for Manufacturing Su...
- Publication number 20100002455
- Publication date Jan 7, 2010
- Yoichi Matsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging Board and Manufacturing Method Therefor, Semiconductor Mo...
- Publication number 20090304910
- Publication date Dec 10, 2009
- Sanyo Electric Co., Ltd.
- Masayuki Nagamatsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...
- Publication number 20090288861
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Guo Cheng LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEST PROBE CARD SPACE TRANSFORMER
- Publication number 20090223043
- Publication date Sep 10, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming Cheng Hsu
- G01 - MEASURING TESTING
Information Patent Application
Interconnection element for electric circuits
- Publication number 20090188706
- Publication date Jul 30, 2009
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME
- Publication number 20090144972
- Publication date Jun 11, 2009
- Unimicron Technology Corp.
- David C. H. Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board and printed circuit b...
- Publication number 20090107699
- Publication date Apr 30, 2009
- Samsung Techwin Co., Ltd.
- Jae-Chul Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD
- Publication number 20090101513
- Publication date Apr 23, 2009
- Chia-Hui WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20090032294
- Publication date Feb 5, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20080283277
- Publication date Nov 20, 2008
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR IMPLEMENTING EMI SHIELDING FOR RIGID CARDS AND FLEXI...
- Publication number 20080236883
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Roger Allen Booth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEV...
- Publication number 20080236879
- Publication date Oct 2, 2008
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming via hole having fine hole land
- Publication number 20080209722
- Publication date Sep 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MO...
- Publication number 20080136033
- Publication date Jun 12, 2008
- Sanyo Electric Co., Ltd.
- Masayuki Nagamatsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing a wiring board by utilizing electro plating
- Publication number 20080116079
- Publication date May 22, 2008
- Shinko Electric Industries Co., Ltd.
- Hiroshi Miyagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20080115355
- Publication date May 22, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hyun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Structures for Implementing EMI Shielding for Rigid Card...
- Publication number 20080029298
- Publication date Feb 7, 2008
- Roger Allen Booth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing the Substrate for Packaging Integrated Circ...
- Publication number 20070264750
- Publication date Nov 15, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Chi-Chao Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A METAL PROTECTION LAYER ON ELECTRICALLY CON...
- Publication number 20070218591
- Publication date Sep 20, 2007
- Phoenix Precision Technology Corporation
- Pao-Hung CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming metal bumps
- Publication number 20070218676
- Publication date Sep 20, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulation structure for high temperature conditions and manufactur...
- Publication number 20070215894
- Publication date Sep 20, 2007
- Samsung Electro-Mechanics CO., LTD.
- Young Ki Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Continuous temporary metal layer over metal pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Insulation structure for high temperature conditions and manufactur...

Same layer microelectronic circuit patterning using hybrid laser pr...

Structure and method of making interconnect element, and multilayer...

Method for manufacturing printed wiring board

Method for fabricating a semiconductor test probe card space transf...

Interconnection element for electric circuits

Circuit board and circuit device

Packaging board and manufacturing method therefor, semiconductor mo...

Method of manufacturing a printed circuit board (PCB)

Method of manufacturing a wiring board by utilizing electro plating

Method for fabricating a semiconductor test probe card space transf...

Insulation structure for high temperature conditions and manufactur...

Structure and method of making interconnect element, and multilayer...

Multilayer substrate and manufacturing method thereof

Circuit board

Method and process for embedding electrically conductive elements i...

Via hole having fine hole land and method for forming the same

Method for fabricating a metal protection layer on electrically con...

Packaging board and manufacturing method therefor, semiconductor mo...

Method for forming metal bumps

Method of manufacturing printed circuit board having landless via hole

Method of manufacturing the substrate for packaging integrated circ...

Method of manufacturing a film printed circuit board

Method for manufacturing semiconductor package substrate

Semiconductor package substrate having bonding pads with plated lay...

Method of making a printed wiring board with conformally plated cir...

Inductor element containing circuit board and power amplifier module

Method of manufacturing a multilayer printed wiring board

Method of manufacturing a wiring board by utilizing electro plating

Method for manufacturing a semiconductor device substrate

Patents Applicationslast 30 patents

INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

PROCESS FOR FABRICATING CIRCUIT BOARD

METHOD FOR FABRICATING A SEMICONDUCTOR TEST PROBE CARD SPACE TRANSF...

INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTUR...

STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER...

SAME LAYER MICROELECTRONIC CIRCUIT PATTERNING USING HYBRID LASER PR...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

Electronic Component Mounting Board and Method for Manufacturing Su...

Packaging Board and Manufacturing Method Therefor, Semiconductor Mo...

CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHO...

TEST PROBE CARD SPACE TRANSFORMER

Interconnection element for electric circuits

CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME

Method of manufacturing printed circuit board and printed circuit b...

METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD

CIRCUIT BOARD

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

STRUCTURES FOR IMPLEMENTING EMI SHIELDING FOR RIGID CARDS AND FLEXI...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEV...

Method for forming via hole having fine hole land

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MO...

Method of manufacturing a wiring board by utilizing electro plating

Method of manufacturing printed circuit board

Method and Structures for Implementing EMI Shielding for Rigid Card...

Method of Manufacturing the Substrate for Packaging Integrated Circ...

METHOD FOR FABRICATING A METAL PROTECTION LAYER ON ELECTRICALLY CON...

Method for forming metal bumps

Insulation structure for high temperature conditions and manufactur...