Claims
- 1. An apparatus for supercritical processing of first and second workpieces comprising:
a. a transfer module having an entrance; b. first and second supercritical processing modules coupled to the transfer module; and c. a transfer mechanism coupled to the transfer module, the transfer mechanism configured to move the first workpiece between the entrance and the first supercritical processing module, the transfer mechanism configured to move the second workpiece between the entrance and the second supercritical processing module.
- 2. The apparatus of claim 1 wherein the transfer module operates at about atmospheric pressure.
- 3. The apparatus of claim 1 wherein the transfer module further comprises means for maintaining a slight positive pressure in the transfer module relative to a surrounding environment.
- 4. The apparatus of claim 3 wherein the means for maintaining the slight positive pressure in the transfer module comprise an inert gas injection arrangement.
- 5. The apparatus of claim 2 wherein the entrance of the transfer module comprises a hand-off station.
- 6. The apparatus of claim 5 wherein the entrance of the transfer module further comprises an additional hand-off station.
- 7. The apparatus of claim 1 wherein the transfer module operates at an elevated pressure and further wherein the entrance of the transfer module comprises a loadlock.
- 8. The apparatus of claim 7 wherein the entrance of the transfer module further comprises an additional loadlock.
- 9. The apparatus of claim 1 wherein the transfer mechanism comprises a robot.
- 10. The apparatus of claim 9 wherein the transfer module comprises a circular configuration.
- 11. The apparatus of claim 10 wherein the robot comprises a central robot, the central robot occupying a center of the circular configuration.
- 12. The apparatus of claim 9 wherein the transfer module comprises a track configuration.
- 13. The apparatus of claim 12 wherein the robot comprises a tracked robot, the tracked robot comprising the robot coupled to a track such that the robot moves along the track in order to reach the first and second processing module located along the track.
- 14. The apparatus of claim 13 further comprising third and fourth supercritical processing modules, the third and fourth supercritical processing modules located along the track, the third and fourth supercritical processing modules located opposite the first and second supercritical processing modules relative to the track.
- 15. The apparatus of claim 9 wherein the robot comprises an extendable arm and an end effector.
- 16. The apparatus of claim 15 wherein the robot further comprises an additional arm and an additional end effector.
- 17. The apparatus of claim 1 wherein the first supercritical processing module comprises a first pressure vessel and further wherein the second supercritical processing module comprises a second pressure vessel.
- 18. The apparatus of claim 17 wherein:
a. the first pressure vessel comprises a first workpiece cavity and a first pressure vessel entrance, the first workpiece cavity holding the first workpiece during supercritical processing, the first pressure vessel entrance providing ingress and egress for the first workpiece; and b. the second pressure vessel comprises a second workpiece cavity and a second pressure vessel entrance, the second workpiece cavity holding the second workpiece during the supercritical processing, the second pressure vessel entrance providing ingress and egress for the first workpiece.
- 19. The apparatus of claim 18 wherein the transfer mechanism is configured to place the first and second workpieces in the first and second workpiece cavities, respectively.
- 20. The apparatus of claim 19 wherein the transfer module and the supercritical processing module are configured to operate at supercritical conditions.
- 21. The apparatus of claim 19 further comprising first and second gate valves, the first gate valve coupling the transfer module and the first supercritical processing module, the second gate valve coupling the transfer module and the second supercritical processing module.
- 22. The apparatus of claim 18 further comprising first and second antechambers, the first ante-chamber coupling the transfer module and the first supercritical processing module, the second ante-chamber coupling the transfer module and the second supercritical processing module.
- 23. The apparatus of claim 1 further comprising means for pressurizing the first and second supercritical processing modules.
- 24. The apparatus of claim 23 wherein the means for pressurizing comprises a CO2 pressurizing configuration which comprises a CO2 supply vessel coupled to a pump which is coupled to the first and second supercritical processing modules such that the CO2 pressurizing configuration pressurizes the first supercritical processing module independently of the second supercritical processing module and further such that the CO2 pressurizing configuration pressurizes the second supercritical processing module independently of the first supercritical processing module.
