Lamination

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CPC
H05K2203/06

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/06Lamination

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Maleimide resin composition, prepreg, resin film, laminated board,...
- Patent number 12,324,105
- Issue date Jun 3, 2025
- Resonac Corporation
- Chihiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive substrate and carrier plate wiring structure with filter...
- Patent number 12,279,377
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminator
- Patent number 12,274,009
- Issue date Apr 8, 2025
- Doosan Corporation
- Sungmoon Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making printed wiring board, printed wiring board, and a...
- Patent number 12,185,477
- Issue date Dec 31, 2024
- Ajinomoto Co., Inc.
- Habib Hichri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonded body and insulating circuit board
- Patent number 12,137,526
- Issue date Nov 5, 2024
- Mitsubishi Materials Corporation
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for laminating conductive-lubricant coated metals for print...
- Patent number 11,963,309
- Issue date Apr 16, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate
- Patent number 11,946,143
- Issue date Apr 2, 2024
- Arisawa Mfg. Co., Ltd.
- Kenji Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,889,624
- Issue date Jan 30, 2024
- Sumitomo Electric Printed Circuits, Inc.
- Yoshio Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with an embedded thermally conductive block and m...
- Patent number 11,864,306
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...
- Publication number 20250168975
- Publication date May 22, 2025
- Resonac Corporation
- Masataka NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20250113447
- Publication date Apr 3, 2025
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND JIG
- Publication number 20250063660
- Publication date Feb 20, 2025
- NIDEC ADVANCE TECHNOLOGY CORPORATION
- Shigeki SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250063671
- Publication date Feb 20, 2025
- LX Semicon Co., Ltd.
- Nam Tae CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD
- Publication number 20250056736
- Publication date Feb 13, 2025
- NEXTRONICS ENGINEERING CORP.
- HOU-AN SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040054
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY AND INSULATING CIRCUIT BOARD
- Publication number 20250024610
- Publication date Jan 16, 2025
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...
- Publication number 20240397634
- Publication date Nov 28, 2024
- FIND HOW ENTERPRISE CO. LTD.
- Kuo-Ching Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341033
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
- Publication number 20240301176
- Publication date Sep 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Kenzo ONIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board
- Publication number 20240298412
- Publication date Sep 5, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240276652
- Publication date Aug 15, 2024
- LEOTEK CORPORATION
- Cheng-Ta TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...
- Publication number 20240224433
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS
- Publication number 20240224434
- Publication date Jul 4, 2024
- Ulrich Rotte Anlagenbau und Foerdertechnik GmbH
- Ulrich ROTTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240196546
- Publication date Jun 13, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOR WIRING BOARD
- Publication number 20240179849
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Maleimide resin composition, prepreg, resin film, laminated board,...

Conductive substrate and carrier plate wiring structure with filter...

Laminator

Method of manufacturing component carrier and component carrier int...

Method for making printed wiring board, printed wiring board, and a...

Method of manufacturing printed circuit board

Bonded body and insulating circuit board

Resin multilayer substrate and method for manufacturing resin multi...

Composite circuit board and method of manufacturing the same

Bent laminated printed circuit board

Method of forming a top plane connection in an electro-optic device

Methods of forming flexible interconnect circuits

Flexible laminated board and multilayer circuit board

Wiring board

Process for laminating conductive-lubricant coated metals for print...

Laminate

Via bond attachment

Method of manufacturing circuits using thick metals and machined bu...

Method for manufacturing printed wiring board

Method for fabricating asymmetric board

Method of manufacturing bonded body for insulation circuit substrat...

Structure for embedding and packaging multiple devices by layer and...

Flexible printed circuit board and method of manufacturing flexible...

Catalyzed metal foil and uses thereof

Circuit board and method of manufacturing circuit board

Component carrier with an embedded thermally conductive block and m...

Method of manufacturing multilayer substrate

Circuit board structure and method for manufacturing a circuit boar...

Method for manufacturing an electronic module and electronic module

Manufacturing method of mounting structure, and sheet therefor

Patents Applicationslast 30 patents

CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...

Stamping Surface Profile in Design Layer and Filling an Indentation...

PRINTED CIRCUIT BOARD

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

MULTILAYER SUBSTRATE AND JIG

METHOD FOR MANUFACTURING CIRCUIT BOARD

CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD

TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

BONDED BODY AND INSULATING CIRCUIT BOARD

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

SYSTEM AND METHOD FOR FORMING BOARD MULTI-LAYERS OF MULTILAYER PRIN...

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

WIRING SUBSTRATE

EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...

Circuit board

CIRCUIT BOARD MODULE AND MANUFACTURING METHOD THEREOF

Interconnect Circuit Methods And Devices

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

DEVICE FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS AND USE THEREOF IN...

WIRING SUBSTRATE

METHOD FOR PRODUCING MULTI-LAYER CIRCUIT BOARDS

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

LAMINATE FOR WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

ELECTRONIC APPARATUS

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...