Method of fabricating micro actuator having media stage

Abstract

A method of fabricating a micro actuator is provided including a media stage having a media loading surface and a coil for driving the media stage, formed on the opposite surface of the media stage to the media loading surface. The method includes forming a groove on a first surface of a first substrate, forming a coil on a first surface of a second substrate, bonding the first surface of the first substrate to the first surface of the second substrate, and forming the media loading surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

FIG. 1 is an exploded perspective view of a micro actuator fabricated by a method according to an exemplary embodiment of the present invention;

FIG. 2A is a top view of a media stage depicted in FIG. 1;

FIG. 2B is a bottom view of a media stage depicted in FIG. 1;

FIG. 3 is a sectional view of the micro actuator depicted in FIG. 1;

FIG. 4 is a schematic view of the driving principal of the media stage depicted in FIG. 1;

FIGS. 5A through 5C are views illustrating a process for forming electrodes and grooves on a glass substrate;

FIGS. 6A through 6G are views illustrating a process for forming coils and electrodes on a silicon substrate; and

FIGS. 7A through 7E are views illustrating a process for forming a data storage medium loading surface after a silicon substrate is bonded to a glass substrate.

Claims

1. A method of fabricating a micro actuator comprising a media stage having a media loaded surface and a coil for driving the media stage, the coil being formed on the opposite surface of the media stage to the media loaded surface, the method comprising: forming a groove on a first surface of a first substrate;forming a coil on a first surface of a second substrate;bonding the first surface of the first substrate to the first surface of the second substrate; andforming the media loaded surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.

2. The method of claim 1, wherein the first substrate is a glass substrate and the second substrate is a silicon substrate.

3. The method of claim 2, wherein the bonding of the first substrate to the second substrate is performed by anodic bonding.

4. The method of claim 1, wherein the forming of the coil comprises: forming a trench on the second substrate using ICP-RIE (inductively coupled plasma reactive ion etching);forming a passivation layer on the second substrate and the trench;filling the trench with metal;removing metal exposed above the trench by polishing.

5. The method of claim 4, wherein the filling of the trench is performed by electroplating.

6. The method of claim 4, wherein the forming of the groove comprises forming a first electrode on the first substrate; and the forming of the coil comprises forming a second electrode on the second substrate.

7. The method of claim 6, wherein the bonding of the first substrate to the second substrate is performed such that the first and second electrodes contact each other to form an electrode pad for applying an electric current.

8. The method of claim 7, wherein the forming of the media loaded surface comprises etching the second surface of the second substrate to a depth within a range where the coil formed on the second substrate is not exposed.

9. The method of claim 7, wherein the second substrate is an SOI (silicon-on-insulator) substrate having an oxidation layer.

10. The method of claim 9, wherein the forming of the media loaded surface comprises etching a second surface of the second substrate, which is opposite the first surface of the second substrate, to expose the oxidation layer; and etching the oxidation layer.

11. The method of claim 8, wherein the forming of the media loaded surface comprises etching the second surface of the second substrate to expose the electrode pad.

12. The method of claim 10, wherein the forming of the media loaded surface comprises etching the second surface of the second substrate to expose the electrode pad.