- 25. The apparatus of claim 18 further comprising first and second means for sealing, the first means for sealing operable to seal the first pressure vessel entrance, the second means for sealing operable to seal the second pressure vessel entrance.
- 26. The apparatus of claim 1 further comprising means for controlling such that the means for controlling directs the transfer mechanism to move the first and second workpieces between the entrance of the transfer module and the first and second supercritical processing modules, respectively, and further such that the means for controlling controls the first supercritical processing module independently of the second supercritical processing module.
- 27. A method of supercritical processing first and second workpieces comprising the steps of:
a. transferring the first workpiece from an entrance of a transfer module to a first supercritical processing module; b. transferring the second workpiece from the entrance of the transfer module to a second supercritical processing module; c. processing the first and second workpieces in the first and second supercritical processing modules, respectively; d. transferring the first workpiece from the first supercritical processing module to the entrance of the transfer module; and e. transferring the second workpiece from the second supercritical processing module to the entrance of the transfer module.
- 28. The method of claim 27 wherein the entrance of the transfer module comprises a hand-off station.
- 29. The method of claim 28 wherein the entrance of the transfer module further comprises an additional hand-off station.
- 30. An apparatus for supercritical processing first and second workpieces comprising:
a. means for transferring the first and second workpieces; b. first means for supercritical processing configured such that in operation the means for transferring transfers the first workpiece between an entrance of a transfer module to the first means for supercritical processing and further such that in operation the first means for supercritical processing processes the first workpiece; and c. second means for supercritical processing configured such that in operation the means for transferring transfers the second workpiece between the entrance of the transfer module to the second means for supercritical processing and further such that in operation the second means for supercritical processing processes the second workpiece.
- 31. An apparatus for supercritical processing comprising:
a. a transfer module having an entrance; b. an inert gas injection arrangement coupled to the transfer module such that in operation the inert gas injection arrangement maintains a slight positive pressure in the transfer module relative to a surrounding environment; c. a first ante-chamber coupled to the transfer module; d. a first supercritical processing module coupled to the first ante-chamber; e. first means for moving a first semiconductor substrate between the first ante-chamber and the first supercritical processing module; f. a second ante-chamber coupled to the transfer module; g. a second supercritical processing module coupled to the second ante-chamber; h. second means for moving a second semiconductor substrate between the second ante-chamber and the second supercritical processing module; and i. a transfer mechanism coupled to the transfer module such that in operation the transfer mechanism transfers the first and second semiconductor substrates between the first and second ante-chambers, respectively, and the entrance of the transfer module.
- 32. An apparatus for supercritical processing comprising:
a. a transfer module having an entrance; b. an inert gas injection arrangement coupled to the transfer module such that in operation the inert gas injection arrangement maintains a slight positive pressure in the transfer module relative to a surrounding environment; c. a first supercritical processing module coupled to the transfer module, the first supercritical processing module including first means for sealing the first supercritical processing module; d. a second supercritical processing module coupled to the transfer module, the second supercritical processing module including second means for sealing the second supercritical processing module; and e. a transfer mechanism coupled to the transfer module such that in operation the transfer mechanism transfers first and second semiconductor substrates between the first and second supercritical processing modules, respectively, and the entrance of the transfer module.
- 33. An apparatus for supercritical processing of first and second workpieces comprising:
a. a hand-off station; b. first and second supercritical processing modules coupled to the hand-off station; and c. a transfer mechanism coupled to the hand-off station, the transfer mechanism coupled to the first and second supercritical processing modules, the transfer mechanism configured to move the first workpiece between the hand-off station and the first supercritical processing module, the transfer mechanism configured to move the second workpiece between the hand-off station and the second supercritical processing module.
RELATED APPLICATIONS
[0001] This application claims priority from U.S. Provisional Patent Application No. 60/163,121 filed on Nov. 2, 1999, which is incorporated by reference.
Provisional Applications (1)
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Number |
Date |
Country |
|
60163121 |
Nov 1999 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
09704642 |
Nov 2000 |
US |
Child |
10327397 |
Dec 2002 |
US |