Lamination

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CPC
H05K2203/06

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/06Lamination

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for laminating conductive-lubricant coated metals for print...
- Patent number 11,963,309
- Issue date Apr 16, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,889,624
- Issue date Jan 30, 2024
- Sumitomo Electric Printed Circuits, Inc.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying PCB core-layer properties
- Patent number 11,644,501
- Issue date May 9, 2023
- International Business Machines Corporation
- Tao Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 11,641,719
- Issue date May 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Hegen Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and control device for laminating display panel as well as v...
- Patent number 11,604,372
- Issue date Mar 14, 2023
- HKC CORPORATION LIMITED
- Xin Chen
- G02 - OPTICS
Information Patent Grant
Wiring body and method for manufacturing same
- Patent number 11,564,313
- Issue date Jan 24, 2023
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
- Publication number 20240301176
- Publication date Sep 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Kenzo ONIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240298412
- Publication date Sep 5, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276652
- Publication date Aug 15, 2024
- LEOTEK CORPORATION
- Cheng-Ta TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...
- Publication number 20240224433
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS
- Publication number 20240224434
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240196546
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOR WIRING BOARD
- Publication number 20240179849
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS
- Publication number 20230422410
- Publication date Dec 28, 2023
- All Flex Solutions, Inc.
- Jason David Hoium
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...
- Publication number 20230383030
- Publication date Nov 30, 2023
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20230371188
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...
- Publication number 20230292431
- Publication date Sep 14, 2023
- TTM TECHNOLOGIES, INC.
- Niels Husted Kirkeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230232540
- Publication date Jul 20, 2023
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing printed circuit board

Bonded body and insulating circuit board

Resin multilayer substrate and method for manufacturing resin multi...

Composite circuit board and method of manufacturing the same

Bent laminated printed circuit board

Method of forming a top plane connection in an electro-optic device

Methods of forming flexible interconnect circuits

Flexible laminated board and multilayer circuit board

Wiring board

Process for laminating conductive-lubricant coated metals for print...

Laminate

Via bond attachment

Method of manufacturing circuits using thick metals and machined bu...

Method for manufacturing printed wiring board

Method for fabricating asymmetric board

Method of manufacturing bonded body for insulation circuit substrat...

Structure for embedding and packaging multiple devices by layer and...

Flexible printed circuit board and method of manufacturing flexible...

Catalyzed metal foil and uses thereof

Circuit board and method of manufacturing circuit board

Component carrier with an embedded thermally conductive block and m...

Method of manufacturing multilayer substrate

Circuit board structure and method for manufacturing a circuit boar...

Method for manufacturing an electronic module and electronic module

Manufacturing method of mounting structure, and sheet therefor

Resin substrate and method for manufacturing resin substrate

Method for identifying PCB core-layer properties

Manufacturing method of printed circuit board

Method and control device for laminating display panel as well as v...

Wiring body and method for manufacturing same

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

WIRING SUBSTRATE

EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...

Circuit board

CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF

Interconnect Circuit Methods And Devices

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...

WIRING SUBSTRATE

METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

LAMINATE FOR WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

ELECTRONIC APPARATUS

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

REWORK PATCH FOR AN ELECTRONIC CIRCUIT

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS

MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD