The invention describes a method for producing a foil which serves as a carrier for electronic devices and a method for producing a portable data carrier having the foil described above.
The production of portable data carriers is known from the prior art. The portable data carriers consist e.g. of several foil layers, which are permanently connected to each other by a lamination method by means of pressure and heat. Electronic devices, such as e.g. an antenna, are applied, for example, on a foil layer before it is laminated with the other foil layers. Chips are integrated, for example, in a module form into a data carrier, by the module being inserted into a recess of the data carrier and, if necessary, connected with an antenna. A contact-type interface, e.g. according to ISO 7816, is usually located on an outer side of the module.
Further, flexible circuit boards into which electronic devices are integrated are known from the prior art. The flexible circuit boards are constructed from different layers, each layer having different electronic devices disposed therein. There are electroconductive connections between the layers for connecting the devices of the different layers into a suitable circuit.
The disadvantage in the prior art is that the integration of electronic devices, such as e.g. chips, displays, sensors, etc. is very complex, because due to their different overall height the devices must be inserted into gaps and the respective gaps penetrate a different number of foil layers. If a module is to be integrated into the data carrier, a respective recess must be produced in the data carrier. In particular the production of recesses is comparatively expensive and time-consuming.
Starting out from the prior art, it is the object of the invention to find a solution which avoids the above disadvantages.
For achieving the object, the invention discloses a method for producing a foil which serves as a carrier of at least one electronic device and at least one interface, which method is characterized in that
a transparent or opaque foil is used as a foil
and electrical conducting paths on the foil are printed by means of a transparent, electrically conductive material in order to electroconductively connect the electronic device with the interface. As the foil is separately produced as a carrier of at least one electronic device, as a so-called functional overlay, it can be easily integrated into a data carrier or applied onto it, without one having to take care of recesses for electronic devices. Additionally, costs are reduced, because expensive carrier bands for e.g. a chip module are no longer necessary.
An advantageous embodiment example is that at least one electronic device is disposed on the surface of the foil and/or in a depression of the foil. The depression is produced e.g. by means of a laser or by means of an embossing method or another suitable method.
Another advantageous embodiment example is that a contact-type and/or a contactless interface is disposed on the foil.
Another advantageous embodiment example is that the contactless and/or the contact-type interface is printed onto the foil by means of the transparent, electrically conductive material.
Another advantageous embodiment example is that the contact-type interface and the contactless interface are disposed on opposing sides of the foil.
Another advantageous embodiment example is that an interface geometry according to ISO 7816 is used as a contact-type interface.
Another advantageous embodiment example is that an antenna coil is used as a contactless interface.
Another advantageous embodiment example is that indium tin oxide, abbreviated with ITO, or graphene or another suitable material is used as a transparent, electrically conductive material.
Another advantageous embodiment example is that a cover is applied onto the foil side opposing the electronic component, so that the electronic component is not recognizable through the transparent foil.
Another advantageous embodiment example is that a hologram is applied onto the foil as a cover.
Another advantageous embodiment example is that the cover is printed onto the foil.
Another advantageous embodiment example is that the electronic device is printed.
Another advantageous embodiment example is that a chip and/or an electronic display unit and or a sensor and/or a keyboard and/or a resistor and/or a capacitor and/or an inductance is used as an electronic device.
Another advantageous embodiment example is that a foil is used which consists of one or of several layers.
Another advantageous embodiment example is that the foil is produced by means of a roll-to-roll method or by means of a roll-to-sheet method or a sheet-to-sheet method.
Another advantageous embodiment example is that the foil is produced in a sheet format or in a roll format.
For achieving the object, the invention further discloses a foil which was produced according to the above-described method.
In addition, for achieving the object, the invention discloses a method for producing a portable data carrier, which is characterized in that a transparent foil according to the above discussion is disposed onto at least one outer side of the data carrier.
Another advantageous embodiment example is that the transparent foil is disposed onto an inlay.
Another advantageous embodiment example is that the transparent foil and the inlay are permanently connected by means of adhesive or lamination.
Another advantageous embodiment example is that the inlay consists of at least one foil.
Another advantageous embodiment example is that the inlay is opaque.
Another advantageous embodiment example is that the transparent foil is disposed onto an opaque or transparent inlay.
Another advantageous embodiment example is that a motif, e.g. sign, letters, numbers, symbols, pictures, letterings, photos, etc., is printed onto the inlay, which motif can be recognized through the transparent foil from outside. The turns of the antenna coil cannot be recognized here, because they are produced from transparent material.
For achieving the object, the invention finally discloses a data carrier which was manufactured according to the method described above.
In the following, an embodiment example of the invention is described with reference to the attached Figures.
Number | Date | Country | Kind |
---|---|---|---|
10 2014 007 474 | May 2014 | DE | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2015/000835 | 4/21/2015 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2015/176792 | 11/26/2015 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
9146017 | Van Der Wel | Sep 2015 | B2 |
20070296592 | Huang | Dec 2007 | A1 |
20100025475 | Webb | Feb 2010 | A1 |
20150041546 | Herslow | Feb 2015 | A1 |
Number | Date | Country |
---|---|---|
2735297 | Mar 2010 | CA |
19500925 | Apr 1999 | DE |
19942932 | Jan 2002 | DE |
60024478 | Aug 2006 | DE |
102008044809 | Mar 2010 | DE |
102010053679 | Jun 2012 | DE |
2001018745 | Mar 2001 | WO |
2011059151 | May 2011 | WO |
2011069675 | Jun 2011 | WO |
2013158090 | Oct 2013 | WO |
WO-2013158090 | Oct 2013 | WO |
Entry |
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German Search Report for corresponding German Application No. DE102014007474.9, dated Apr. 29, 2015. |
International Search Report for corresponding International PCT Application PCT/EP2015/000835, dated Jul. 8, 2015. |
Number | Date | Country | |
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20170076192 A1 | Mar 2017 | US |